Operating Temperature Range ......................... -40°C to +125°C
Storage Temperature Range ............................ -65°C to +150°C
Lead Temperature (soldering, 10s) ................................. +300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Electrical Characteristics
PARAMETER
Operating Voltage Range
V
CC
Supply Current
(V
CC
= full range, T
A
= -40°C to +125°C, unless otherwise specified. Typical values are at T
A
= +25°C.) (Note 1)
SYMBOL
V
CC
I
CC
CONDITIONS
V
CC
= 5.5V, no load
V
CC
= 2.5V, no load
V
CC
= 1.8V, no load
V
CC
Reset Threshold
(See Reset Thresholds table)
Reset Threshold Tempco
V
CC
to Reset Delay
V
TH
ΔV
TH
/°C
V
CC
falling at 10mV/µs from V
TH
+ 100mV
to V
TH
- 100mV
D1
D2
Reset Timeout Period
MAX6381–MAX6389
(See Reset Timeout table)
D3
t
RP
D5
D6
D4
D7
Reset Timeout Period
MAX6390
MR
timeout period
t
RP
V
CC
timeout period
D4
D7
D4
D7
1
20
140
280
560
1120
1200
140
150
1120
1200
T
A
= +25°C
T
A
= -40°C to +125°C
V
TH
-
1.5%
V
TH
-
2.5%
V
CC
= 3.6V, no load
MIN
1.0
7
6
4
3
V
TH
V
TH
60
35
2
40
280
560
1120
2240
2400
280
300
2240
2400
0.3 x
V
CC
0.7 x
V
CC
0.8
2.4
V
ms
ms
TYP
MAX
5.5
13
11
7
6
V
TH
+
1.5%
V
TH
+
2.5%
V
ppm/°C
µs
µA
UNITS
V
V
IL
MR
Input Voltage
V
IH
V
IH
V
IL
V
TH
< 4V
V
TH
> 4V
www.maximintegrated.com
Maxim Integrated │ 2
MAX6381–MAX6390
SC70/μDFN, Single/Dual Low-Voltage,
Low-Power μP Reset Circuits
Electrical Characteristics (continued)
PARAMETER
MR
Minimum Input Pulse Width
MR
Glitch Rejection
MR
to Reset Delay
MR
Internal Pullup Resistance
RESET IN Input Threshold
RESET IN to RESET Delay
RESET IN Input Leakage Current
Open-Drain
RESET
Output
Voltage
Open-Drain
RESET
Output
Leakage Current
I
RESET IN
V
OL
I
LKG
V
OL
Push-Pull
RESET
Output Voltage
V
OH
V
THRST
SYMBOL
(V
CC
= full range, T
A
= -40°C to +125°C, unless otherwise specified. Typical values are at T
A
= +25°C.) (Note 1)
CONDITIONS
MIN
1
100
200
MAX6381–MAX6389
MAX6390
T
A
= +25°C
T
A
= 0°C to +85°C
32
500
1.245
1.232
1.219
4.5
-50
V
CC
≥ 4.5V, I
SINK
= 3.2mA, reset asserted
V
CC
≥ 1.0V, I
SINK
= 80µA, reset asserted
V
CC
> V
TH
,
RESET
not asserted
V
CC
≥ 4.5V, I
SINK
= 3.2mA, reset asserted
V
CC
≥ 1.0V, I
SINK
= 80µA, reset asserted
V
CC
≥ 4.5V, I
SOURCE
= 800µA, reset not
asserted
V
CC
≥ 2.5V, I
SOURCE
= 500µA, reset not
asserted
V
CC
≥ 4.5V, I
SOURCE
= 800µA, reset
asserted
V
CC
≥ 2.5V, I
SOURCE
= 500µA, reset
asserted
V
CC
≥ 1.8V, I
SOURCE
= 150µA, reset
asserted
V
CC
≥ 1.0V, I
SOURCE
= 1µA, reset asserted
V
CC
≥ 4.5V, I
SINK
= 3.2mA, reset not
asserted
V
CC
≥ 2.5V, I
SINK
= 1.2mA, reset not
asserted
V
CC
≥ 2.5V, I
SINK
= 1.2mA, reset asserted
0.8 x
V
CC
0.8 x
V
CC
0.8 x
V
CC
0.8 x
V
CC
0.8 x
V
CC
0.8 x
V
CC
0.4
0.3
V
V
CC
≥ 2.5V, I
SINK
= 1.2mA, reset asserted
±1
+50
0.4
0.3
0.3
1.0
0.4
0.3
0.3
V
µA
V
63
1560
1.27
100
3000
1.295
1.308
1.321
µs
nA
V
TYP
MAX
UNITS
µs
ns
ns
kΩ
Ω
T
A
= -40°C to +125°C
V
RESETIN
falling at 4mV/µs from
V
THRST
+ 40mV to V
THRST
- 40mV
V
OH
Push-Pull RESET Output Voltage
V
OL
Note 1:
Specifications over temperature are guaranteed by design, not production tested.
www.maximintegrated.com
Maxim Integrated │ 3
MAX6381–MAX6390
SC70/μDFN, Single/Dual Low-Voltage,
Low-Power μP Reset Circuits
Typical Operating Characteristics
SUPPLY CURRENT vs. TEMPERATURE
(NO LOAD)
MAX6381/90 toc01
MAX6381/90 toc02
SUPPLY CURRENT (µA)
7
6
5
4
3
2
1
0
V
CC
= +2.5V
V
CC
= +5.5V
POWER-DOWN RESET DELAY (µs)
8
V
CC
= +3.6V
41
39
37
35
33
31
29
27
25
V
CC
= +3V
NORMALIZED RESET TIMEOUT PERIOD
1.06
1.04
1.02
1.00
0.98
0.96
0.94
V
CC
= +1.8V
V
CC
= +1.8V
-40 -25 -10 5 20 35 50 65 80 95 110 125
TEMPERATURE (°C)
-40 -25 -10 5 20 35 50 65 80 95 110 125
TEMPERATURE (°C)
-40 -25 -10 5 20 35 50 65 80 95 110 125
TEMPERATURE (°C)
NORMALIZED RESET THRESHOLD
vs. TEMPERATURE
MAX6381/90 toc04
OUTPUT-VOLTAGE LOW
vs. SINK CURRENT
MAX6381/90 toc05
OUTPUT-VOLTAGE HIGH
vs. SOURCE CURRENT
V
CC
= +2.5V
MAX6381/90 toc06
1.020
NORMALIZED RESET THRESHOLD
1.015
1.010
1.005
1.000
0.995
0.990
0.985
1.2
1.0
0.8
0.6
0.4
0.2
0
V
CC
= +4.5V
3.0
2.5
2.0
V
OH
(V)
1.5
1.0
0.5
0
V
CC
= +1.8V
V
OL
(V)
V
CC
= +3.0V
0.990
-40 -25 -10 5 20 35 50 65 80 95 110 125
TEMPERATURE (°C)
0
3
6
I
SINK
(mA)
9
12
0
250
500
750
1000
1250
1500
I
SOURCE
(µA)
MAXIMUM TRANSIENT DURATION (µs)
450
400
350
300
250
200
150
100
50
0
1
10
100
RESET ASSERTED
ABOVE THIS LINE
MAX6381/90 toc07
5.3
5.1
RESET IN DELAY (µs)
4.9
4.7
4.5
4.3
4.1
3.9
3.7
3.5
1000
-40 -25 -10 5 20 35 50 65 80 95 110 125
TEMPERATURE (°C)
RESET COMPARATOR OVERDRIVE, V
TH
- V
CC
(mV)
www.maximintegrated.com
Maxim Integrated │ 4
MAX6381/90 toc08
500
MAXIMUM TRANSIENT DURATION
vs. RESET COMPARATOR OVERDRIVE
5.5
RESET IN TO RESET DELAY
vs. TEMPERATURE
MAX6381/90 toc03
9
43
POWER-DOWN RESET DELAY
vs. TEMPERATURE
1.08
NORMALIZED POWER-UP RESET TIMEOUT
vs. TEMPERATURE
MAX6381–MAX6390
SC70/μDFN, Single/Dual Low-Voltage,
Low-Power μP Reset Circuits
Pin Description
PIN
3-PIN SC70
µDFN
MAX6384/
MAX6381/
MAX6382 MAX6386/
MAX6383
MAX6390
4-PIN SC70
MAX6387/
MAX6385
MAX6388
MAX689
NAME
FUNCTION
1
(MAX6382/
MAX6385/
MAX6388)
2
—
2
—
2
RESET
Active-High Push-Pull Reset Output. RESET
changes from low to high when any monitored
voltage (V
CC
or VRESETIN) drops below the
reset threshold or
MR
is pulled low. RESET
remains high for the reset timeout period
after monitored voltages exceed the reset
thresholds or
MR
is released.
Active-Low Open-Drain/Push-Pull Reset Output.
RESET
changes from high to low when any
monitored voltage (V
CC
or VRESETIN) drops
below the reset threshold or
MR
is pulled low.
RESET
remains low for the reset timeout
period after the monitored voltages exceed the
reset thresholds or
MR
is released. Open-drain
requires an external pullup resistor.
1
(MAX6381/
MAX6383/
MAX6384/
MAX6386/
MAX6387/
MAX6390)
2, 3, 5
(MAX6381/
MAX6382/
MAX6383)
2, 5
(MAX6384–
MAX6390)
3
(MAX6384/
MAX6385/
MAX6386/
MAX6390)
2
—
2
—
2
—
RESET
—
—
—
—
—
—
N.C.
No Connection. Not Internally connected.
—
—
3
3
—
—
MR
Active-Low Manual Reset Input. Drive low to
force a reset. Reset remains active as long as
MR
is low and for the reset timeout period after
MR
is released. Leave unconnected or connect
to V
CC
if unused.
MR
has an internal 63kΩ
(1.56kΩ for MAX6390) pullup resistor to V
CC
.
Auxiliary Reset Input. High-impedance input to
the auxiliary reset comparator. Connect RESET
IN to the center point of an external resistor
voltage-divider network to set the reset threshold
Hehe, two very delicate small boards, share with you. It's very simple, just a board.The production date is very new, July 2014. It should be a new productThe event page says that the expenses can be ...
*********************************************************************************MSP430 CODE EXAMPLE DISCLAIMER** MSP430 code examples are self-contained low-level programs that typically* demonstrate...
Power supply is a must for every electronic design competition. As the power supply used in control competitions, because high-power components such as motors are used, it is recommended to use separa...
Network cameras are a new high-tech product. As they span the two previously unrelated industries of network and security, people who work in the network don't know much about monitoring, and people w...
The ACM32F070 development board and the touch function evaluation board can better realize human-computer interaction. The segment code LCD screen on the function board can display 2 lines of 4-bit da...
Hardware designers have begun to adopt FPGA technology in high-performance DSP designs because it can provide 10-100 times faster computing than PC-based or microcontroller-based solutions. Previou...[Details]
From the PIC16F946 datasheet, we know that there are two ways to write values to the LCD for display:
1. Directly write the value to LCDDATA1~LCDDATA23
2. Use disconnect t...[Details]
With the rapid development of wireless
digital communication
, more challenges have been raised for integrated circuit design and testing. In the product design stage, in order to ensure
t...[Details]
Analysis of the three core aspects of digital TV transmission standards
According to the differences in regionality, transmission method and modulation method, the transmission method needs to...[Details]
The launch of Shenzhou IX is imminent, and Tiangong is welcoming visitors again. Yesterday, Professor Fu Qiang, Vice President of the Institute of Science and Industrial Technology of Harbin Instit...[Details]
1 Introduction to LED
With the development of science and technology, people have higher and higher requirements on automobile light sources. LED (Light Emitting Diode) has gradually attracted...[Details]
1. Introduction
Modern modular machine tools are equipped with a large number of electronic devices to meet the requirements of processing accuracy, processing speed, etc. If the conventional ...[Details]
Synchronous buck designs are becoming increasingly difficult, and the selection of suitable ICs is becoming quite narrow. This Design Idea combines a current-mode PWM IC used in a flyback regulator...[Details]
Traditionally, when using PLC to control stepper motors, a dedicated stepper motor control intelligent module is usually added to the PLC, and then connected to the drive power supply to realize th...[Details]
Today, as information becomes an increasingly important resource, strong market demand and the development of microelectronics technology have led to the rapid development of portable electronic sy...[Details]
1. Introduction
With the continuous development of modern urban construction, infrastructure and real estate are becoming increasingly prosperous, and the quality requirements for construction ...[Details]
LED (Light-emitting diode) is widely used in indication, display and other fields due to its advantages such as long life and low energy consumption. Reliability, stability and high light output ar...[Details]
While we enjoy the great benefits of solid-state technology, the microelectronics at its core rely on clean electricity. Faster speeds and lower voltages mean higher demands on power quality. Power...[Details]
1. Project Introduction
Energy consumption is an important controllable part of the cost of enterprise products. Reducing energy consumption is an important way for enterprises to reduce costs...[Details]
Beijing time, July 2 morning news, Google last week released its own brand tablet computer Nexus 7, equipped with its latest operating system Android 4.1 "Jelly Bean". But market research firm Ovum sa...[Details]
Microchip MCU
京公网安备 11010802033920号
EEWORLD
