OT PLD, 8ns, PAL-Type, ECL, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERAMIC, DIP-24
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | DIP |
| package instruction | DIP, DIP24,.3 |
| Contacts | 24 |
| Reach Compliance Code | unknow |
| ECCN code | 3A001.A.2.C |
| Architecture | PAL-TYPE |
| maximum clock frequency | 100 MHz |
| JESD-30 code | R-GDIP-T24 |
| JESD-609 code | e0 |
| Dedicated input times | 11 |
| Number of I/O lines | 8 |
| Number of entries | 20 |
| Output times | 8 |
| Number of product terms | 90 |
| Number of terminals | 24 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 11 DEDICATED INPUTS, 8 I/O |
| Output function | MACROCELL |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | -4.5 V |
| Programmable logic type | OT PLD |
| propagation delay | 8 ns |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | ECL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Base Number Matches | 1 |
| AMPAL10020EV8-8DE | AMPAL10H20EV8-8/B3C | AMPAL10H20EV8-8LE | |
|---|---|---|---|
| Description | OT PLD, 8ns, PAL-Type, ECL, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERAMIC, DIP-24 | OT PLD, 8ns, PAL-Type, ECL, CQCC28, CERAMIC, LCC-28 | OT PLD, 8ns, PAL-Type, ECL, CQCC28, CERAMIC, LCC-28 |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Parts packaging code | DIP | QLCC | QLCC |
| package instruction | DIP, DIP24,.3 | QCCN, LCC28,.45SQ | QCCN, LCC28,.45SQ |
| Contacts | 24 | 28 | 28 |
| Reach Compliance Code | unknow | unknown | unknown |
| ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| Architecture | PAL-TYPE | PAL-TYPE | PAL-TYPE |
| maximum clock frequency | 100 MHz | 100 MHz | 100 MHz |
| JESD-30 code | R-GDIP-T24 | S-CQCC-N28 | S-CQCC-N28 |
| JESD-609 code | e0 | e0 | e0 |
| Dedicated input times | 11 | 11 | 11 |
| Number of I/O lines | 8 | 8 | 8 |
| Number of entries | 20 | 20 | 20 |
| Output times | 8 | 8 | 8 |
| Number of product terms | 90 | 90 | 90 |
| Number of terminals | 24 | 28 | 28 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C |
| organize | 11 DEDICATED INPUTS, 8 I/O | 11 DEDICATED INPUTS, 8 I/O | 11 DEDICATED INPUTS, 8 I/O |
| Output function | MACROCELL | MACROCELL | MACROCELL |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP | QCCN | QCCN |
| Encapsulate equivalent code | DIP24,.3 | LCC28,.45SQ | LCC28,.45SQ |
| Package shape | RECTANGULAR | SQUARE | SQUARE |
| Package form | IN-LINE | CHIP CARRIER | CHIP CARRIER |
| power supply | -4.5 V | -5.2 V | -5.2 V |
| Programmable logic type | OT PLD | OT PLD | OT PLD |
| propagation delay | 8 ns | 8 ns | 8 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | YES | YES |
| technology | ECL | ECL | ECL |
| Temperature level | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | NO LEAD | NO LEAD |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | QUAD |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | NOT SPECIFIED |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED |
| Maker | - | AMD | AMD |
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