EEWORLDEEWORLDEEWORLD

Part Number

Search

IDT71T65802S100BG

Description
ZBT SRAM, 512KX18, 5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119
Categorystorage    storage   
File Size541KB,25 Pages
ManufacturerIDT (Integrated Device Technology)
Download Datasheet Parametric Compare View All

IDT71T65802S100BG Overview

ZBT SRAM, 512KX18, 5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119

IDT71T65802S100BG Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instructionBGA,
Contacts119
Reach Compliance Codenot_compliant
ECCN code3A991.B.2.A
Maximum access time5 ns
JESD-30 codeR-PBGA-B119
JESD-609 codee0
length22 mm
memory density9437184 bit
Memory IC TypeZBT SRAM
memory width18
Humidity sensitivity level3
Number of functions1
Number of terminals119
word count524288 words
character code512000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX18
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
Certification statusNot Qualified
Maximum seat height2.36 mm
Maximum supply voltage (Vsup)2.625 V
Minimum supply voltage (Vsup)2.375 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature20
width14 mm
Base Number Matches1
256K x 36, 512K x 18
2.5V Synchronous ZBT™ SRAMs
2.5V I/O, Burst Counter
Pipelined Outputs
Features
u
256K x 36, 512K x 18 memory configurations
u
Supports high performance system speed - 150 MHz
u
ZBT
TM
Feature - No dead cycles between write and read
u
Internally synchronized output buffer enable eliminates the
u
Single R/W (READ/WRITE) control pin
u
Positive clock-edge triggered address, data, and control
u
u
u
u
u
u
u
need to control
OE
cycles
(3.8 ns Clock-to-Data Access)
Preliminary
IDT71T65602
IDT71T65802
Description
signal registers for fully pipelined applications
4-word burst capability (interleaved or linear)
Individual byte write (BW
1
-
BW
4
) control (May tie active)
Three chip enables for simple depth expansion
2.5V power supply (±5%)
2.5V I/O Supply (V
DDQ
)
Power down controlled by ZZ input
Packaged in a JEDEC standard 100-pin plastic thin quad
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch
ball grid array (fBGA).
The IDT71T65602/5802 are 2.5V high-speed 9,437,184-bit
(9 Megabit) synchronous SRAMs. They are designed to eliminate dead
bus cycles when turning the bus around between reads and writes, or
writes and reads. Thus, they have been given the name ZBT
TM
, or Zero
Bus Turnaround.
Address and control signals are applied to the SRAM during one
clock cycle, and two cycles later the associated data cycle occurs, be it
read or write.
The IDT71T65602/5802 contain data I/O, address and control signal
registers. Output enable is the only asynchronous signal and can be used
to disable the outputs at any given time.
A Clock Enable
CEN
pin allows operation of the IDT71T65602/5802
to be suspended as long as necessary. All synchronous inputs are ignored
when (CEN) is high and the internal device registers will hold their previous
values.
There are three chip enable pins (CE
1
, CE
2
,
CE
2
) that allow the
user to deselect the device when desired. If any one of these three is not
asserted when ADV/LD is low, no new memory operation can be initiated.
Pin Description Summary
A
0
-A
18
CE
1
, CE
2
,
CE
2
OE
R/W
CEN
BW
1
,
BW
2
,
BW
3
,
BW
4
CLK
ADV/LD
LBO
TMS
TDI
TCK
TDO
ZZ
I/O
0
-I/O
31
, I/O
P1
-I/O
P4
V
DD
, V
DDQ
V
SS
Address Inputs
Chip Enables
Output Enable
Read/Write Signal
Clock Enable
Individual Byte Write Selects
Clock
Advance burst address / Load new address
Linear / Interleaved Burst Order
Test Mode Select
Test Data Input
Test Clock
Test Data Output
Sleep Mode
Data Input / Output
Core Power, I/O Power
Ground
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Output
Input
I/O
Supply
Supply
Synchronous
Synchronous
Asynchronous
Synchronous
Synchronous
Synchronous
N/A
Synchronous
Static
N/A
N/A
N/A
N/A
Asynchronous
Synchronous
Static
Static
5302 tbl 01
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc. and the architecture is supported by Micron Technology and Motorola, Inc.
NOVEMBER 2000
DSC-5302/02
1
©2000 Integrated Device Technology, Inc.

IDT71T65802S100BG Related Products

IDT71T65802S100BG IDT71T65802S133BQ IDT71T65802S133PF IDT71T65802S100BQ IDT71T65802S150PF IDT71T65802S100PF IDT71T65802S150BG
Description ZBT SRAM, 512KX18, 5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 ZBT SRAM, 512KX18, 4.2ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165 ZBT SRAM, 512KX18, 4.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIHGT, PLASTIC, TQFP-100 ZBT SRAM, 512KX18, 5ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165 ZBT SRAM, 512KX18, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIHGT, PLASTIC, TQFP-100 ZBT SRAM, 512KX18, 5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIHGT, PLASTIC, TQFP-100 ZBT SRAM, 512KX18, 3.8ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code BGA BGA QFP BGA QFP QFP BGA
package instruction BGA, TBGA, LQFP, TBGA, LQFP, LQFP, BGA,
Contacts 119 165 100 165 100 100 119
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 5 ns 4.2 ns 4.2 ns 5 ns 3.8 ns 5 ns 3.8 ns
JESD-30 code R-PBGA-B119 R-PBGA-B165 R-PQFP-G100 R-PBGA-B165 R-PQFP-G100 R-PQFP-G100 R-PBGA-B119
JESD-609 code e0 e0 e0 e0 e0 e0 e0
length 22 mm 15 mm 20 mm 15 mm 20 mm 20 mm 22 mm
memory density 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit
Memory IC Type ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM
memory width 18 18 18 18 18 18 18
Humidity sensitivity level 3 3 3 3 3 3 3
Number of functions 1 1 1 1 1 1 1
Number of terminals 119 165 100 165 100 100 119
word count 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words
character code 512000 512000 512000 512000 512000 512000 512000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 512KX18 512KX18 512KX18 512KX18 512KX18 512KX18 512KX18
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA TBGA LQFP TBGA LQFP LQFP BGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY GRID ARRAY, THIN PROFILE FLATPACK, LOW PROFILE GRID ARRAY, THIN PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 225 225 240 225 240 240 225
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.36 mm 1.2 mm 1.6 mm 1.2 mm 1.6 mm 1.6 mm 2.36 mm
Maximum supply voltage (Vsup) 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V
Minimum supply voltage (Vsup) 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL GULL WING BALL GULL WING GULL WING BALL
Terminal pitch 1.27 mm 1 mm 0.65 mm 1 mm 0.65 mm 0.65 mm 1.27 mm
Terminal location BOTTOM BOTTOM QUAD BOTTOM QUAD QUAD BOTTOM
Maximum time at peak reflow temperature 20 20 20 20 20 20 20
width 14 mm 13 mm 14 mm 13 mm 14 mm 14 mm 14 mm
Maker IDT (Integrated Device Technology) - - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Base Number Matches 1 1 1 1 - - -
There is an error when connecting the development board to CCS. Please help me
I made my own development board, the emulator is XDS560PLUS and connected with JTAG port. The following error occurred during the connection: Trouble Reading Register: Error 0x80002044/-275 Fatal Erro...
pd840228 Embedded System
Regarding the timing issue of 51 microcontroller!
I made a program and wanted the direction of the LED revolving light to change once every 10 seconds. However, in fact, the actual result I tested was 24 seconds, which is strange! The frequency of th...
cclccl985 Embedded System
[RVB2601 Creative Application Development] Simulating UART 3 to implement FIFO reception
The hardware serial port has a FIFO function, so the received data will be put into the buffer. Since the GPIO simulation has no buffer, I "copied" a FIFO work myself. fifi.c /**************FIFO Begin...
lugl4313820 XuanTie RISC-V Activity Zone
Please God save the child
Please help me, big guys. I beg you. 1. Based on the principle of the narrow pulse frequency discrimination circuit, design a practical frequency discrimination circuit, in which the monostable trigge...
无意lll Analog electronics
CES 2016 Highlights Review: Driving the EvoCar's Fantastic Journey
Imagine a car from the future: the driver can easily connect his phone to the car and set a destination or play music on a touch screen control panel that supports color 3D graphics. Not only that, th...
maylove DSP and ARM Processors
[MSP430 LaunchPad Application Notes] Using G2231ADC to implement an oscilloscope
The data is collected using the built-in 10-bit 200KSPS ADC of the LaunchPad MSP430G2231 and sent to the host through the serial port. The host computer software is developed using CSharp, which recei...
littleshrimp TI Technology Forum

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1722  2141  1004  2928  2186  35  44  21  59  45 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号