HM62W8128LFP-10SL datasheet, PDF

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HM62W8128LFP-10SL: DescriptionStandard SRAM, 128KX8, 100ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32; Categorystorage storage; File Size87KB，16 Pages; ManufacturerHitachi （Renesas ）; Websitehttp://www.renesas.com/eng/

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HM62W8128LFP-10SL Overview

Standard SRAM, 128KX8, 100ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32

HM62W8128LFP-10SL Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Hitachi （Renesas ）
Parts packaging code	SOIC
package instruction	SOP, SOP32,.56
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	100 ns
Other features	BATTERY BACK-UP OPERATION
I/O type	COMMON
JESD-30 code	R-PDSO-G32
JESD-609 code	e0
length	20.45 mm
memory density	1048576 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP32,.56
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	3 mm
Maximum standby current	0.000015 A
Minimum standby current	2 V
Maximum slew rate	0.025 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	11.3 mm
Base Number Matches	1

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HM62W8128 Series

131,072-word

8-bit High Speed CMOS Static RAM

Description

The Hitachi HM62W8128 is a CMOS static RAM organized 131,072-word

8-bit. It realizes higher density,

higher performance and low power consumption by employing 0.8

µm

Hi-CMOS process technology. It

offers low power standby power dissipation; therefore, it is suitable for battery backup systems. The device,

packaged in a 525-mil SOP (460-mil body SOP) or a 8

20 mm TSOP with thickness of 1.2 mm, is available

for high density mounting. TSOP package is suitable for cards, and reverse type TSOP is also provided.

Features

•

High speed



Fast access time: 100/120 ns (max)

•

Low power



Active: 23 mW (typ)



Standby: 4

µW

(typ)

•

Single 3.3 V supply

•

Completely static memory

No clock or timing strobe required

•

Equal access and cycle times

•

Common data input and output

Three state output

•

All inputs and outputs CMOS compatible.

•

Capability of battery backup operation

2 chip selection for battery backup

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