5962-8984103LA datasheet, PDF - EEWORLD Datasheet

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5962-8984103LA: DescriptionFlash PLD, 15ns, CMOS, CDIP24; CategoryProgrammable logic devices Programmable logic; File Size199KB，23 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com

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5962-8984103LA Overview

Flash PLD, 15ns, CMOS, CDIP24

5962-8984103LA Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP24,.3
Reach Compliance Code	compliant
ECCN code	3A001.A.2.C
Architecture	PAL-TYPE
maximum clock frequency	50 MHz
JESD-30 code	R-GDIP-T24
JESD-609 code	e0
length	32 mm
Dedicated input times	11
Number of I/O lines	10
Number of entries	22
Output times	10
Number of product terms	132
Number of terminals	24
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	11 DEDICATED INPUTS, 10 I/O
Output function	MACROCELL
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Programmable logic type	FLASH PLD
propagation delay	15 ns
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	5.08 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb) - hot dipped
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Base Number Matches	1

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REVISIONS

LTR

DESCRIPTION

Added K package. Added 04 device, two suppliers and 05 device,

one supplier. Added vendor CAGE 34335 for devices 01L, 013, and

02L. Editorial changes throughout. Added vendor CAGE 34335 for

devices 01K, 023, and 02K. Redrawn.

Added vendor CAGE 65786 for devices 01, 02, 03, 04, and 05LX,

KX, and 3X. Added vendor CAGE 18324 for devices 01, 02, 04, and

05LX. IAW NOR 5962-R079-93.

Added 06 device for one supplier. Added test t

SU2

to table I.

Editorial changes throughout. Redrawn.

Added devices 07-14, Added CAGE 1FN41 for devices 13 and 14,

added test I

CCSB

to table I for devices 13 and 14, and updated text to

newer boiler plate.

Changes in accordance with NOR 5962-R263-97

Changes in accordance with NOR 5962-R341-97

Added powerup-reset parameters to table I, and the waveform as

figure 5. Updated boilerplate. ksr

Changed minimum IOS value for devices 01 thru 06 on table I.

Value was changed from -50 mA to -30 mA. ksr

Updated boiler plate. ksr

Boilerplate update, part of 5 year review. ksr

Added devices 15 and 16. Updated Table I, added Figure 6 for

devices 15 and 16. ksr

DATE (YR-MO-DA)

91 – 04 – 19

APPROVED

M. A. Frye

93 – 01 – 28

M. A. Frye

93 – 07 – 30

97 – 03 – 04

M. A. Frye

Raymond Monnin

97 – 04 – 23

97 – 06 – 05

98 – 07 – 10

99 – 03 – 19

02 - 10 - 10

08 – 06 - 04

08 -08-25

Raymond Monnin

Robert M. Heber

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Kenneth Rice

CHECKED BY

Charles Reusing

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS

AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF

DEFENSE

AMSC N/A

http://www.dscc.dla.mil

APPROVED BY

Michael A. Frye

DRAWING APPROVAL DATE

89 – 11 – 28

REVISION LEVEL

MICROCIRCUIT, MEMORY, DIGITAL,

CMOS, PROGRAMMABLE ARRAY

LOGIC (EEPLD), MONOLITHIC

SILICON

SIZE

CAGE CODE

SHEET

67268

1 OF 19

5962-89841

5962-E482-08

DSCC FORM 2233

APR 97

1.4 Recommended operating conditions.

Supply voltage range (V

)----------------------------------------

High level input voltage (V

)--------------------------------------

Low level input voltage (V

) --------------------------------------

High level output current (I

) ------------------------------------

Low level output current (I

) -------------------------------------

Case operating temperature range (T

) -----------------------

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form

a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those

cited in the solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 -

MIL-STD-1835 -

Test Method Standard Microcircuits.

Interface Standard Electronic Component Case Outlines.

4.5 V dc to 5.5 V dc

2.0 V dc to V

+1.0 V dc

-0.5 V dc to +0.8 V dc

-2.0 mA maximum

12 mA maximum

-55°C to +125°C

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 -

MIL-HDBK-780 -

List of Standard Microcircuit Drawings.

Standard Microcircuit Drawings.

(Copies of these documents are available online at

http://assist.daps.dla.mil/quicksearch/

or from the Standardization

Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein,

the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and

regulations unless a specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for

non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified

Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional

certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved

program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the

Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect

form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A "Q" or "QML"

certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as

specified in MIL-PRF-38535, appendix A and herein.

3.2.1. Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.2 Truth table. The truth table shall be as specified on figure 2.

3.2.2.1 Unprogrammed devices. The truth table for unprogrammed devices shall be as specified on figure 2.

3.2.2.2 Programmed devices. The truth table for programmed devices shall be as specified by an attached altered item

drawing.

3.2.3 Case outlines The case outlines shall be in accordance with 1.2.2 herein.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

SHEET

5962-89841

5962-8984103LA Related Products

	5962-8984103LA	5962-89841033A	5962-89841053A	5962-8984105LA
Description	Flash PLD, 15ns, CMOS, CDIP24	EE PLD, 15ns, CMOS, CQCC28	OT PLD, 10ns, CMOS, CQCC28	Flash PLD, 10ns, CMOS, CDIP24
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP24,.3	QCCN, LCC28,.45SQ	CERAMIC, LCC-28	0.300 INCH, CERDIP-24
Reach Compliance Code	compliant	compliant	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Architecture	PAL-TYPE	PAL-TYPE	PAL-TYPE	PAL-TYPE
maximum clock frequency	50 MHz	50 MHz	83 MHz	83 MHz
JESD-30 code	R-GDIP-T24	S-CQCC-N28	S-CQCC-N28	R-GDIP-T24
JESD-609 code	e0	e0	e0	e0
Dedicated input times	11	11	11	11
Number of I/O lines	10	10	10	10
Number of entries	22	22	22	22
Output times	10	10	10	10
Number of product terms	132	132	132	132
Number of terminals	24	28	28	24
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C
organize	11 DEDICATED INPUTS, 10 I/O	11 DEDICATED INPUTS, 10 I/O	11 DEDICATED INPUTS, 10 I/O	11 DEDICATED INPUTS, 10 I/O
Output function	MACROCELL	MACROCELL	MACROCELL	MACROCELL
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	QCCN	QCCN	DIP
Encapsulate equivalent code	DIP24,.3	LCC28,.45SQ	LCC28,.45SQ	DIP24,.3
Package shape	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V
Programmable logic type	FLASH PLD	EE PLD	OT PLD	FLASH PLD
propagation delay	15 ns	15 ns	10 ns	10 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	MIL-STD-883	MIL-STD-883	38535Q/M;38534H;883B	38535Q/M;38534H;883B
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb) - hot dipped	Tin/Lead (Sn/Pb) - hot dipped	TIN LEAD	Tin/Lead (Sn/Pb) - hot dipped
Terminal form	THROUGH-HOLE	NO LEAD	NO LEAD	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	QUAD	QUAD	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Base Number Matches	1	1	1	1
length	32 mm	-	11.45 mm	32 mm
Maximum seat height	5.08 mm	-	2.54 mm	5.08 mm
width	7.62 mm	-	11.45 mm	7.62 mm

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