K6F1016R4A-FI100 datasheet, PDF

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K6F1016R4A-FI100: DescriptionStandard SRAM, 64KX16, 100ns, CMOS, PBGA48, 6 X 7 MM, FBGA-48; Categorystorage storage; File Size160KB，9 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K6F1016R4A-FI100 Overview

Standard SRAM, 64KX16, 100ns, CMOS, PBGA48, 6 X 7 MM, FBGA-48

K6F1016R4A-FI100 Parametric

Parameter Name	Attribute value
Maker	SAMSUNG
Parts packaging code	BGA
package instruction	TFBGA,
Contacts	48
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	100 ns
JESD-30 code	R-PBGA-B48
length	7 mm
memory density	1048576 bit
Memory IC Type	STANDARD SRAM
memory width	16
Number of functions	1
Number of terminals	48
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	64KX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	2.2 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
width	6 mm
Base Number Matches	1

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K6F1016R4A Family

Document Title

CMOS SRAM

64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM

Revision History

Revision No. History

0.0

Initial Draft

- Specify CSP type to distinguish between uBGA and FBGA

Finalize

- Change operating voltage from 1.7~2.2V to 1.65~2.2V.

- Change I

CC2

from 25mA to 20mA

Draft Date

October 29, 1998

Remark

Preliminary

1.0

July 29, 1999

Final

The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and

products. SAMSUNG Electronics will answer to your questions about device. If you have any questions, please contact the SAMSUNG branch offices.

-1-

Revision 1.0

July 1999

K6F1016R4A-FI100 Related Products

	K6F1016R4A-FI100	K6F1016R4A-FI10	K6F1016R4A-FI70	K6F1016R4A-FI700
Description	Standard SRAM, 64KX16, 100ns, CMOS, PBGA48, 6 X 7 MM, FBGA-48	Standard SRAM, 64KX16, 100ns, CMOS, PBGA48, 6 X 7 MM, FBGA-48	Standard SRAM, 64KX16, 70ns, CMOS, PBGA48, 6 X 7 MM, FBGA-48	Standard SRAM, 64KX16, 70ns, CMOS, PBGA48, 6 X 7 MM, FBGA-48
Maker	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG
Parts packaging code	BGA	BGA	BGA	BGA
package instruction	TFBGA,	TFBGA, BGA48,6X8,30	TFBGA, BGA48,6X8,30	TFBGA,
Contacts	48	48	48	48
Reach Compliance Code	unknown	compliant	compliant	unknow
ECCN code	EAR99	EAR99	EAR99	EAR99
Maximum access time	100 ns	100 ns	70 ns	70 ns
JESD-30 code	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48
length	7 mm	7 mm	7 mm	7 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bi
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	16	16	16	16
Number of functions	1	1	1	1
Number of terminals	48	48	48	48
word count	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
organize	64KX16	64KX16	64KX16	64KX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TFBGA	TFBGA	TFBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	2.2 V	2.2 V	2.2 V	2.2 V
Minimum supply voltage (Vsup)	1.65 V	1.65 V	1.65 V	1.65 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL	BALL	BALL
Terminal pitch	0.75 mm	0.75 mm	0.75 mm	0.75 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	6 mm	6 mm	6 mm	6 mm

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