Configuration Memory, 64KX1, Serial, CMOS, CDIP8, CERAMIC, DIP-8
| Parameter Name | Attribute value |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 8 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum clock frequency (fCLK) | 5 MHz |
| JESD-30 code | R-GDIP-T8 |
| memory density | 65536 bit |
| Memory IC Type | CONFIGURATION MEMORY |
| memory width | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 65536 words |
| character code | 64000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 64KX1 |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | SERIAL |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| 5962-9471701MPX | 5962-9561701MPX | |
|---|---|---|
| Description | Configuration Memory, 64KX1, Serial, CMOS, CDIP8, CERAMIC, DIP-8 | Configuration Memory, 256KX1, Serial, CMOS, CDIP8, CERAMIC, DIP-8 |
| Parts packaging code | DIP | DIP |
| package instruction | DIP, | DIP, |
| Contacts | 8 | 8 |
| Reach Compliance Code | unknown | unknown |
| ECCN code | EAR99 | EAR99 |
| Maximum clock frequency (fCLK) | 5 MHz | 12.5 MHz |
| JESD-30 code | R-GDIP-T8 | R-GDIP-T8 |
| memory density | 65536 bit | 262144 bit |
| Memory IC Type | CONFIGURATION MEMORY | CONFIGURATION MEMORY |
| memory width | 1 | 1 |
| Number of functions | 1 | 1 |
| Number of terminals | 8 | 8 |
| word count | 65536 words | 262144 words |
| character code | 64000 | 256000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C |
| organize | 64KX1 | 256KX1 |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE |
| Parallel/Serial | SERIAL | SERIAL |
| Certification status | Not Qualified | Not Qualified |
| Filter level | MIL-STD-883 | MIL-STD-883 |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | NO | NO |
| technology | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | DUAL | DUAL |
| Base Number Matches | 1 | 1 |
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