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LTC4302-2

Description
Addressable 2-Wire Bus Buffers
File Size318KB,20 Pages
ManufacturerLinear ( ADI )
Websitehttp://www.analog.com/cn/index.html
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LTC4302-2 Overview

Addressable 2-Wire Bus Buffers

FEATURES
s
s
LTC4302-1/LTC4302-2
Addressable
2-Wire Bus Buffers
DESCRIPTIO
The LTC
®
4302-1/LTC4302-2 addressable I
2
C bus and
SMBus compatible bus buffers allow a peripheral board
to be inserted and removed from a live backplane without
corruption of the bus. The LTC4302-1/LTC4302-2 main-
tain electrical isolation between the backplane and periph-
eral board until their V
CC
supply is valid and a master
device on the backplane side addresses the LTC4302-1/
LTC4302-2 and commands them to connect. The
LTC4302-1/LTC4302-2’s ADDRESS pin provides 32 pos-
sible addresses set by an external resistive divider be-
tween V
CC
and GND. The LTC4302-1/LTC4302-2 work
with supply voltages ranging from 2.7V to 5.5V. The SDA
and SCL inputs and outputs do not load the bus lines when
V
CC
is low.
Rise time accelerator circuitry* allows for heavier capaci-
tive bus loading while still meeting system timing require-
ments. During insertion, the SDA and SCL lines are
precharged to 1V to minimize bus disturbances. Two
general purpose input/output pins (GPIOs) on the
LTC4302-1 can be configured as inputs, open-drain out-
puts or push-pull outputs. The LTC4302-2 option replaces
one GPIO pin with a second supply voltage pin V
CC2
,
providing level shifting between systems with different
supply voltages. The LTC4302-1/LTC4302-2 are available
in a 10-pin MSOP package.
s
s
s
s
s
s
s
s
Bidirectional Buffer for SDA and SCL Lines
Increases Fanout
Connect SDA and SCL Lines with 2-Wire Bus
Commands
Prevents SDA and SCL Corruption During Live Board
Insertion and Removal from Backplane
Compatible with I
2
C
TM
Standard Mode, I
2
C Fast
Mode and SMBus Standards
Rise Time Accelerators on SDA, SCL Lines
1V Precharge on SDA and SCL Lines
32 Unique Addresses from a Single ADDRESS Pin
Two General Purpose Inputs-Outputs (LTC4302-1)
Translates Between 5V and 3.3V Systems
(LTC4302-2)
Small 10-Pin MSOP Package
APPLICATIO S
s
s
s
s
s
Live Board Insertion
5V/3.3V Level Translator
Servers
Capacitance Buffer/Bus Extender
Nested Addressing
, LTC and LT are registered trademarks of Linear Technology Corporation.
I
2
C is a trademark of Philips Electronics N.V.
*U.S. Patent No. 6,650,174
TYPICAL APPLICATIO
2.7V
to
5.5V
R3
10k
R4
10k
R1
1870Ω
R2
2000Ω
V
CC
LTC4302-1
SDA
CARD SDA
SDAIN SDAOUT
SCL
CARD SCL
SCLOUT
SCLIN
CONN
ADDRESS GPIO2
GPIO1
GND
R5
10k
C1
0.01µF
R6
10k
R7
10k
R8
1k
R9
1k
OUTPUT
SIDE
50pF
LED
LED
4203 TA01a
U
U
U
Input-Output Connection t
PLH
INPUT
SIDE
150pF
0.1µs/DIV
4032 F10
sn430212 430212fs
1

LTC4302-2 Related Products

LTC4302-2 LTC4302CMS-2 LTC4302IMS-1 LTC4302IMS-2 LTC4302-1 LTC4302CMS-1
Description Addressable 2-Wire Bus Buffers Addressable 2-Wire Bus Buffers Addressable 2-Wire Bus Buffers Addressable 2-Wire Bus Buffers Addressable 2-Wire Bus Buffers Addressable 2-Wire Bus Buffers
Brand Name - Linear Technology Linear Technology Linear Technology - Linear Technology
Is it Rohs certified? - incompatible incompatible incompatible - incompatible
Maker - Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) - Linear ( ADI )
Parts packaging code - MSOP MSOP MSOP - MSOP
package instruction - TSSOP, TSSOP10,.19,20 TSSOP, TSSOP10,.19,20 TSSOP, TSSOP10,.19,20 - TSSOP, TSSOP10,.19,20
Contacts - 10 10 10 - 10
Manufacturer packaging code - MS MS MS - MS
Reach Compliance Code - not_compliant not_compliant not_compliant - not_compliant
ECCN code - EAR99 EAR99 EAR99 - EAR99
Interface integrated circuit type - INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT - INTERFACE CIRCUIT
JESD-30 code - S-PDSO-G10 S-PDSO-G10 S-PDSO-G10 - S-PDSO-G10
JESD-609 code - e0 e0 e0 - e0
length - 3 mm 3 mm 3 mm - 3 mm
Humidity sensitivity level - 1 1 1 - 1
Number of functions - 1 1 1 - 1
Number of terminals - 10 10 10 - 10
Maximum operating temperature - 70 °C 85 °C 85 °C - 70 °C
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code - TSSOP TSSOP TSSOP - TSSOP
Encapsulate equivalent code - TSSOP10,.19,20 TSSOP10,.19,20 TSSOP10,.19,20 - TSSOP10,.19,20
Package shape - SQUARE SQUARE SQUARE - SQUARE
Package form - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) - 235 235 235 - 235
power supply - 3/5 V 3/5 V 3/5 V - 3/5 V
Certification status - Not Qualified Not Qualified Not Qualified - Not Qualified
Maximum seat height - 1.1 mm 1.1 mm 1.1 mm - 1.1 mm
Maximum slew rate - 8 mA 8 mA 8 mA - 8 mA
Maximum supply voltage - 5.5 V 5.5 V 5.5 V - 5.5 V
Minimum supply voltage - 2.7 V 2.7 V 2.7 V - 2.7 V
surface mount - YES YES YES - YES
technology - CMOS CMOS CMOS - CMOS
Temperature level - COMMERCIAL INDUSTRIAL INDUSTRIAL - COMMERCIAL
Terminal surface - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb)
Terminal form - GULL WING GULL WING GULL WING - GULL WING
Terminal pitch - 0.5 mm 0.5 mm 0.5 mm - 0.5 mm
Terminal location - DUAL DUAL DUAL - DUAL
Maximum time at peak reflow temperature - 20 20 20 - 20
width - 3 mm 3 mm 3 mm - 3 mm

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