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IRLR8726TRL

Description
Power Field-Effect Transistor, 86A I(D), 30V, 0.058ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252AA, DPAK, 3 PIN
CategoryDiscrete semiconductor    The transistor   
File Size354KB,11 Pages
ManufacturerInfineon
Websitehttp://www.infineon.com/
Download Datasheet Parametric View All

IRLR8726TRL Overview

Power Field-Effect Transistor, 86A I(D), 30V, 0.058ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252AA, DPAK, 3 PIN

IRLR8726TRL Parametric

Parameter NameAttribute value
package instructionDPAK, 3 PIN
Reach Compliance Codecompliant
ECCN codeEAR99
Avalanche Energy Efficiency Rating (Eas)120 mJ
Shell connectionDRAIN
ConfigurationSINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage30 V
Maximum drain current (ID)86 A
Maximum drain-source on-resistance0.058 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JEDEC-95 codeTO-252AA
JESD-30 codeR-PSSO-G2
Number of components1
Number of terminals2
Operating modeENHANCEMENT MODE
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Polarity/channel typeN-CHANNEL
Maximum pulsed drain current (IDM)340 A
Certification statusNot Qualified
surface mountYES
Terminal formGULL WING
Terminal locationSINGLE
transistor applicationsSWITCHING
Transistor component materialsSILICON
Base Number Matches1
PD - 97146A
IRLR8726PbF
IRLU8726PbF
HEXFET
®
Power MOSFET
Applications
l
High Frequency Synchronous Buck
V
DSS
R
DS(on)
max
Qg (typ.)
Converters for Computer Processor Power
30V 5.8m @V
GS
= 10V 15nC
l
High Frequency Isolated DC-DC
Converters with Synchronous Rectification
D
D
for Telecom and Industrial Use
:
Benefits
l
Very Low R
DS(on)
at 4.5V V
GS
l
Ultra-Low Gate Impedance
l
Fully Characterized Avalanche Voltage
and Current
l
Lead-Free
l
RoHS compliant
G
D
S
G
D
S
D-Pak
IRLR8726PbF
G
D
I-Pak
IRLU8726PbF
S
Gate
Drain
Max.
30
± 20
86
Source
Units
V
Absolute Maximum Ratings
Parameter
V
DS
V
GS
I
D
@ T
C
= 25°C
I
D
@ T
C
= 100°C
I
DM
P
D
@T
C
= 25°C
P
D
@T
C
= 100°C
T
J
T
STG
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
h
Maximum Power Dissipation
h
Maximum Power Dissipation
Linear Derating Factor
Operating Junction and
Storage Temperature Range
™
f
61
f
340
75
38
A
W
W/°C
°C
0.5
-55 to + 175
300 (1.6mm from case)
Soldering Temperature, for 10 seconds
Thermal Resistance
Parameter
R
θJC
R
θJA
R
θJA
Junction-to-Case
h
Typ.
Max.
2.0
50
110
Units
°C/W
Junction-to-Ambient (PCB Mount)
Junction-to-Ambient
h
ghÃ
–––
–––
–––
Notes

through
†
are on page 11
ORDERING INFORMATION:
See detailed ordering and shipping information on the last page of this data sheet.
www.irf.com
1
11/23/09

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