UV PLD, 30ns, PAL-Type, CMOS, CDIP24, 0.300 INCH, CERDIP-24
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Intel |
| Parts packaging code | DIP |
| package instruction | DIP, DIP24,.3 |
| Contacts | 24 |
| Reach Compliance Code | compliant |
| Other features | PAL WITH MACROCELLS; 12 MACROCELLS; 2 EXTERNAL CLOCKS; SHARED INPUT/CLOCK |
| Architecture | PAL-TYPE |
| maximum clock frequency | 23.8 MHz |
| JESD-30 code | R-GDIP-T24 |
| JESD-609 code | e0 |
| length | 32.07 mm |
| Dedicated input times | 8 |
| Number of I/O lines | 12 |
| Number of entries | 22 |
| Output times | 12 |
| Number of product terms | 200 |
| Number of terminals | 24 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 8 DEDICATED INPUTS, 12 I/O |
| Output function | MACROCELL |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Programmable logic type | UV PLD |
| propagation delay | 30 ns |
| Certification status | Not Qualified |
| Maximum seat height | 5.72 mm |
| Maximum supply voltage | 5.25 V |
| Minimum supply voltage | 4.75 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| Base Number Matches | 1 |
| D5AC312-30 | P5AC312-30 | N5AC312-30 | P5AC312-25 | D5AC312-25 | |
|---|---|---|---|---|---|
| Description | UV PLD, 30ns, PAL-Type, CMOS, CDIP24, 0.300 INCH, CERDIP-24 | OT PLD, 30ns, PAL-Type, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | OT PLD, 30ns, PAL-Type, CMOS, PQCC28, PLASTIC, LCC-28 | OT PLD, 25ns, PAL-Type, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | UV PLD, 25ns, PAL-Type, CMOS, CDIP24, 0.300 INCH, CERDIP-24 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Intel | Intel | Intel | Intel | Intel |
| Parts packaging code | DIP | DIP | QLCC | DIP | DIP |
| package instruction | DIP, DIP24,.3 | DIP, DIP24,.3 | QCCJ, LDCC28,.5SQ | DIP, DIP24,.3 | DIP, DIP24,.3 |
| Contacts | 24 | 24 | 28 | 24 | 24 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | unknown |
| Other features | PAL WITH MACROCELLS; 12 MACROCELLS; 2 EXTERNAL CLOCKS; SHARED INPUT/CLOCK | PAL WITH MACROCELLS; 12 MACROCELLS; 2 EXTERNAL CLOCKS; SHARED INPUT/CLOCK | PAL WITH MACROCELLS; 12 MACROCELLS; 2 EXTERNAL CLOCKS; SHARED INPUT/CLOCK | PAL WITH MACROCELLS; 12 MACROCELLS; 2 EXTERNAL CLOCKS; SHARED INPUT/CLOCK | PAL WITH MACROCELLS; 12 MACROCELLS; 2 EXTERNAL CLOCKS; SHARED INPUT/CLOCK |
| Architecture | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
| maximum clock frequency | 23.8 MHz | 23.8 MHz | 23.8 MHz | 28.5 MHz | 28.5 MHz |
| JESD-30 code | R-GDIP-T24 | R-PDIP-T24 | S-PQCC-J28 | R-PDIP-T24 | R-GDIP-T24 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| length | 32.07 mm | 31.61 mm | 11.5062 mm | 31.61 mm | 32.07 mm |
| Dedicated input times | 8 | 8 | 8 | 8 | 8 |
| Number of I/O lines | 12 | 12 | 12 | 12 | 12 |
| Number of entries | 22 | 22 | 22 | 22 | 22 |
| Output times | 12 | 12 | 12 | 12 | 12 |
| Number of product terms | 200 | 200 | 200 | 200 | 200 |
| Number of terminals | 24 | 24 | 28 | 24 | 24 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 8 DEDICATED INPUTS, 12 I/O | 8 DEDICATED INPUTS, 12 I/O | 8 DEDICATED INPUTS, 12 I/O | 8 DEDICATED INPUTS, 12 I/O | 8 DEDICATED INPUTS, 12 I/O |
| Output function | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| Package body material | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DIP | QCCJ | DIP | DIP |
| Encapsulate equivalent code | DIP24,.3 | DIP24,.3 | LDCC28,.5SQ | DIP24,.3 | DIP24,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| Programmable logic type | UV PLD | OT PLD | OT PLD | OT PLD | UV PLD |
| propagation delay | 30 ns | 30 ns | 30 ns | 25 ns | 25 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.72 mm | 4.32 mm | 4.57 mm | 4.32 mm | 5.72 mm |
| Maximum supply voltage | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| Minimum supply voltage | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | QUAD | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.62 mm | 7.62 mm | 11.5062 mm | 7.62 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | - | - |