K7A803609B-QI200 datasheet, PDF

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K7A803609B-QI200: DescriptionCache SRAM, 256KX36, 3.1ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100; Categorystorage storage; File Size307KB，23 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K7A803609B-QI200 Overview

Cache SRAM, 256KX36, 3.1ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100

K7A803609B-QI200 Parametric

Parameter Name	Attribute value
Maker	SAMSUNG
Parts packaging code	QFP
package instruction	LQFP,
Contacts	100
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	3.1 ns
Other features	PIPELINED ARCHITECTURE
JESD-30 code	R-PQFP-G100
length	20 mm
memory density	9437184 bit
Memory IC Type	CACHE SRAM
memory width	36
Number of functions	1
Number of terminals	100
word count	262144 words
character code	256000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256KX36
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Package shape	RECTANGULAR
Package form	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	1.6 mm
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
width	14 mm
Base Number Matches	1

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K7A803609B

K7A803209B

K7A801809B

Document Title

256Kx36/x32 & 512Kx18 Synchronous SRAM

256Kx36 & 256Kx32 & 512Kx18-Bit Synchronous Pipelined Burst SRAM

Revision History

Rev. No.

0.0

0.1

0.2

0.3

1.0

History

Initial draft

1. Delete pass- through

1. Add x32 org part and industrial temperature part

1. change scan order(1) form 4T to 6T at 119BGA(x18)

1. Final spec release

2. Change I

SB2

form 50mA to 60mA

Remove tCYC 225MHz(-22)

1. Delete 119BGA package

Draft Date

May. 18 . 2001

June. 26. 2001

Aug. 11. 2001

Aug. 28. 2001

Nov. 16. 2001

Remark

Preliminary

Final

2.0

2.1

April. 01. 2002

April. 04. 2003

Final

The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the

specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-

tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.

-1-

April 2003

Rev 2.1

K7A803609B-QI200 Related Products

	K7A803609B-QI200	K7A803609B-QC200	K7A801809B-QC200	K7A803209B-QI200	K7A803609B-HC200	K7A803209B-QC200	K7A803209B-QC250	K7A803209B-QI250	K7A801809B-QI200
Description	Cache SRAM, 256KX36, 3.1ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100	Cache SRAM, 256KX36, 3.1ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100	Cache SRAM, 512KX18, 3.1ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100	Cache SRAM, 256KX32, 3.1ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100	Cache SRAM, 256KX36, 3.1ns, CMOS, PBGA119, BGA-119	Cache SRAM, 256KX32, 3.1ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100	Cache SRAM, 256KX32, 2.6ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100	Cache SRAM, 256KX32, 2.6ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100	Cache SRAM, 512KX18, 3.1ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100
Parts packaging code	QFP	QFP	QFP	QFP	BGA	QFP	QFP	QFP	QFP
package instruction	LQFP,	LQFP,	LQFP,	LQFP,	BGA,	LQFP,	LQFP,	LQFP,	LQFP,
Contacts	100	100	100	100	119	100	100	100	100
Reach Compliance Code	unknown	unknown	compliant	unknown	unknown	unknown	unknown	unknown	compliant
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	3.1 ns	3.1 ns	3.1 ns	3.1 ns	3.1 ns	3.1 ns	2.6 ns	2.6 ns	3.1 ns
Other features	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
JESD-30 code	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PBGA-B119	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100
length	20 mm	20 mm	20 mm	20 mm	22 mm	20 mm	20 mm	20 mm	20 mm
memory density	9437184 bit	9437184 bit	9437184 bit	8388608 bit	9437184 bit	8388608 bit	8388608 bit	8388608 bit	9437184 bit
Memory IC Type	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM
memory width	36	36	18	32	36	32	32	32	18
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	100	100	100	100	119	100	100	100	100
word count	262144 words	262144 words	524288 words	262144 words	262144 words	262144 words	262144 words	262144 words	524288 words
character code	256000	256000	512000	256000	256000	256000	256000	256000	512000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	70 °C	85 °C	70 °C	70 °C	70 °C	85 °C	85 °C
organize	256KX36	256KX36	512KX18	256KX32	256KX36	256KX32	256KX32	256KX32	512KX18
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LQFP	LQFP	LQFP	LQFP	BGA	LQFP	LQFP	LQFP	LQFP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	GRID ARRAY	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V
Minimum supply voltage (Vsup)	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	BALL	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.65 mm	0.65 mm	0.65 mm	1.27 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	BOTTOM	QUAD	QUAD	QUAD	QUAD
width	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm
Maker	SAMSUNG	SAMSUNG	-	-	-	-	SAMSUNG	SAMSUNG	SAMSUNG
Maximum seat height	1.6 mm	1.6 mm	1.6 mm	1.6 mm	-	1.6 mm	1.6 mm	1.6 mm	1.6 mm
Base Number Matches	1	1	1	1	1	1	1	1	-

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Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

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