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MSP1N6384E3TR

Description
Trans Voltage Suppressor Diode, 1500W, 12V V(RWM), Bidirectional, 1 Element, Silicon, PLASTIC, CASE 1, 2 PIN
CategoryDiscrete semiconductor    diode   
File Size279KB,3 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Environmental Compliance
Download Datasheet Parametric View All

MSP1N6384E3TR Overview

Trans Voltage Suppressor Diode, 1500W, 12V V(RWM), Bidirectional, 1 Element, Silicon, PLASTIC, CASE 1, 2 PIN

MSP1N6384E3TR Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
package instructionO-PALF-W2
Contacts2
Manufacturer packaging codeCASE 1
Reach Compliance Codeunknow
ECCN codeEAR99
Minimum breakdown voltage14.1 V
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 codeO-PALF-W2
JESD-609 codee3
Maximum non-repetitive peak reverse power dissipation1500 W
Number of components1
Number of terminals2
Package body materialPLASTIC/EPOXY
Package shapeROUND
Package formLONG FORM
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityBIDIRECTIONAL
Maximum power dissipation1.52 W
Certification statusNot Qualified
Maximum repetitive peak reverse voltage12 V
surface mountNO
technologyAVALANCHE
Terminal surfaceMATTE TIN
Terminal formWIRE
Terminal locationAXIAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1
1N6373 thru 1N6389, e3
or MPTE-5 thru MPTE-45C, e3
SCOTTSDALE DIVISION
1500 WATT LOW CLAMPING FACTOR
TRANSIENT VOLTAGE SUPPRESSOR
DESCRIPTION
This Transient Voltage Suppressor (TVS) series for 1N6373 thru 1N6389
are JEDEC registered selections for both unidirectional and bidirectional
devices. The 1N6373 thru 1N6381 are unidirectional and the 1N6382 thru
1N6389 are bi-directional where they all provide a very low specified
clamping factor for minimal clamping voltages (V
C
) above their respective
breakdown voltages (V
BR
) as specified herein. They are most often used
in protecting sensitive components from inductive switching transients or
induced secondary lightning effects as found in lower surge levels of
IEC61000-4-5 . They are also very successful in protecting airborne
avionics and electrical systems. Since their response time is virtually
instantaneous, they can also protect from ESD and EFT per IEC61000-4-2
and IEC61000-4-4.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
CASE 1
FEATURES
Unidirectional and bidirectional TVS series for thru-hole
mounting
Suppresses transients up to 1500 watts @ 10/1000 µs
t
clamping
(0 volts to V
(BR)
min):
Unidirectional – Less than 100 pico seconds.
Bidirectional – Less than 5 nano seconds.
Working voltage (V
WM
) range 5 V to 45 V
Low clamping factor (ratio of actual V
C
/V
BR
): 1.33 @ full
rated power and 1.20 @ 50% rated power
Economical plastic encapsulated TVS for thru-hole mount
Options for screening in accordance with MIL-PRF-19500
for JAN, JANTX, JANTXV, and JANS are also available
by adding MQ, MX, MV, MSP prefixes respectively to
part numbers, e.g. MX1N6373, etc.
Surface mount equivalent packages also available as
SMCJ6373 – SMCJ6389 (consult factory for other
surface mount options)
RoHS Compliant devices available by adding “e3” suffix
Metal package axial-leaded equivalents available in the
1N6373 – 1N6389 series (see separate data sheet)
APPLICATIONS / BENEFITS
Designed to protect Bipolar and MOS
Microprocessor based systems.
Protection from switching transients and induced RF
ESD & EFT protection per IEC 61000-4-2 and -4-4
Secondary lightning protection per IEC61000-4-5
with 42 Ohms source impedance:
Class 1, 2 & 3 1N6356 to 1N6372
Class 4: 1N6356 to 1N6362
Secondary lightning protection per IEC61000-4-5
with 12 Ohms source impedance:
Class 1 & 2: 1N6356 to 1N6372
Class 3: 1N6356 to 1N6362
Class 4: 1N6356 to 1N6358
Secondary lightning protection per IEC61000-4-5
with 2 Ohms source impedance:
Class 2: 1N6356 to 1N6361
Class 3: 1N6356 to 1N6358
MAXIMUM RATINGS
1500 Watts for 10/1000
μs
with repetition rate of 0.01% or
less* at lead temperature (T
L
) 25
o
C (See Figs. 1, 2, & 4)
o
o
Operating & Storage Temperatures: -65 to +150 C
Thermal Resistance: 22
º
C/W junction to lead at 3/8 inch
(10 mm) from body, or 82
º
C/W junction to ambient when
2
mounted on FR4 PC board with 4 mm copper pads (1oz)
and track width 1 mm, length 25 mm
Steady-State Power dissipation*: 5 watts at T
L
< 40
o
C, or
1.52 watts at T
A
= 25
º
C when mounted on FR4 PC board
described for thermal resistance
Solder Temperatures: 260
o
C for 10 s (maximum)
MECHANICAL AND PACKAGING
CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
FINISH: Tin-Lead or RoHS Compliant annealed-
matte Tin plating solderable per MIL-STD-750
method 2026
POLARITY: Cathode indicated by band
MARKING: Part number and polarity diode symbol
WEIGHT: 1.5 grams. (Approx)
TAPE & REEL option: Standard per EIA-296 (add
“TR” suffix to part number)
See “CASE 1” package dimension on last page
1N6373 thru 1N6389, e3
MPTE-5 thru MPTE-45C, e3
TVS devices are not typically used for dc power dissipation and are instead operated at or less than their rated standoff voltage
(V
WM
) except for transients that briefly drive the device into avalanche breakdown (V
BR
to V
C
region).
Copyright
©
2006
3-31-2006 REVB
*
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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