SURFACE MOUNT ZENER DIODES
GLZ-SERIES
RoHS Compliant Product
A suffix of "-C" specifies halogen-free
0.5W , ± 2%
SPEC.
GLZ2.0
GLZ2.2
GLZ2.4
GLZ2.7
GLZ3.0
GLZ3.3
GLZ3.6
GLZ3.9
GLZ4.3
GLZ4.7
GLZ5.1
GLZ5.6
GLZ6.2
GLZ6.8
GLZ7.5
GLZ8.2
GLZ9.1
CLASS
A
B
A
B
A
B
A
B
A
B
A
B
A
B
A
B
A
B
C
A
B
C
A
B
C
A
B
C
A
B
C
A
B
C
A
B
C
A
B
C
A
B
C
A
B
C
D
A
B
C
GLZ10
GLZ11
V
Z
(V)
MIN
MAX
1.880
2.100
2.020
2.200
2.120
2.300
2.220
2.410
2.330
2.520
2.430
2.630
2.540
2.750
2.690
2.910
2.850
3.070
3.010
3.220
3.160
3.380
3.320
3.530
3.455
3.695
3.600
3.845
3.740
4.010
3.890
4.160
4.040
4.290
4.170
4.430
4.300
4.570
4.440
4.680
4.550
4.800
4.680
4.930
4.810
5.070
4.940
5.200
5.090
5.370
5.280
5.550
5.450
5.730
5.610
5.910
5.780
6.090
5.960
6.270
6.120
6.440
6.290
6.630
6.490
6.830
6.660
7.010
6.850
7.220
7.070
7.450
7.290
7.670
7.530
7.920
7.780
8.190
8.030
8.450
8.290
8.730
8.570
9.010
8.830
9.300
9.120
9.590
9.410
9.900
9.700
10.200
9.940
10.440
10.180
10.710
10.500
11.050
10.820
11.380
I
Z
(mA)
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
V
R
(V)
0.5
0.7
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.5
2.5
3.0
3.5
4.0
5.0
6.0
I
R
(μ
A)
MAX
120
120
120
120
50
20
10
5
5
5
5
5
5
2
0.5
0.5
0.5
Izt
(mA)
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
Zzt (Ω)
MAX
140
120
100
100
80
70
60
50
40
25
20
13
10
8
8
8
8
Izk
(mA)
1
1
1
1
1
1
1
1
1
1
1
1
1
0.5
0.5
0.5
0.5
Zzk (Ω)
MAX
2000
2000
2000
1000
1000
1000
1000
1000
1000
900
800
500
300
150
120
120
120
20
7.0
0.2
20
8
0.5
120
20
8.0
0.2
10
10
0.5
120
* Mini Melf Molded Glass.
01-Jun-2002 Rev. A
Page 1 of
3
SURFACE MOUNT ZENER DIODES
GLZ-SERIES
Absolute Maximum Ratings
Symbol
Value
Unit
mW
o
C
o
C
Zener Current see Table "Characteristics"
Ptot
500*
Power Dissipation at Tamb=25
o
C
Junction Temperature
Tj
175
Storage Temperature Range
Ts
-65 to +175
*Valid provided that leads at a distance of 10mm from case are kept at ambient temperature
Cases:Mini Melf Molded Glass Glass
Characteristic at Tamb=25
o
C
Symbol
Min.
Typ.
Max.
Unit
K/mW
V
Thermal Resistance
RthA
-
-
0.3*
Junction to Ambient Air
Forward Voltage
V
F
-
-
1
at I
F
=100mA
*Valid provided that leads at a distance of 10mm from case are kept at ambient temperature
Breakdown Characteristics
GLZ-SERIES
mA
50
5
10
15
20
25
30
V
Iz
40
30
Test Current
Iz=20mA
20
10
0
Changes in the power dissipation
due to the ambient temperature
500
GLZ2.7
400
300
200
100
0
GLA6.8
GLA6.2
GLZ5.6
GLZ5.1
GLZ4.7
GLZ9.1
GLZ4.3
GLZ3.9
GLZ11
GLZ12
GLZ15
GLZ20
GLZ24
Vz
MINI MELF
pd(mW)
Power dissipation
1.6
0.5
3.7
50
100 150 200 250
O
Ta( C)
Ambient Temperature
Dimensions in mm
Page
3
of
3
01-Jun-2002 Rev. A
0.5
Microchip MCU
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