3DFN16G08VS2306CN datasheet, PDF

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3DFN16G08VS2306CN: DescriptionFlash, 2GX8, PDSO50, 0.50 MM PITCH, SOP-50; Categorystorage storage; File Size77KB，2 Pages; Manufacturer3D PLUS

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3DFN16G08VS2306CN Overview

Flash, 2GX8, PDSO50, 0.50 MM PITCH, SOP-50

3DFN16G08VS2306CN Parametric

Parameter Name	Attribute value
Maker	3D PLUS
package instruction	SSOP,
Reach Compliance Code	unknown
JESD-30 code	R-PDSO-G50
length	18.7 mm
memory density	17179869184 bit
Memory IC Type	FLASH
memory width	8
Number of functions	1
Number of terminals	50
word count	2147483648 words
character code	2000000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2GX8
Package body material	PLASTIC/EPOXY
encapsulated code	SSOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, SHRINK PITCH
Parallel/Serial	PARALLEL
Programming voltage	3.3 V
Maximum seat height	5.6 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
width	13.64 mm
Base Number Matches	1

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E M O R Y M O D U L E

F L A S H N a n d 2 G x 8 -S O P

F la s h M e m o r y

M O D U L E

3 D F N 1 6 G 0 8 V S 2 3 0 6

1 6 G b it F L A S H

N a n d o r g a n iz e d a s 2 G x 8 , b a s e d o n 1 G x 8

P in A s s ig n m e n t (T o p V ie w )

S O P 5 0 - ( P itc h : 0 .5 0 m m )

F e a tu re s

O r g a n iz a t io n

- M e m o r y C e ll A r r a y ( 1 G + 3 2 M ) b it x 8 b

A u to m a tic P r o g r a m a n d E r a s e .

- P a g e P ro g ra m : (4 K + 1 2 8 ) B y te /B a n

- B lo c k E r a s e : ( 2 5 6 K + 8 K ) B y te /B a n k

S in g le + 3 . 3 V ± 0 .3 V p o w e r s u p p ly o p e r a

P a g e R e a d O p e r a tio n

- R a n d o m R e a d : 2 5 µ s (M a x .)

- S e r ia l A c c e s s : 2 5 n s ( M in . )

F a s t W r it e C y c le T im e

- P r o g r a m t im e : 2 0 0 µ s ( T y p . )

- B lo c k E r a s e T im e : 1 .5 m s ( T y p .)

C o m m a n d /A d d r e s s /D a ta M u ltip le x e d I/O

H a r d w a r e D a ta P r o te c tio n

- P r o g r a m /E r a s e L o c k o u t D u r in g P o w

R e lia b le C M O S F lo a t in g - G a t e T e c h n o lo

- E n d u ra n c e : 1 0 0 K P ro g ra m /E ra s e C

- D a ta R e te n tio n : 1 0 Y e a r s

C o m m a n d R e g is te r O p e r a t io n

I n t e llig e n t C o p y - B a c k O p e r a t io n

it x 2 .

tio n .

1 0

1 1

1 2

1 3

1 4

1 5

1 6

1 7

1 8

1 9

2 0

2 1

2 2

2 3

2 4

2 5

P o rt

e r T r a n s it io n s

g y

y c le s

N C

# R B 1

# R B 0

# R E 0

# C E 0

# C E 1

N C

V C C

V S S

N C

C L E

A L E

# W E 0

# W P

# W E 1

N C

2 6

2 7

2 8

2 9

3 0

3 1

3 2

3 3

3 4

3 5

3 6

3 7

3 8

3 9

4 0

4 1

4 2

4 3

4 4

4 5

4 6

4 7

4 8

4 9

5 0

N C

I/O 0

I/O 1

I/O 2

I/O 3

N C

V S S

V C C

# R E 1

N C

I/O 4

I/O 5

I/O 6

I/O 7

N C

G e n e r a l d e s c r ip tio n

T h e 3 D F N 1 6 G 0 8 V S 2 3 0 6 is a 1 6 G b it h ig h - d e n s ity N o n - V o la tile C M O S

N A N D F L A S H m o d u le o r g a n iz e d a s 2 x 1 G x 8 b it .

U s in g h ig h - p e r f o r m a n c e a n d h ig h - r e lia b ilit y C M O S t e c h n o lo g y c h ip s ,

s t a c k in g w it h t h e w e ll- k n o w

3 D P lu s M C M - V t e c h n o lo g y , t h is F L A S H

m e m o r y m o d u le p r o v id e s a c o s t- e ffe c tiv e s o lu tio n fo r lo w p o w e r a n d

h ig h - c a p a c it y n o n - v o la t ile m e m o r y d a t a s t o r a g e n e e d s , s u c h a s v o ic e

r e c o r d in g a n d im a g e f ile m e m o r y fo r s t ill c a m e r a .

E a c h d e v ic e o f th e m o d u le is a 8 G b it ( w it h s p a r e 2 5 6 M b it) N A N D F L A S H ,

o r g a n iz e d a s 1 G x 8 b it, a n d c a n b e a c c e s s e d b y a c tiv a t in g t h e a s s o c ia -

te d c o n tr o l s ig n a l ( # C E n , # W e n , # R e n ) . A p r o g r a m o p e r a tio n p r o g r a m s

t h e ( 4 K + 1 2 8 ) b y t e x 8 p a g e in t y p ic a l 2 0 0 µ s a n d a n e r a s e o p e r a tio n c a n

b e p e r f o r m e d in t y p ic a l 1 .5 m s o n a ( 2 5 6 K + 8 K ) - b y t e b lo c k . D a t a in t h e

d a t a p a g e c a n b e r e a d o u t a t 2 5 n s c y c le t im e p e r b y t e . T h e I/ O p in s

s e r v e a s th e p o r ts fo r a d r e s s a n d d a ta in p u t/o u tp u t a s w e ll a s c o m m a n d

in p u t.T h e o n - c h ip w r ite c o n tr o lle r a u to m a te s a ll p r o g r a m a n d

e r a s e f u n c tio n s in c lu d in g p u ls e r e p e tit io n , w h e r e r e q u ir e d , a n d in te r n a l

v e r if ic a tio n a n d m a r g in in g o f d a ta . E v e n t h e w r it e - in t e n s iv e s y s te m c a n

t a k e a d v a n t a g e o f t h e 3 D F N 1 6 G 0 8 V S 2 3 0 6 e x t e n d e d r e lia b ilit y o f

1 0 0 K p r o g r a m / e r a s e c y c le s b y p r o v id in g E C C ( E r r o r C o r r e c t in g C o d e )

w it h r e a l tim e m a p p in g - o u t a lg o r it h m .

T h e 3 D F N 1 6 G 0 8 V S 2 3 0 6 m o d u le is p a c k a g e d in a 5 0 S O P P a c k a g e

a n d is a v a ila b le fo r C o m m e r c ia l a n d In d u s t r ia l r a n g e te m p e r a tu r e .

F la s h M e m o r y M o d u le

F U N C T IO N A L B L O C K

D IA G R A M

I/O 0 -7

# C E 0 -# R /B 0 -# R E 0 -# W E 0

# C E 1 -# R /B 1 -# R E 1 -# W E 1

1 G x 8

( A ll o t h e r s ig n a ls a r e c o m m o n to t h e t w o m e m o r ie s )

3 D F N 1 6 G 0 8 V S 2 3 0 6

P L U S S .A . r e s e r v e s th e r ig h t to c h a n g e o r c a n c e l p r o d u c ts o r s p e c ific a tio n s w ith o u t n o tic e

D F P -0 3 0 6 -R E V : 1 - O C T 2 0 1 1

3DFN16G08VS2306CN Related Products

	3DFN16G08VS2306CN	3DFN16G08VS2306MSP-00
Description	Flash, 2GX8, PDSO50, 0.50 MM PITCH, SOP-50	Flash, 2GX8, PDSO50, SOP-50
Maker	3D PLUS	3D PLUS
package instruction	SSOP,	SSOP,
Reach Compliance Code	unknown	unknown
JESD-30 code	R-PDSO-G50	R-PDSO-G50
length	18.7 mm	18.7 mm
memory density	17179869184 bit	17179869184 bit
Memory IC Type	FLASH	FLASH
memory width	8	8
Number of functions	1	1
Number of terminals	50	50
word count	2147483648 words	2147483648 words
character code	2000000000	2000000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	125 °C
organize	2GX8	2GX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SSOP	SSOP
Package shape	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH
Parallel/Serial	PARALLEL	PARALLEL
Programming voltage	3.3 V	2.7 V
Maximum seat height	5.6 mm	5.6 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	COMMERCIAL	MILITARY
Terminal form	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.5 mm
Terminal location	DUAL	DUAL
width	13.64 mm	13.64 mm
Base Number Matches	1	1

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