11,43 0,450
IMPROVED CONTACT DESIGN
(PRE BEND)
RECOMMENDED PCB LAYOUT (COMPONENT SIDE VIEW)
EMPFOHLENES LEITERPLATTEN-LAYOUT (BESTUECKUNGSSEITE)
TOL. 0.05 [0.002] UNLESS NOTED
10,16 0,400
RECOMMENDED PANEL CUTOUT
EMPFOHLENER FRONTPLATTEN-AUSSCHNITT
17,78 min.
0,38
±0,10
0,015
±0,004
2,54 0,100
1,27 0,050
0,8
9
07
±0,
0,0
35
003
±0,
7 5 3 1
15,46 0,609
8 6 4 2
2 4 6 8
9,15 0,360
1 3 5 7
11,40 0,449
8,89 0,350
5,85 0,230
2,54 0,100
TOP OF PCB
LP
17,27 0,680
1,60 0,063
28,50 1,122 MAX
4,57 0,180
±0
,00
3
x2
2,13 0,084
2,79 0,110
11,43 0,450
2,13 0,084
2,79 0,110
x6
1
8
3,20
±0,30
0,126
±0,012
0,0
7
0 ,1
28
±0
0, 0
,00
3
63
25,50 1,004 MAX
1, 6
3 ,2
0
±
5
±
0,0
7
8
1
4,57 0,180
5,85 0,230
10,89 0,429
PART NO.
IDENT. NR.
TRANSMISSION
CATEGORY
CAT 5
CAT 5e
Stan d ard ap p l i c.
Standard description
Standard description
Thickness of plating
Thickness of plating
Standard description
Thickness of plating
Val ue
T e st D ata
Stand ard ap p l i c. Val ue
PBT 30%
Me chani cal p ro p e rti e s
C5210 (acc.JIS)
Insertion/withdrawal force IEC 603-7
max. 20 N
30 µin Au over 50 µin Ni
Mechanical operations
IEC 512-5, 9a
min. 1.000
80 µin matte Sn over 50 µin Ni
Effectiveness of connector
SUS301 (acc.JIS)
coupling device IEC 512-8, 15f
50 N
N.A.
El e ctri c al p ro p e rti e s
Cre e p ag e / cl e arance d i stance s
a) Contact - contact
IEC 807-3
0,52 mm
Tray
b) Contact - shell
IEC 807-3
min. 1,0 mm
235°C at 3-5s
Vo l tag e p ro o f (D i e l e ctri c Wi thstand Vo l tag e )
wave
a) Contact - contact
IEC 512-2, 4a
min. 1.000 V AC/DC
b) Contact - shell/testpanel IEC 512-2, 4a
min. 1.500 V AC/DC
Current carrying capacity
IEC 512-3, 5b
1,5 A @ 25° C
V0
Contact resistance
IEC 512-2, 2a
max. 30 mOhm
E145613
Insulation resistance
IEC 512-2, 3a
min. 500 MOhm
Yes
En vi ro n me ntal p ro p e rti e s
Operation temperature
0 - 70° C
9,15 0,360
11,40 0,449
15,46 0,609
133039
203517
T e chnical spe cif icat io ns
Mate ri al s & F i ni sh
Insulation body
Contact material
Contact finish, mating zone
Contact finish termination zone
Shell/shield material
Shell/shield plating
A sse mb l y p ro ce ss
Packaging
Solder temperature
Suitable assembly process
A p p ro v al s
UL insulation body
UL File No.
RoHS compliant
1:1
NOTE 1: PANEL GROUND FLANGES TOP, BOTTOM, SIDES (GF9)
Copyright by ERNI GmbH
Proprietary notice pursuant to ISO 16016 to be observed.
Information:
Tolerances
Scale
All Dimensions
in mm[in]
2:1
^
X,XX = ±0,25
All rights reserved.
Only for Information.
To ensure that this is the latest
version of this drawing, please
contact one of the ERNI companies
before using.
c
Index
20.05.2010
Date
Designation
Subject to modification without
prior notice.
Drawing will not be updated.
MOD JACK - MJD
8P8C, 2x1
UL 94
www.ERNI.com
Class
133880
25,64 min.
2,54 0,100
x16
A3
MCU
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