MCM4064P datasheet, PDF - EEWORLD Datasheet

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MCM4064P: DescriptionIC,SRAM,16X4,TTL,DIP,16PIN,PLASTIC; Categorystorage storage; File Size3MB，44 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MCM4064P Overview

IC,SRAM,16X4,TTL,DIP,16PIN,PLASTIC

MCM4064P Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
Maximum access time	60 ns
JESD-30 code	R-PDIP-T16
JESD-609 code	e0
Memory IC Type	STANDARD SRAM
memory width	4
Number of terminals	16
word count	16 words
character code	16
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature
organize	16X4
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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MCM4064P Related Products

	MCM4064P	MC4002P	MC4064P	MC4038P	MC4350L	MC4362F
Description	IC,SRAM,16X4,TTL,DIP,16PIN,PLASTIC	IC,DECODER/DEMUX,1-2/2-4-LINE,TTL,DIP,PLASTIC	IC,SRAM,16X4,TTL,DIP,16PIN,PLASTIC	IC,DECODER/DEMUX,3-TO-8-LINE,TTL,DIP,16PIN,PLASTIC	IC,DISPLAY COUNTER,TTL,DIP,16PIN,CERAMIC	IC,LOGIC GATE,2 3-IN MAJ LOGIC,TTL,FP,14PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	NXP	NXP	NXP	NXP	NXP	NXP
package instruction	DIP, DIP16,.3	DIP, DIP(UNSPEC)	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DFP, FL14,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknow
JESD-609 code	e0	e0	e0	e0	e0	e0
Maximum operating temperature	85 °C	70 °C	70 °C	70 °C	125 °C	125 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP	DFP
Encapsulate equivalent code	DIP16,.3	DIP(UNSPEC)	DIP16,.3	DIP16,.3	DIP16,.3	FL14,.3
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	FLATPACK
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	NO	NO	YES
technology	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	OTHER	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	FLAT
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
JESD-30 code	R-PDIP-T16	-	R-PDIP-T16	R-PDIP-T16	R-XDIP-T16	R-XDFP-F14
Number of terminals	16	-	16	16	16	14
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Terminal pitch	2.54 mm	-	2.54 mm	2.54 mm	2.54 mm	1.27 mm
Base Number Matches	1	1	1	1	-	-
Logic integrated circuit type	-	OTHER DECODER/DRIVER	-	OTHER DECODER/DRIVER	DISPLAY DRIVER COUNTER	MAJORITY LOGIC GATE

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