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5962-9309102HXA

Description
EEPROM Module, 512KX8, 300ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32
Categorystorage    storage   
File Size351KB,12 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

5962-9309102HXA Overview

EEPROM Module, 512KX8, 300ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32

5962-9309102HXA Parametric

Parameter NameAttribute value
Parts packaging codeDIP
package instructionDIP,
Contacts32
Reach Compliance Codecompliant
ECCN code3A001.A.2.C
Maximum access time300 ns
Other featuresAUTOMATIC WRITE
JESD-30 codeR-CDIP-T32
JESD-609 codee0
length42.4 mm
memory density4194304 bit
Memory IC TypeEEPROM MODULE
memory width8
Number of functions1
Number of terminals32
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512KX8
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height6.98 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTIN LEAD
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm
Base Number Matches1
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