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K9F1208U0A-PCB0T

Description
Flash, 64MX8, 30ns, PDSO48,
Categorystorage    storage   
File Size968KB,45 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Environmental Compliance
Download Datasheet Parametric View All

K9F1208U0A-PCB0T Overview

Flash, 64MX8, 30ns, PDSO48,

K9F1208U0A-PCB0T Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerSAMSUNG
package instructionTSSOP, TSSOP48,.8,20
Reach Compliance Codecompliant
Maximum access time30 ns
command user interfaceYES
Data pollingNO
JESD-30 codeR-PDSO-G48
JESD-609 codee3
memory density536870912 bit
Memory IC TypeFLASH
memory width8
Humidity sensitivity level1
Number of departments/size4K
Number of terminals48
word count67108864 words
character code64000000
Maximum operating temperature70 °C
Minimum operating temperature
organize64MX8
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP48,.8,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
page size512 words
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
power supply3/3.3 V
Certification statusNot Qualified
ready/busyYES
Department size16K
Maximum standby current0.00005 A
Maximum slew rate0.02 mA
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitNO
Base Number Matches1
K9F1216U0A
K9F1208U0A
FLASH MEMORY
Document Title
64M x 8 Bit , 32M x 16 Bit NAND Flash Memory
Revision History
Revision No. History
0.0
0.1
Initial issue.
TBGA(K9F12XXX0A-DCB0/DIB0) size information is changed.
(before) 9 x 11 /0.8mm pitch , Width 1.0 mm
(after ) To Be Decided.
TBGA(K9F12XXX0A-DCB0/DIB0) size information is changed.
(before) 9 x 11 /0.8mm pitch , Width 1.0 mm, to
(after) 8.5 x 15 /0.8mm pitch, Width 1.0mm
Draft Date
Apr. 25th 2002
May. 9th 2002
Remark
Preliminary
0.2
July, 10th 2002
0.3
0.4
Pin numbering includes TBGA Dummy ball . (Page5)
Pin numbering excludes TBGA Dummy ball . (Page5)
Pin assignment of TBGA dummy ball is changed.
(before) DNU --> (after) N.C
1. Add the Rp vs tr ,tf & Rp vs ibusy graph for 1.8V device (Page 43)
2. Add the data protection Vcc guidence for 1.8V device - below about
1.1V. (Page 44)
The min. Vcc value 1.8V devices is changed.
K9F1208Q0A : Vcc 1.65V~1.95V --> 1.70V~1.95V
Pb-free Package is added.
K9F1208U0A-FCB0,FIB0
K9F1208Q0A-HCB0,HIB0
K9F1216U0A-HCB0,HIB0
K9F1216U0A-PCB0,PIB0
K9F1216Q0A-HCB0,HIB0
K9F1208U0A-HCB0,HIB0
K9F1208U0A-PCB0,PIB0
Errata is added.(Front Page)-K9F1208Q0A
tWC tWH tWP tRC tREH tRP tREA tCEA
Specification
45 15 25 50 15 25 30
45
Relaxed value 60 20 40 60 20 40 40
55
New definition of the number of invalid blocks is added.
(Minimum 1004 valid blocks are guaranteed for each contiguous 128Mb
memory space.)
1. 2.65V device is added.
2. Note is added.
(VIL can undershoot to -0.4V and VIH can overshoot to VCC +0.4V for
durations of 20 ns or less.)
Aug, 10th 2002
Oct, 21th 2002
0.5
Nov, 21th 2002
0.6
Mar. 5th 2003
0.7
Mar. 13rd 2003
0.8
Mar. 17th 2003
0.9
Apr. 4th 2003
1.0
Jul. 4th 2003
Note : For more detailed features and specifications including FAQ, please refer to Samsung’s Flash web site.
http://www.samsung.com/Products/Semiconductor/Flash/TechnicalInfo/datasheets.htm
The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right
to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have
any questions, please contact the SAMSUNG branch office near you.
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