1.4KESD90CE3TR datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> diode> 1.4KESD90CE3TR

1.4KESD90CE3TR: DescriptionTrans Voltage Suppressor Diode, 1400W, 90V V(RWM), Bidirectional, 1 Element, Silicon, DO-204AH, ROHS COMPLIANT, HERMETIC SELAD, GLASS, DO-35, 2 PIN; CategoryDiscrete semiconductor diode; File Size173KB，4 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com; Environmental Compliance

Download Datasheet Parametric View All

1.4KESD90CE3TR Overview

Trans Voltage Suppressor Diode, 1400W, 90V V(RWM), Bidirectional, 1 Element, Silicon, DO-204AH, ROHS COMPLIANT, HERMETIC SELAD, GLASS, DO-35, 2 PIN

1.4KESD90CE3TR Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Parts packaging code	DO-35
package instruction	O-LALF-W2
Contacts	2
Reach Compliance Code	unknow
ECCN code	EAR99
Other features	LOW CAPACITANCE
Minimum breakdown voltage	100 V
Shell connection	ISOLATED
Configuration	SINGLE
Diode component materials	SILICON
Diode type	TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95 code	DO-204AH
JESD-30 code	O-LALF-W2
JESD-609 code	e3
Maximum non-repetitive peak reverse power dissipation	1400 W
Number of components	1
Number of terminals	2
Package body material	GLASS
Package shape	ROUND
Package form	LONG FORM
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
polarity	BIDIRECTIONAL
Maximum power dissipation	0.5 W
Certification status	Not Qualified
Maximum repetitive peak reverse voltage	90 V
surface mount	NO
technology	AVALANCHE
Terminal surface	MATTE TIN
Terminal form	WIRE
Terminal location	AXIAL
Maximum time at peak reflow temperature	NOT SPECIFIED
Base Number Matches	1

Preview

Download Datasheet

View All

1.4KESD5.0 thru 1.4KESD170CA, e3

AXIAL-LEAD TVS

SCOTTSDALE DIVISION

DESCRIPTION

These small axial-leaded TVS devices feature the ability to clamp

dangerous high voltage short-term transients such as produced by directed

or radiated electrostatic discharge phenomena before entering sensitive

component regions of a circuit design. They are small economical transient

voltage suppressors targeted primarily for short-term transients below a few

microseconds while still achieving significant peak-pulse-power capability

as illustrated in Figure #1.

APPEARANCE

WWW .

Microsemi

DO-35

(DO-204AH)

IMPORTANT:

For the most current data, consult

MICROSEMI’s

website:

http://www.microsemi.com

FEATURES

•

Excellent protection in clamping direct ESD level

transients in excess of 15,000 V per MIL-STD-750,

Method 1020 (approx. 150 ns exponential wave)

•

Absorbs ESD level transients* of 1400 Watts per MIL-

STD-750, Method 1020 (approx. 150 ns exponential

wave, or one microsecond transients up to 400 watts.

See Figure #1 and #2 for overall transient Peak Pulse

Power.

•

Clamps Transients in less than 100 picoseconds

•

Working Stand-off Voltage range of 5 V to 170 V

•

Hermetic DO-35 Package. Also available in surface

mount DO-213AA MELF package (see separate data

sheet)

•

RoHS Compliant devices available by adding “e3” suffix

APPLICATIONS / BENEFITS

•

Protects Sensitive circuits from short duration fast

rise time transients such as Electrostatic Discharge

(ESD) or Electrical Fast Transients (EFT)

•

Low inherent capacitance for high-frequency

applications (See Figure #4)

•

Flexible axial-lead mounting terminals

•

Bidirectional features available by adding a “C” or

“CA” suffix

MAXIMUM RATINGS

•

400 Watts for One Microsecond Square Wave or

1400 watts per ESD Wave form of MIL-STD-750,

method 1020.

•

See Surge Rating curve in Figures #1 and 2.

•

Operating and storage temperature –65 C to 175 C

•

THERMAL RESISTANCE: Less than 250

C/W

junction to lead at 0.375 inches from body.

•

DC power dissipation 500 mW at T

= 75

C at 3/8

inch (10 mm) lead length from body.

•

Derate at 2.3 W/

C above 25

C for P

(1μs) and at

5 mW/ C above 100 C for dc power.

•

Forward Surge Current 50 amps for 1μs at T

= 25 C

(rise time > 100 ns).

MECHANICAL AND PACKAGING

•

CASE: Hermetically sealed axial-lead glass DO-35

(DO-204AH) package

•

FINISH: Tin-lead or RoHS Compliant matte-Tin

plating solderable per MIL-STD-750, method 2026

•

POLARITY: Banded end is cathode

•

WEIGHT: 0.2 grams (typical)

•

MARKING: Part number

•

TAPE & REEL option: Standard per EIA-296 (add

“TR” suffix to part number)

•

See package dimension on last page

1.4KESD5.0 thru

1.4KESD170A, e3

2006

3-29-2006 REV B

Microsemi

Scottsdale Division

8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503

Page 1

Recommended Resources

Electromechanical control winding to electronic motor rotor string resistance starting control circuit

Light control delay warm wall light circuit

sound generator circuit

High output voltage integrated regulated power supply composed of CW137

Computer motherboard circuit diagram 820 2_16

Does anyone have a SLR camera? Help: I want to buy a lens. Of course, I don't use a SLR. The shooting distance is about 100-200 meters. The shooting area is 1m*1m, so the angle is very small. The focal length should be relatively large. ...; 247153481 Embedded System

Today, People's Daily pushes information from the Ministry of Industry and Information Technology: According to the Ministry of Industry and Information Technology, there are currently 113,000 5G base stations in operation across the country, and 870,000 users have signed up for 5G packages....; btty038 RF/Wirelessly

Power Tip 17: Buffered Flyback Converter: Previously, we looked at how to buffer the voltage across the output rectifier of a forward converter during its on-time. Now let’s look at how to buffer the FET turn-off voltage of a flyback converte...; 德州仪器 Analog electronics

Does anyone have the Windows CE driver or related technical information for EPSON LQ300?: Does anyone have the windows ce.net driver or related technical information for EPSON LQ300? Thank you very much...; tjj104923185 Embedded System

A preliminary discussion on the application of CAN bus: The structure and function of the high-frequency quenching manipulator device and the hardware structure and software structure of the manipulator distributed control system based on the CAN bus are b...; frozenviolet Automotive Electronics

RK3399 development board Android image burning Windows system image burning: 4.1.1 l RKTool driver installation (based on Xunwei iTOP-3399 development board) DriverAssitant_v4.5.zip file, openand the driver is successfully installed, as shown below: Notes:1. Currently supporte...; 塔7呃 Embedded System

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components