B352F110T30
BCM
TM
Bus Converter
• 352 V to 11 V V•I Chip
TM
Converter
• 300 Watt (450 Watt for 1 ms)
• High density – up to 1036 W/in
3
• Small footprint – 260
W/in
2
• Low weight – 0.5 oz (15 g)
• ZVS / ZCS isolated sine
amplitude converter
• Typical efficiency 95%
• 125°C operation (T
J
)
• <1 µs transient response
• >3.5 million hours MTBF
• No output filtering required
©
Vin = 330 - 365 V
Vout = 10.3 - 11.4 V
Iout = 27.3 A
K = 1/32
Rout = 15.0 mΩ max
Product Description
The V•I Chip Bus Converter Module is a high efficiency
(>95%), narrow input range Sine Amplitude Converter
(SAC) operating from a 330 to 365 Vdc primary bus to
deliver an isolated low voltage secondary (ELV). The off-
line BCM provides an isolated 10.3 -11.4 V distribution
bus and is ideal for use in silver boxes and PFC front
ends. Due to the fast response time and low noise of the
BCM, the need for limited life aluminum electrolytic or
tantalum capacitors at the input of POL converters is
reduced—or eliminated—resulting in savings of board
area, materials and total system cost.
The BCM achieves a power density of 1036 W/in
3
in
a V•I Chip package compatible with standard pick-and-
place and surface mount assembly processes. The
V•I Chip package provides flexible thermal management
through its low junction-to-case and junction-to-board
thermal resistance. Owing to its high conversion
efficiency and safe operating temperature range, the
BCM does not require a discrete heat sink in typical
applications. Low junction-to-case and junction-to-lead
thermal impedances assure low junction temperatures
and long life in the harshest environments.
Absolute Maximum Ratings
Parameter
+In to -In
+In to -In
PC to -In
+Out to -Out
Isolation voltage
Output current
Peak output current
Output power
Peak output power
Case temperature
Operating junction temperature
(1)
Storage temperature
Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by a shutdown comparator.
Values
-1.0 to 400
500
-0.3 to 7.0
-0.5 to 16.0
4,242
30.4
41.0
300
450
225
-40 to 125
-40 to 125
Unit
Vdc
Vdc
Vdc
Vdc
Vdc
A
A
W
W
°C
°C
°C
Notes
For 100 ms
Input to Output
Continuous
For 1 ms
Continuous
For 1 ms
During reflow MSL 5
T-Grade
T-Grade
Part Numbering
B
Bus Converter
Module
352
Input Voltage
Designator
F
110
Output Voltage
Designator
(=V
OUT
x10)
T
30
Output Power
Designator
(=P
OUT
/10)
Configuration
F = J-lead
T = Through hole
Product Grade Temperatures (°C)
Grade
Storage Operating (T
J
)
T
-40 to125 -40 to125
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B352F110T30
Rev. 2.0
Page 1 of 12
Specifications
Input
(Conditions are at 352 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Input voltage range
Input dV/dt
Input undervoltage turn-on
Input undervoltage turn-off
Input overvoltage turn-on
Input overvoltage turn-off
Input quiescent current
Inrush current overshoot
Input current
Input reflected ripple current
No load power dissipation
Internal input capacitance
Internal input inductance
Recommended external input capacitance
1.2
0.2
0.9
400
4.3
0.2
5
2
7.0
V•I Chip Bus Converter Module
Min
330
Typ
352
Max
365
1
325
315
399
Unit
Vdc
V/µs
Vdc
Vdc
Vdc
Vdc
mA
A
Adc
mA p-p
W
µF
nH
µF
Note
275
366
PC low
Using test circuit in Figure 20; See Figure 1
Using test circuit in Figure 20; See Figure 4
200 nH maximum source inductance; See Figure 20
Input Waveforms
Figure 1
— Inrush transient current at full load and 352 Vin with PC
enabled
Figure 2
— Output voltage turn-on waveform with PC enabled at full load
and 352 Vin
Figure 3
— Output voltage turn-on waveform with input turn-on at full
load and 352 Vin
Figure 4
— Input reflected ripple current at full load and 352 Vin
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B352F110T30
Rev. 2.0
Page 2 of 12
Specifications
(continued)
V•I Chip Bus Converter Module
Output
(Conditions are at 352 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Output voltage
Output power
Rated DC current
Peak repetitive power
Current share accuracy
Efficiency
Half load
Full load
Internal output inductance
Internal output capacitance
Load capacitance
Output overvoltage setpoint
Output ripple voltage
No external bypass
10 µF bypass capacitor
Short circuit protection set point
Average short circuit current
Effective switching frequency
Line regulation
K
Load regulation
R
OUT
Transient response
Voltage overshoot
Response time
Recovery time
Output overshoot
Input turn-on
PC enable
Output turn-on delay
From application of power
From release of PC pin
38.0
3.3
0.0309
0.18
3.4
1/32
12.2
115
200
1
0
0
750
160
3.5
0.0316
15.0
mΩ
mV
ns
µs
mV
mV
ms
ms
100% load step; See Figures 10 and 11
See Figures 10 and 11
See Figures 10 and 11
No output filter; See Figure 3
No output filter; See Figure 2
No output filter; See Figure 3
No output filter
93.5
94.3
5
95.8
95.5
1.1
31
1,200
11.4
200
13
400
Min
10.3
9.91
0
0
Typ
Max
11.4
11.0
300
30.4
450
10
Unit
Vdc
Vdc
W
Adc
W
%
%
%
nH
µF
µF
Vdc
mV p-p
mV p-p
Adc
A
MHz
Note
No load
Full load
330 - 365 V
IN
P
OUT
≤300
W
Max pulse width 1ms, max duty cycle 10%,
baseline power 50%
See Parallel Operation on Page 11
See Figure 5
See Figure 5
Effective value
See Figures 7 and 9
See Figure 8
Module will shut down
Fixed, 1.7 MHz per phase
VOUT = K•V
IN
at no load
Output Waveforms
Efficiency vs. Output Power
98
16
Power Dissipation
Power Dissipation (W)
14
12
10
8
6
4
2
96
Efficiency (%)
94
92
90
88
86
84
82
0
30
60
90
120
150
180
210
240
270
300
0
30
60
90
120
150
180
210
240
270
300
Output Power (W)
Output Power (W)
Figure 6
— Power dissipation as a function of output power
Figure 5
— Efficiency vs. output power at 352 Vin
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B352F110T30
Rev. 2.0
Page 3 of 12
Specifications
(continued)
V•I Chip Bus Converter Module
Figure 7
— Output voltage ripple at full load and 352 Vin without any
external bypass capacitor.
Figure 8
— Output voltage ripple at full load and 352 Vin with 10 µF
ceramic external bypass capacitor and 20 nH of distribution inductance.
Ripple vs. Output Power
210
Output Ripple (mVpk-pk)
180
150
120
90
60
30
0
30
60
90
120
150
180
210
240
270
300
Output Power (W)
Figure 9
— Output voltage ripple vs. output power at 352 Vin without any
external bypass capacitor.
Figure 10
— 0 -27.3 A load step with 2 µF input capacitor and no
output capacitor.
Figure 11
— 27.3- 0 A load step with 2 µF input capacitor and no output
capacitor.
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B352F110T30
Rev. 2.0
Page 4 of 12
Specifications
General
Parameter
MTBF
MIL-HDBK-217F
Isolation specifications
Voltage
Capacitance
Resistance
Agency approvals
Mechanical
Weight
Dimensions
Length
Width
Height
(continued)
V•I Chip Bus Converter Module
Min
Typ
3.5
Max
Unit
Mhrs
Vdc
pF
MΩ
Note
25°C, GB
Input to Output
Input to Output
Input to Output
UL /CSA 60950-1, EN 60950-1
Low Voltage Directive
See Mechanical Drawings, Figures 15 – 18
4,242
500
10
cTÜVus
CE Mark
RoHS
0.53/15
1.28 / 32,5
0.87 / 22
0.26/ 6,6
125
130
9.3
1.1
2.1
135
oz /g
in / mm
in / mm
in / mm
°C
Ws /°C
°C/ W
°C/ W
Junction temperature
Thermal
Over temperature shutdown
Thermal capacity
Junction-to-case thermal impedance (R
θJC
)
Junction-to-board thermal impedance (R
θJB
)
Auxiliary Pins
(Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Primary control (PC)
DC voltage
Module disable voltage
Module enable voltage
Current limit
Enable delay time
Disable delay time
2.4
Min
4.8
2.4
Typ
5.0
2.5
2.5
2.5
160
20
Max
5.2
2.6
2.9
Unit
Vdc
Vdc
Vdc
mA
ms
µs
Note
Source only
See Figure 12, time from PC low to output low
Figure 12
— V
OUT
at full load vs. PC disable
Figure 13
— PC signal during fault
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B352F110T30
Rev. 2.0
Page 5 of 12
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