D8279-5 datasheet, PDF - EEWORLD Datasheet

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D8279-5: DescriptionMicroprocessor Circuit, CMOS, CDIP40, DIP-40; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，17 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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D8279-5 Overview

Microprocessor Circuit, CMOS, CDIP40, DIP-40

D8279-5 Parametric

Parameter Name	Attribute value
Maker	Rochester Electronics
package instruction	DIP,
Reach Compliance Code	unknown
JESD-30 code	R-GDIP-T40
length	52.325 mm
Number of terminals	40
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Maximum seat height	5.72 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT
Base Number Matches	1

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REI Datasheet

8279, 8279-5

Programmable Keyboard/Display Interface

The Intel 8279 is a general purpose programmable keyboard and display I/O interface device

designed for use with Intel microprocessors. The keyboard portion can provide a scanned interface to

a 64-contact key matrix. The keyboard portion will also interface to an array of sensors or a strobed

interface keyboard, such as the hall effect and ferrite variety. Key depressions can be 2-key lockout

or N-key rollover. Keyboard entries are debounced and strobed in an 8-character FIFO. If more than

8 characters are entered, overrun status is set. Key entries set the interrupt output line to the CPU.

Rochester Electronics

Manufactured Components

Rochester branded components are

manufactured using either die/wafers

purchased from the original suppliers

or Rochester wafers recreated from the

original IP. All recreations are done with

the approval of the OCM.

Parts are tested using original factory

test programs or Rochester developed

test solutions to guarantee product

meets or exceeds the OCM data sheet.

Quality Overview

•

ISO-9001

AS9120 certification

Qualified Manufacturers List (QML) MIL-PRF-38535

•

Class Q Military

•

Class V Space Level

Qualified Suppliers List of Distributors (QSLD)

•

Rochester is a critical supplier to DLA and

meets all industry and DLA standards.

Rochester Electronics, LLC is committed to supplying

products that satisfy customer expectations for

quality and are equal to those originally supplied by

industry manufacturers.

The original manufacturer’s datasheet accompanying this document reflects the performance

and specifications of the Rochester manufactured version of this device. Rochester Electronics

guarantees the performance of its semiconductor products to the original OEM specifications.

‘Typical’ values are for reference purposes only. Certain minimum or maximum ratings may be

based on product characterization, design, simulation, or sample testing.

To learn more, please visit

www.rocelec.com

D8279-5 Related Products

	D8279-5	TD8279-5	QD8279-5	QD8279	P8279-5	D8279	P8279
Description	Microprocessor Circuit, CMOS, CDIP40, DIP-40	Microprocessor Circuit, CMOS, CDIP40, DIP-40	Microprocessor Circuit, CMOS, CDIP40, DIP-40	Microprocessor Circuit, CMOS, CDIP40, DIP-40	Microprocessor Circuit, CMOS, PDIP40, DIP-40	Microprocessor Circuit, CMOS, CDIP40, DIP-40	Microprocessor Circuit, CMOS, PDIP40, DIP-40
package instruction	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-GDIP-T40	R-GDIP-T40	R-GDIP-T40	R-GDIP-T40	R-PDIP-T40	R-GDIP-T40	R-PDIP-T40
length	52.325 mm	52.325 mm	52.325 mm	52.325 mm	52.26 mm	52.325 mm	52.26 mm
Number of terminals	40	40	40	40	40	40	40
Maximum operating temperature	70 °C	85 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Maximum seat height	5.72 mm	5.72 mm	5.72 mm	5.72 mm	5.08 mm	5.72 mm	5.08 mm
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT
Maker	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	-	Rochester Electronics	-
Maximum supply voltage	5.5 V	-	5.5 V	5.25 V	5.5 V	5.25 V	5.25 V
Minimum supply voltage	4.5 V	-	4.5 V	4.75 V	4.5 V	4.75 V	4.75 V
Base Number Matches	1	1	1	1	1	-	-

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