Junction-to-Ambient Thermal Resistance in Still Air
32-Pin 5mm x 5mm TQFP ........................................+105°C/W
32-Lead 5mm x 5mm QFN ........................................+47°C/W
Junction-to-Ambient Thermal Resistance with
500LFPM Airflow
32-Pin 5mm x 5mm TQFP .........................................+73°C/W
Junction-to-Case Thermal Resistance
32-Pin 5mm x 5mm TQFP .........................................+25°C/W
32-Lead 5mm x 5mm QFN .........................................+2°C/W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
ESD Protection
Human Body Model (Inputs and Outputs) ........................2kV
Soldering Temperature (10s) ...........................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(V
CC
- V
EE
= 2.375V to 5.5V, MAX9400/MAX9403 outputs terminated with 50Ω ±1% to V
CC
- 2.0V. Typical values are at V
CC
- V
EE
=
3.3V, V
IHD
= V
CC
- 0.9V, V
ILD
= V
CC
- 1.7V, T
A
= +25°C, unless otherwise noted.) (Notes 1, 2, and 3)
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