3. Epoxy meniscus may extend about 1mm (0.040”) down the leads.
Device Selection Guide
Iv (cd) @ 20mA
Part Number
HLMP-CW18-VY0xx
HLMP-CW19-VY0xx
HLMP-CW28-TW0xx
HLMP-CW29-TW0xx
HLMP-CW38-SV0xx
HLMP-CW39-SV0xx
Notes:
1. Tolerance for luminous intensity measurement is +/- 15%
2. The luminous intensity is measured on the mechanical axis of the lamp package.
3. The optical axis is closely aligned with the package mechanical axis.
4. LED light output is bright enough to cause injuries to the eyes. Precautions must be taken to prevent looking directly at the LED without proper safety
equipment.
Typ. Viewing Angle
Min.
15°
15°
23°
23°
30°
30°
4.20
4.20
2.50
2.50
1.90
1.90
Typ.
6.40
6.40
3.80
3.80
3.00
3.00
Standoff Leads
No
Yes
No
Yes
No
Yes
Package
Dimension
A
B
A
B
A
B
Part Numbering System
L M P - C W XX - X X X XX
Mechanical Option
00: Bulk
DD: Ammo Pack
Color Bin Options
0: Full color bin distribution
Maximum Intensity Bin Limit
0: No maximum intensity bin limit
Minimum Intensity Bin Limit
Refer to Device Selection Guide
Viewing Angle
18: 15 without standoffs
19: 15˚ with standoffs
28: 23˚ without standoffs
29: 23˚ with standoffs
38: 30 ˚ without standoffs
39: 30 ˚ with standoffs
Color Options
W: White
Package Options
C: T-1 3/4
2
Absolute Maximum Ratings (T
A
= 25°C)
Parameter
DC Forward Current
[1]
Peak Forward Current
[2]
Average Forward Current
Power Dissipation
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Wave Solder Temperature
[3]
Solder Dipping Temperature
[3]
Notes:
1. Derate linearly as shown in Figure 4.
2. Duty Factor 30%, 1 KHz
3. 1.59 mm (0.060 inch) below body
Value
30
100
30
120
130
-40 to +85
-40 to +100
250 for 3 secs
260 for 5secs
Units
mA
mA
mA
mW
°C
°C
°C
°C
°C
Electrical/Optical Characteristics (T
A
= 25
o
C)
Parameters
Forward voltage
Capacitance
Reverse Voltage
[1]
Thermal resistance
Viewing Angle
[2]
CW18/CW19
CW28/CW29
CW38/CW39
Symbol
V
F
C
V
R
Rθ
J-PIN
2θ
1/2
15
23
30
0.31
0.32
I
F
= 20 mA
Minimum Typical
3.4
53
0.6
240
Maximum Units
4.0
V
pF
V
o
C/W
Test Condition
I
F
= 20 mA
V
F
=0, f=1 MHz
I
R
= 10
µA
LED Junction to cathode lead
I
F
= 20 mA
Degree
Chromaticity Coordinate
[3]
X
Y
Notes:
2. 2
θ
1/2
is the off-axis angle where the luminous intensity is ½ the on axis intensity
1. The reverse voltage of the product is equivalent to the forward voltage of the protective chip at I
R
= 10
µ
A
3. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device.
Recently the forum held an activity called "Meeting Friends by Disassembling", so I dug out some old antique laptops from under the bed, and disassembled them to show everyone what classic designs are...
As the title says, if I want to design such a light curtain, can I use LED as the light source? How to achieve it? ? The curtain surface is 100mm*1000mmStartFragment...
[i=s] This post was last edited by wawaw on 2015-1-19 19:24 [/i] I downloaded MDK5.12 and an error occurred when I was emulating the virtual machine. However, the previous program was debugged normall...
MPLAB X IDE environment, compiler uses xc8 [backcolor=rgb(239, 245, 249)]pic12f675 chip[/backcolor] [backcolor=rgb(239, 245, 249)]GP1 is used as ADC input. The following program has not been adjusted ...
[table] [tr][td][b]MCU simulation software | Proteus [i]7.10[/i] cracked version download Chinese professional version[/b][/td][/tr] [/table] has been uploaded to the download center, welcome to downl...
I just bought this book. It has been on my desk for 2 days. The cover is a little dirty, but the inside is brand new. The original price is 49.8, but now it is 30% off. It can be cut with a knife. If ...
In recent years, with the increasing demand for manufacturing and automated production management, industrial barcode scanners have gradually become an indispensable part of the industrial manufact...[Details]
While
the solid-state battery
industry is still engaged in a long technological marathon for
the "ultimate solution" for
electric vehicles
, some companies have begun looking for mor...[Details]
Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
A line scan lens is an industrial lens used with line scan cameras. Its imaging principle is to capture the image of the workpiece using a linear sensor and then perform digital signal processing t...[Details]
1. Project Overview
1.1 Introduction
Currently, most music files are saved in MP3 format, a lossy audio compression format that cannot perfectly reproduce the original music. With the exp...[Details]
The most significant feature of IPS panels is that both electrodes are located on the same surface, unlike other LCD panels, which have electrodes arranged on top and bottom surfaces in a three-dim...[Details]
Capable of providing precise and efficient thermal management for artificial intelligence computing power, intelligent sensing and autonomous driving systems
Shenzhen, ...[Details]
According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
Recently, South Korean robotics giant WIRobotics launched its first general-purpose humanoid robot, ALLEX, at the Robotics Innovation Center (RIH) at the Korea University of Science and Technology....[Details]
The complexity of the integrated circuits (ICs) used in electronic systems in vehicles is increasing. They aim to execute artificial intelligence (AI) algorithms to control autonomous driving funct...[Details]
UPS stands for Uninterruptible Power Supply, which includes energy storage devices. It is mainly used to provide uninterruptible power supply for devices that require high power stability.
...[Details]
Reflow soldering is one of the most commonly used methods in electronics manufacturing, allowing for the soldering of large numbers of components in a relatively short time. However, any experience...[Details]
My career has been closely tied to the semiconductor industry. From product management to content marketing, I've provided countless forecasts and predictions across a variety of roles. Whethe...[Details]
For today's new energy vehicles, they have different configurations from fuel vehicles, and some configurations have also become a selling point for manufacturers. Compared with traditional vehicle...[Details]
From time to time, I see some audiophiles spending a lot of money or a lot of time to DIY speakers, but the results are not what they want. Below I list some of the small experiences I summarized b...[Details]
Making friends through disassembly
京公网安备 11010802033920号
EEWORLD
