DG50_ACJ/CWE ..................................................0°C to +70°C
DG50_ABK........................................................-20°C to +85°C
DG50_ADJ/DY/EWE..........................................-40°C to +85°C
DG50_AAK/MY ...............................................-55°C to +125°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow)
PDIP, Wide SO, Narrow SO, CERDIP containing lead(Pb)..+240°C
PDIP, Wide SO, Narrow SO lead(Pb)-free ....................+260°C
Note 1:
Signals on S_ or D_ exceeding V+ or V- are clamped by internal diodes. Limit forward-diode current to maximum current ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
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DSP and ARM Processors
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