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SMBJ5937B-TP-HF

Description
Zener Diode, 33V V(Z), 5%, 1.5W,
CategoryDiscrete semiconductor    diode   
File Size347KB,4 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance
Download Datasheet Parametric View All

SMBJ5937B-TP-HF Overview

Zener Diode, 33V V(Z), 5%, 1.5W,

SMBJ5937B-TP-HF Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
Reach Compliance Codenot_compliant
ECCN codeEAR99
ConfigurationSINGLE
Diode typeZENER DIODE
Maximum dynamic impedance33 Ω
Humidity sensitivity level1
Number of components1
Maximum operating temperature150 °C
Peak Reflow Temperature (Celsius)260
Maximum power dissipation1.5 W
Nominal reference voltage33 V
surface mountYES
Maximum time at peak reflow temperature10
Maximum voltage tolerance5%
Working test current11.4 mA
Base Number Matches1
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

  !"#
$ %    !"#
SMBJ5913B
THRU
SMBJ5956B
1.5 Watt
Surface Mount
Silicon
Zener Diodes
DO-214AA
(SMB) (LEAD FRAME)
Features
Halogen
free available upon request by adding suffix "-HF"
Surface M ount Application
3.3
thru
200
Volt Voltage Range
Low Inductance,Low Profile Mounting
Glass Passivated Junction
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Mechanical Data
CASE: JEDEC DO-214AA molded Surface Mountable
Terminals solderable per MIL-STD-750, Method 2026
Polarity is indicated by cathode band.
Packaging: Standard 12mm Tape (see EIA 481)
Maximum temperature for soldering: 260 C for 10 seconds.
o
A
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Maximum Ratings @ 25
o
C Unless Otherwise Specified
Output
I
F
200mA
Current
Maximum
V
F
1.5V
(Note:
2)
Forward
Voltage
P
(AV)
Steady State
1.5W
(Note:
3)
Power
Dissipation
Operation And
T
J
, T
STG
-55
o
C to
Storage
+150
o
C
Temperature
NOTES:
1.
High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
2.
Forward Current @ 200mA.
3.
Mounted on 5.0mm (1oz thick) Iand areas.
Lead temperature at T
L
=75 C
o
2
B
C
F
D
H
G
E
DIMENSIONS
INCHES
MIN
.160
.130
.006
.030
.200
.079
.075
.002
MM
MIN
4.06
3.30
0.15
0.76
5.08
2.00
1.91
0.05
DIM
A
B
C
D
E
F
G
H
MAX
.185
.155
.012
.060
.220
.096
.087
.008
MAX
4.70
3.94
0.31
1
..52
5.59
2.44
2.21
0.203
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.106"
0.083”
0.050”
Revision:
D
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