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345874-4

Description
SOCKET, DIP14, IC SOCKET
CategoryThe connector    socket   
File Size106KB,1 Pages
ManufacturerTE Connectivity
Websitehttp://www.te.com
Download Datasheet Parametric View All

345874-4 Overview

SOCKET, DIP14, IC SOCKET

345874-4 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTE Connectivity
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresULTRA-LOW PROFILE
Contact to complete cooperationGOLD (30)
Contact completed and terminatedTIN LEAD OVER NICKEL
Contact materialBERYLLIUM COPPER
Device slot typeIC SOCKET
Type of equipment usedDIP14
JESD-609 codee0
Manufacturer's serial number345874
Number of contacts14
Base Number Matches1
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345874-4 Product Details
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DIP Sockets
Always ELV C om plia nt
(
Sta te m e nt of C om plia nce
)
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345874-4
T E I nternal N umber: 3 4 5 8 7 4 - 4
Product Highlights:
l
DIP Socket
l
Number of Positions = 14
l
Row-to-Row Spacing = 7.62 mm
l
Through Hole C ontact Termination Type
l
Mount Style = Vertical
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Obsolete
C ontact Product Information
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Documentation & Additional Information
Product Drawings:
l
None Available
Catalog Pages/Data Sheets:
l
None Available
Product Specifications:
l
None Available
Application Specifications:
l
None Available
Instruction Sheets:
l
None Available
CAD Files:
l
None Available
Additional Information:
l
Product Line Information
Related Products:
l
Tooling
Product Features
(Please use the Product Drawing for all design activity)
Product Type Features:
l
Product Type
= DIP Socket
l
Number of Positions
= 14
l
Profile
= Ultra-low
l
Frame Style
= Open
l
Leg Style
= Straight
Electrical Characteristics:
l
Insulation Resistance (M?) = 10,000
l
C ontact Resistance (m?) = 30
Termination Related Features:
l
Termination Post Length (mm [in])
= 2.40 [0.094]
l
Solder Tail C ontact Plating = Tin-Lead over Nickel
Body Related Features:
l
Row-to-Row Spacing (mm [in])
= 7.62 [0.300]
l
Mount Style
= Vertical
l
C enterline (mm [in])
= 2.54 [0.100]
Contact Related Features:
l
C ontact Termination Type
= Through Hole
l
C ontact Base Material
= Beryllium C opper
l
C ontact Mating Area Plating Material
= Gold (30)
l
C ontact Style
= Screw Machine
l
Mating C ontact Type
= Inner Spring
Configuration Related Features:
l
Height Above PC Board (mm [in])
= 1.80 [0.071]
Industry Standards:
l
RoHS/ELV C ompliance
= ELV compliant
l
Lead Free Solder Processes
= Not reviewed for lead free solder
process
l
RoHS/ELV C ompliance History = Always was ELV compliant
Conditions for Usage:
l
Temperature Range (?C ) = 105
Packaging Related Features:
l
Packaging Method
= Tube
Other:
l
Brand = AMP
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2009 Tyco Electronics C orporation All Rights Reserved
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Index Files: 879  2490  488  210  1377  18  51  10  5  28 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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