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K3N5V1000D-DC15

Description
MASK ROM, 1MX16, 150ns, CMOS, PDIP42, 0.600 INCH, DIP-42
Categorystorage    storage   
File Size98KB,4 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric View All

K3N5V1000D-DC15 Overview

MASK ROM, 1MX16, 150ns, CMOS, PDIP42, 0.600 INCH, DIP-42

K3N5V1000D-DC15 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSAMSUNG
Parts packaging codeDIP
package instructionDIP,
Contacts42
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time150 ns
Other featuresCONFIGURABLE AS 1M X 16
Spare memory width8
JESD-30 codeR-PDIP-T42
length52.42 mm
memory density16777216 bit
Memory IC TypeMASK ROM
memory width16
Number of functions1
Number of terminals42
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX16
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width15.24 mm
Base Number Matches1
K3N5V(U)1000D-D(G)C
16M-Bit (2Mx8 /1Mx16) CMOS MASK ROM
FEATURES
Switchable organization
2,097,152 x 8(byte mode)
1,048,576 x 16(word mode)
Fast access time : 100ns(Max.)
Supply voltage : single +3.0V/ single +3.3V
Current consumption
Operating : 40mA(Max.)
Standby : 30µA(Max.)
Fully static operation
All inputs and outputs TTL compatible
Three state outputs
Package
-. K3N5V(U)1000D-DC : 42-DIP-600
-. K3N5V(U)1000D-GC : 44-SOP-600
CMOS MASK ROM
GENERAL DESCRIPTION
The K3N5V(U)1000D-D(G)C is a fully static mask programma-
ble ROM fabricated using silicon gate CMOS process technol-
ogy, and is organized either as 2,097,152 x 8 bit(byte mode) or
as 1,048,576x16 bit(word mode) depending on BHE voltage
level.(See mode selection table)
This device operates with 3.0V or 3.3V power supply, and all
inputs and outputs are TTL compatible.
Because of its asynchronous operation, it requires no external
clock assuring extremely easy operation.
It is suitable for use in program memory of microprocessor, and
data memory, character generator.
The K3N5V(U)1000D-DC is packaged in a 42-DIP and the
K3N5V(U)1000D-GC in a 44-SOP.
FUNCTIONAL BLOCK DIAGRAM
PIN CONFIGURATION
A
19
.
.
.
.
.
.
.
.
A
0
A
-1
X
BUFFERS
AND
DECODER
MEMORY CELL
MATRIX
(1,048,576x16/
2,097,152x8)
A
18
A
17
A
7
A
6
A
5
A
4
A
3
1
2
3
4
5
6
7
8
9
42 A
19
41 A
8
40 A
9
39 A
10
38 A
11
37 A
12
36 A
13
35 A
14
34 A
15
33 A
16
32 BHE
N.C 1
A
18
2
A
17
A
7
3
4
44 N.C
43 A
19
42 A
8
41 A
9
40 A
10
39 A
11
38 A
12
37 A
13
36 A
14
35 A
15
34 A
16
33 BHE
32 V
SS
31 Q
15
/A
-1
30 Q
7
29 Q
14
28 Q
6
27 Q
13
26 Q
5
25 Q
12
24 Q
4
23 V
CC
A
6
5
A
5
6
A
4
A
3
A
2
7
8
9
Y
BUFFERS
AND
DECODER
SENSE AMP.
DATA OUT
BUFFERS
. . .
A
2
A
1
A
0
10
CE 11
V
SS
12
OE 13
Q
0
14
Q
8
15
Q
1
16
A
1
10
A
0
11
DIP
CE
OE
BHE
CONTROL
LOGIC
Q
0
/Q
8
Q
7
/Q
15
Q
9
17
Q
2
18
Q
10
19
Q
3
20
Q
11
21
Pin Name
A
0
- A
19
Q
0
- Q
14
Q
15
/A
-1
BHE
CE
OE
V
CC
V
SS
N.C
Pin Function
Address Inputs
Data Outputs
Output 15(Word mode)/
LSB Address(Byte mode)
Word/Byte selection
Chip Enable
Output Enable
Power
Ground
No Connection
31 V
SS
CE 12
30 Q
15
/A
-1
V
SS
13
29 Q
7
OE 14
28 Q
14
Q
0
15
27 Q
6
Q
8
16
26 Q
13
Q
1
17
25 Q
5
Q
9
18
24 Q
12
Q
2
19
23 Q
4
Q
10
20
22 V
CC
Q
3
21
Q
11
22
SOP
K3N5V(U)1000D-DC
K3N5V(U)1000D-GC
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