When drawing a package with ORCAD, the pad I created reports an error. Please help. Thank you~~~~~~~~~~~~~~~~~~~~~~ E- (SPMHAP-2): No padstack specified. E- (SPMHAP-3): Problem loading 'Zz22.pad'. E- ...
The firmware library functions of the third part memory protection (MPU) and the fourth part (EEPROM) will be uploaded later [/color][/size][/font] [[i] This post was last edited by Pinghu Qiuyue on 2...
[i=s]This post was last edited by zqjqq88 on 2015-1-13 16:41[/i] I want to play with ST's low-power processors recently. I remember that there seemed to be an event in the forum where many people had ...
I would like to ask you a question. If there are multiple schematics in a PCB project and I want to import these schematics into one PCB, how can I import these schematics into one PCB? Thank you....
On August 23rd, Geely's subsidiary, Jiyao Tongxing, announced it has the industry's largest advanced production capacity for tandao
batteries
, with eight production bases across China. Jiy...[Details]
Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
Reflow soldering, a common soldering method in modern electronics manufacturing, primarily melts solder paste and pads to form solder joints. With technological advancements, soldering equipment ha...[Details]
When you are happily watching NBA or football, your wife asks you to turn off the lights in the bedroom. Would you be depressed? Of course, unless you are not afraid of your wife.
Now you are ...[Details]
As more and more consumers purchase new energy vehicles, the safety of electric vehicles has become a major concern. This has been particularly prominent following a series of electric vehicle fire...[Details]
When we travel in cities, we all find that electric vehicles have many advantages. As a means of transportation, they can also fulfill their mission well. Now, more and more residential communities...[Details]
According to foreign media reports, secondary battery materials company POSCO Future M announced that it has successfully developed two experimental (prototype) positive electrode materials for the...[Details]
According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
On August 20th, Tiantai Robotics Co., Ltd., along with strategic partners including Shandong Future Robotics Technology Co., Ltd., Shandong Future Data Technology Co., Ltd., and Gangzai Robotics Gr...[Details]
This paper proposes a temperature real-time transmission and display solution based on LED optical data transmission, with Jingwei Yager low-power FPGA HR (Yellow River) series as the main controll...[Details]
Overview
As handheld voice communication devices become more and more popular, they are increasingly used in noisy environments, such as airports, busy roads, crowded bars, etc. In such noisy ...[Details]
Chinese characters are extensive and profound, and there are many different names for ESD tubes. How many of them do you know?
As far as I know, ESD diodes are currently known as ESD p...[Details]
Intel®
Xeon®
6
-
core processors now support the new Amazon EC2 R8i and R8i-flex instances on Amazon Web Services (AWS).
These new instances offer superior performance and fast...[Details]
Charging is an essential topic for electric vehicles. Batteries are a core component of new energy vehicles. So, what's the optimal charge level for electric vehicles? Based on current battery tech...[Details]
The fracture mechanism is stress concentration, which typically occurs at the capacitor lead pins or pad connection points, as shown in the figure. Under vibration, the capacitor lead pins and pad ...[Details]
PCB Design
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