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R71PI3330502-M

Description
Film Capacitor, Polypropylene, 630V, 20% +Tol, 20% -Tol, 0.33uF, Through Hole Mount, RADIAL LEADED
CategoryPassive components    capacitor   
File Size457KB,5 Pages
ManufacturerKEMET
Websitehttp://www.kemet.com
Download Datasheet Parametric View All

R71PI3330502-M Overview

Film Capacitor, Polypropylene, 630V, 20% +Tol, 20% -Tol, 0.33uF, Through Hole Mount, RADIAL LEADED

R71PI3330502-M Parametric

Parameter NameAttribute value
MakerKEMET
package instruction,
Reach Compliance Codecompliant
ECCN codeEAR99
capacitance0.33 µF
Capacitor typeFILM CAPACITOR
dielectric materialsPOLYPROPYLENE
JESD-609 codee3
Installation featuresTHROUGH HOLE MOUNT
negative tolerance20%
Number of terminals2
Maximum operating temperature105 °C
Minimum operating temperature-40 °C
Package shapeRECTANGULAR PACKAGE
method of packingBULK
positive tolerance20%
Rated (AC) voltage (URac)275 V
Rated (DC) voltage (URdc)630 V
surface mountNO
Terminal surfaceTIN
Terminal shapeWIRE
Base Number Matches1
Loose
Fig.1
Taped
Fig.2
MeTAllIZeD POlyPROPylene FIlM
CAPACITOR
MKP series
R71
Typical applications:
P.F.C. (Power Factor Correction)
PRoDUCT CoDe:
R71
Ø d ±0.05
p
≤15
0.6 or 0.8*
22.5
p
27.5
0.8
p = 37.5
1
*see size table.
All dimensions are in mm.
MKP Series
geneRAl TeCHnICAl DATA
Dielectric:
polypropylene film.
Plates:
metal layer deposited by evaporation under
vacuum.
Winding:
non-inductive type.
leads:
tinned wire.
Protection:
plastic case, thermosetting resin filled.
Box material is solvent resistant and flame
retardant according to UL94 V0.
Marking:
Manufacturer’s logo, series, capacitance,
tolerance, D.C. rated voltage.
Operating temperature range:
-40 to +110°C
For temperatures between +105°C and 110°C a
decreasing factor of 4% per degree C on the rated
voltage V
R
has to be applied.
eleCTRICAl CHARACTeRISTICS
Capacitance range:
0.01µF to 22µF
Capacitance tolerances
(measured at 1 kHz):
±5% (J) ±10% (K); ±20% (M);
Tolerance available upon requests
Total self-inductance
(L): (lead length ~2mm)
Pitch (mm)
L(nH)
10
9
15
10
22.5
18
27.5
18
37.5
20
Pitch Box thickness (B)
(mm)
(mm)
10.0
All
15.0
<7.5
15.0
≥7.5
22.5
All
27.5
All
37.5
All
Maximum dimensions (mm)
B max
H max
L max
B +0.2
H +0.1
L +0.2
B +0.2
H +0.1
L +0.3
B +0.2
H +0.1
L +0.5
B +0.2
H +0.1
L +0.3
B +0.2
H +0.1
L +0.3
B +0.3
H +0.1
L +0.3
TeST MeTHOD AnD PeRFORMAnCe
Damp heat, steady state:
Test conditions 1st
Temperature:
Relative humidity (RH):
Test duration:
Test conditions 2nd
Temperature:
Relative humidity (RH):
Test duration:
Performance
Capacitance change |∆C/C|:
Insulation resistance:
endurance:
Test conditions
Temperature:
Test duration:
Voltage applied:
Performance
Capacitance change |∆C/C|:
Insulation resistance:
Resistance to soldering heat:
Test conditions
solder bath temperature:
Dipping time (with heat screen):
Performance
Capacitance change |∆C/C|:
≤2%
+260°C±5°C
10 s±1 s
≤5%
≥50%
of initial limit.
+60°C±2°C
95% ±2%
500 hours
+40°C±2°C
93% ±2%
56 days
+105°C±2°C
2000 h
1.25xV
R
≤5%
≥50%
of initial limit.
Dissipation factor (DF):
tgδx10
-4
at +25°C ±5°C:
≤10
(6)* at 1kHz
*
Typical value
Insulation resistance:
Test conditions
+25°C±5°C
Temperature:
1 min
Voltage charge time:
Voltage charge:
100 Vdc
Performance
≥1
x 10
5
MΩ for C
≤0.33
µ
F
(5 x 10
5
MΩ)*
≥30000
s
for C
>0.33
µ
F
(150000 s)*
*Typical
value
Test voltage between terminations:
1.6xV
R
applied for 2 s at +25°C±5°C
Winding scheme
09/2008
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