1N3821 thru 1N3830A, e3
1 Watt Metal Case Zener Diodes
SCOTTSDALE DIVISION
DESCRIPTION
This well established zener diode series for the 1N3821 thru 1N3830A
JEDEC registration in the glass hermetic sealed DO-13 package provides a
low voltage selection for 3.3 to 7.5 volts. It is also well suited for high-
reliability applications where it is available in JAN, JANTX, and JANTXV
military qualifications. Higher voltages are also available in the 1N3016
thru 1N3051 series (6.8 V to 200 V) in the same package (see separate
data sheet). Microsemi also offers numerous other Zener diode products
for a variety of other packages including surface mount.
APPEARANCE
WWW .
Microsemi
.C
OM
DO-13
(DO-202AA)
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
FEATURES
•
•
•
•
Zener Voltage Range: 3.3 V to 7.5 V
Hermetically sealed DO-13 metal package
Internally solder-bonded construction.
Also available in JAN, JANTX, JANTXV qualifications
per MIL-PRF19500/115 by adding the JAN, JANTX,
or JANTXV prefixes to part numbers for desired level
of screening, e.g. JANTX1N3821, JANTXV1N3051A,
etc.
Surface mount also available with 1N3821UR-1 thru
1N30330AUR-1 series on separate data sheet
RoHS Compliant devices available by adding “e3” suffix
•
•
•
•
•
•
•
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current
and temperature range
Low voltage selection from 3.3 to 7.5 V
Tight voltage tolerances available
Low reverse (leakage) currents
Nonsensitive to ESD
Hermetically sealed metal package
Inherently radiation hard as described in
Microsemi MicroNote 050
•
•
MAXIMUM RATINGS
•
Operating Junction and Storage Temperatures:
-65
o
C to +175
o
C
o
•
THERMAL RESISTANCE: 50 C/W* junction to lead
at 0.375 inches (10 mm) from body or 110
o
C/W
junction to ambient when leads are mounted on FR4
PC board with 4 mm
2
copper pads (1 oz) and track
width 1 mm, length 25 mm
•
DC Power Dissipation
*
: 1 Watt at T
L
< +125
o
C 3/8”
o
(10 mm) from body or 1.0 Watts at T
L
< +65 C when
mounted on FR4 PC board as described for thermal
resistance above (also see Fig 1)
•
Forward Voltage @ 200 mA: 1.5 Volts.
•
Solder Temperatures: 260
o
C for 10 s (maximum)
•
•
MECHANICAL AND PACKAGING
CASE: DO-13 (DO-202AA), welded, hermetically
sealed metal and glass
FINISH: All external surfaces are Tin-Lead (Pb/Sn)
or RoHS compliant annealed matte-Tin (Sn) plated
and solderable per MIL-STD-750 method 2026
POLARITY: Cathode connected case.
WEIGHT: 1.4 grams.
Tape & Reel option: Standard per EIA-296 (add
“TR” suffix to part number)
See package dimensions on last page
•
•
•
•
1N3821 – 1N3830A, e3
* For further mounting reference options, thermal resistance from junction to metal case is
<
20
o
C/W
when mounting DO-13 metal case directly on heat sink.
Copyright
©
2006
3-12-2006 REV B
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
1N3821 thru 1N3830A, e3
1 Watt Metal Case Zener Diodes
SCOTTSDALE DIVISION
*ELECTRICAL CHARACTERISTICS @ 25
o
C
JEDEC
TYPE
NUMBER
1N3821
1N3821A
1N3822
1N3822A
1N3823
1N3823A
1N3824
1N3824A
1N3825
1N3825A
1N3826
1N3826A
1N3827
1N3827A
1N3828
1N3828A
1N3829
1N3829A
1N3830
1N3830A
NOMINAL
ZENER
VOLTAGE
V
Z
@ I
ZT
(Note 1)
Volts
3.3
3.3
3.6
3.6
3.9
3.9
4.3
4.3
4.7
4.7
5.1
5.1
5.6
5.6
6.2
6.2
6.8
6.8
7.5
7.5
ZENER
TEST
CURRENT
I
ZT
mA
76
76
69
69
64
64
58
58
53
53
49
49
45
45
41
41
37
37
34
34
MAXIMUM ZENER IMPEDANCE
(Note 2)
Z
ZT
@ I
ZT
Z
ZK
@ I
ZK
= 1mA
OHMS
OHMS
10
400
10
400
10
400
10
400
9
400
9
400
9
400
9
400
8
500
8
500
7
550
7
550
5
600
5
600
2
700
2
700
1.5
500
1.5
500
1.5
250
1.5
250
MAXIMUM
ZENER
CURRENT
I
ZM
(Note 3)
mA
276
276
252
252
238
238
213
213
194
194
178
178
162
162
146
146
133
133
121
121
MAXIMUM
REVERSE
LEAKAGE
CURRENT
@ V
R
I
R
μA
Volts
100
1
100
1
100
1
100
1
50
1
50
1
10
1
10
1
10
1
10
1
10
1
10
1
10
2
10
2
10
3
10
3
10
3
10
3
10
3
10
3
TYPICAL
TEMP. COEFF.
OF ZENER
VOLTAGE
α
VZ
o
%/ C
-.066
-.066
-.058
-.058
-.046
-.046
-.033
-.033
-.015
-.015
+/-.010
+/-.010
+.030
+.030
+.049
+.049
+.053
+.053
+.057
+.057
WWW .
Microsemi
.C
OM
*JEDEC Registered Data.
NOTES:
1.
The JEDEC type numbers shown with suffix A have a standard tolerance of +/-5% on the nominal zener voltage. V
Z
measured
o
with device in thermal equilibrium in 25 C still air and mounted in test clips, ¾” from unit body. if tighter tolerance on V
Z
is required,
consult factory.
The zener impedance is derived when a 60 cycle ac current having an rms value equal to 10% of the dc zener current (I
ZT
or I
ZK
) is
superimposed on I
ZT
or I
ZK
. Zener impedance is measured at 2 points to ensure a sharp knee on the breakdown curve and to
eliminate unstable units. See MicroNote 202 for variation in dynamic impedance with different zener currents.
Allowance has been made for the increase in
V
Z
due to Z
Z
and for the increase in junction temperature as the unit approaches
thermal equilibrium at the power dissipation of 1 watt.
2.
3.
GRAPHS
Rated Power Dissipation (W)
1N3821 – 1N3830A, e3
T
L
T
A
T
L
– Lead Temperature ( C) 3/8” from body
or T
A
on FR4 PC Board
o
FIGURE 2
Temperature Coeff. vs. Zener Voltage
FIGURE 1
Power Derating
Copyright
©
2006
3-12-2006 REV B
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 2
Embedded System
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