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54F219DMQB

Description
IC,SRAM,16X4,F-TTL,DIP,16PIN,CERAMIC
Categorystorage    storage   
File Size207KB,4 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
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54F219DMQB Overview

IC,SRAM,16X4,F-TTL,DIP,16PIN,CERAMIC

54F219DMQB Parametric

Parameter NameAttribute value
MakerNational Semiconductor(TI )
package instructionDIP, DIP16,.3
Reach Compliance Codeunknown
Maximum access time32 ns
JESD-30 codeR-XDIP-T16
Memory IC TypeSTANDARD SRAM
memory width4
Number of terminals16
word count16 words
character code16
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize16X4
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Maximum slew rate0.055 mA
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyTTL
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

54F219DMQB Related Products

54F219DMQB 74F219DC 74F219QC
Description IC,SRAM,16X4,F-TTL,DIP,16PIN,CERAMIC IC 16 X 4 STANDARD SRAM, 27 ns, CDIP16, CERAMIC, DIP-16, Static RAM IC 16 X 4 STANDARD SRAM, 27 ns, PQCC20, PLASTIC, CC-20, Static RAM
Maker National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI )
package instruction DIP, DIP16,.3 DIP, DIP16,.3 QCCJ, LDCC20,.4SQ
Reach Compliance Code unknown unknown unknown
Maximum access time 32 ns 27 ns 27 ns
JESD-30 code R-XDIP-T16 R-GDIP-T16 S-PQCC-J20
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 4 4 4
Number of terminals 16 16 20
word count 16 words 16 words 16 words
character code 16 16 16
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 70 °C 70 °C
organize 16X4 16X4 16X4
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material CERAMIC CERAMIC, GLASS-SEALED PLASTIC/EPOXY
encapsulated code DIP DIP QCCJ
Encapsulate equivalent code DIP16,.3 DIP16,.3 LDCC20,.4SQ
Package shape RECTANGULAR RECTANGULAR SQUARE
Package form IN-LINE IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL PARALLEL
power supply 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum slew rate 0.055 mA 0.055 mA 0.055 mA
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount NO NO YES
technology TTL TTL TTL
Temperature level MILITARY COMMERCIAL COMMERCIAL
Terminal form THROUGH-HOLE THROUGH-HOLE J BEND
Terminal pitch 2.54 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL QUAD
Base Number Matches 1 1 -
Is it Rohs certified? - incompatible incompatible
ECCN code - EAR99 EAR99
JESD-609 code - e0 e0
length - 19.43 mm 8.89 mm
memory density - 64 bit 64 bit
Number of functions - 1 1
Number of ports - 1 1
Exportable - NO NO
Peak Reflow Temperature (Celsius) - NOT SPECIFIED NOT SPECIFIED
Maximum seat height - 5.08 mm 4.57 mm
Maximum supply voltage (Vsup) - 5.5 V 5.5 V
Minimum supply voltage (Vsup) - 4.5 V 4.5 V
Terminal surface - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED
width - 7.62 mm 8.89 mm
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