5962-9213203MXX datasheet, PDF

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5962-9213203MXX: DescriptionFast Page DRAM, 64KX4, 150ns, CMOS, CQCC18, CERAMIC, LCC-18; Categorystorage storage; File Size302KB，10 Pages; ManufacturerMicross; Websitehttps://www.micross.com

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5962-9213203MXX Overview

Fast Page DRAM, 64KX4, 150ns, CMOS, CQCC18, CERAMIC, LCC-18

5962-9213203MXX Parametric

Parameter Name	Attribute value
Maker	Micross
Parts packaging code	LCC
package instruction	QCCN,
Contacts	18
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FAST PAGE
Maximum access time	150 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 code	R-CQCC-N18
JESD-609 code	e0
memory density	262144 bit
Memory IC Type	FAST PAGE DRAM
memory width	4
Number of functions	1
Number of ports	1
Number of terminals	18
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	64KX4
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	NO LEAD
Terminal location	QUAD
Base Number Matches	1

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Description	Fast Page DRAM, 64KX4, 150ns, CMOS, CQCC18, CERAMIC, LCC-18	Fast Page DRAM, 64KX4, 100ns, CMOS, CQCC18, CERAMIC, LCC-18	Fast Page DRAM, 64KX4, 120ns, CMOS, CQCC18, CERAMIC, LCC-18	Fast Page DRAM, 64KX4, 100ns, CMOS, CQCC18, CERAMIC, LCC-18	Fast Page DRAM, 64KX4, 150ns, CMOS, CQCC18, CERAMIC, LCC-18	Fast Page DRAM, 64KX4, 150ns, CMOS, CDIP18, 0.400 INCH, CERAMIC, DIP-18	Fast Page DRAM, 64KX4, 120ns, CMOS, CDIP18	Fast Page DRAM, 64KX4, 100ns, CMOS, CDIP18, 0.400 INCH, CERAMIC, DIP-18
package instruction	QCCN,	QCCN,	CERAMIC, LCC-18	QCCN,	QCCN,	DIP,	DIP,	DIP,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE
Maximum access time	150 ns	100 ns	120 ns	100 ns	150 ns	150 ns	120 ns	100 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 code	R-CQCC-N18	R-CQCC-N18	R-CQCC-N18	R-CQCC-N18	R-CQCC-N18	R-CDIP-T18	R-CDIP-T18	R-CDIP-T18
memory density	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit
Memory IC Type	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM
memory width	4	4	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1
Number of terminals	18	18	18	18	18	18	18	18
word count	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000	64000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	64KX4	64KX4	64KX4	64KX4	64KX4	64KX4	64KX4	64KX4
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN	QCCN	QCCN	QCCN	QCCN	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	1	1	1	1
Maker	Micross	-	Micross	-	Micross	Micross	-	Micross
Parts packaging code	LCC	LCC	LCC	LCC	LCC	DIP	-	DIP
Contacts	18	18	18	18	18	18	-	18
JESD-609 code	e0	e0	e0	e0	e0	e0	-	e0
Filter level	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	-	MIL-STD-883
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	-	TIN LEAD

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