MSC1201
MSC1202
SBAS317B − APRIL 2004 − REVISED JANUARY 2005
Precision, Analog-to-Digital Converter (ADC)
and Digital-to-Analog Converter (DAC)
with 8051 Microcontroller and Flash Memory
FEATURES
ANALOG FEATURES
Peripheral Features
D
16 Digital I/O Pins
D
Additional 32-Bit Accumulator
D
Two 16-Bit Timer/Counters
D
System Timers
D
Programmable Watchdog Timer
D
Full-Duplex USART
D
Basic SPI
D
Basic I
2
C
D
Power Management Control
D
Internal Clock Divider
D
Idle Mode Current < 200mA
D
Stop Mode Current < 100nA
D
Digital Brownout Reset
D
Analog Low-Voltage Detect
D
20 Interrupt Sources
D
MSC1201:
− 24 Bits No Missing Codes
− 22 Bits Effective Resolution At 10Hz
− Low Noise: 75nV
MSC1202:
− 16 Bits No Missing Codes
− 16 Bits Effective Resolution At 200Hz
− Noise: 600nV
PGA From 1 to 128
Precision On-Chip Voltage Reference
6 Differential/Single-Ended Channels
On-Chip Offset/Gain Calibration
Offset Drift: 0.02ppm/°C
Gain Drift: 0.5ppm/°C
On-Chip Temperature Sensor
Selectable Buffer Input
Burnout Detect
8-Bit Current DAC
D
D
D
D
D
D
D
D
D
D
D
GENERAL FEATURES
DIGITAL FEATURES
Microcontroller Core
D
8051-Compatible
D
High-Speed Core:
− 4 Clocks per Instruction Cycle
D
DC to 33MHz
D
On-Chip Oscillator
D
PLL with 32kHz Capability
D
Single Instruction 121ns
D
Dual Data Pointer
Memory
D
4kB or 8kB of Flash Memory
D
Flash Memory Partitioning
D
Endurance 1M Erase/Write Cycles,
100-Year Data Retention
D
256 Bytes Data SRAM
D
In-System Serially Programmable
D
Flash Memory Security
D
1kB Boot ROM
D
D
D
D
D
Each Device Has Unique Serial Number
Package: QFN-36
Low Power: 3mW at 3.0V, 1MHz
Industrial Temperature Range:
−40°C to +125°C
Power Supply: 2.7V to 5.25V
APPLICATIONS
D
D
D
D
D
D
D
D
D
D
D
Industrial Process Control
Instrumentation
Liquid/Gas Chromatography
Blood Analysis
Smart Transmitters
Portable Instruments
Weigh Scales
Pressure Transducers
Intelligent Sensors
Portable Applications
DAS Systems
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
SPI is a trademark of Motorola. I2C is a trademark of Philips Corporation. All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Products
conform to specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all parameters.
Copyright
2004−2005, Texas Instruments Incorporated
www.ti.com
MSC1201
MSC1202
www.ti.com
SBAS317B − APRIL 2004 − REVISED JANUARY 2005
PACKAGE/ORDERING INFORMATION
(1)
PRODUCT
MSC1201Y2
MSC1201Y3
MSC1202Y2
MSC1202Y3
FLASH
MEMORY
(BYTES)
4k
8k
4k
8k
ADC
RESOUTION
(BITS)
24
24k
16
16
PACKAGE-LEAD
QFN-36
QFN-36
QFN-36
QFN-36
PACKAGE
DESIGNATOR
RHH
RHH
RHH
RHH
SPECIFIED
TEMPERATURE
RANGE
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
PACKAGE
MARKING
MSC1201Y2
MSC1201Y3
MSC1202Y2
MSC1202Y3
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this datasheet, or refer to our
web site at www.ti.com.
MSC1201Yx/MSC1202Yx FAMILY FEATURES
FEATURES(1)
Flash Program Memory (Bytes)
Flash Data Memory (Bytes)
Internal Scratchpad RAM (Bytes)
MSC120xY2(2)
Up to 4k
Up to 2k
256
MSC120xY3(2)
Up to 8k
Up to 4k
256
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
(1) All peripheral features are the same on all devices; the flash memory size
is the only difference.
(2) The last digit of the part number (N) represents the onboard flash size =
(2
N
)kBytes.
ABSOLUTE MAXIMUM RATINGS
(1)
MSC1201Yx, MSC1202Yx
Analog Inputs
Momentary
Input current
Input voltage
Power Supply
DVDD to DGND
AVDD to AGND
AGND to DGND
VREF to AGND
Digital input voltage to DGND
Digital output voltage to DGND
Maximum junction temperature
Operating temperature range
Storage temperature range
Lead temperature (soldering, 10s)
Package power dissipation
Output current, all pins
Output pin short-circuit
High K (2s 2p)
Thermal Resistance
Digital Outputs
Output current
I/O source/sink current
Power pin maximum
Continuous
100
100
300
mA
mA
mA
Junction to ambient (qJA)
Junction to case (qJC)
Low K (1s)
−0.3 to +6
−0.3 to +6
−0.3 to +0.3
−0.3 to AVDD + 0.3
−0.3 to DVDD + 0.3
−0.3 to DVDD + 0.3
+150
−40 to +125
−65 to +150
+235
(TJ Max − TAMBIENT)/qJA
200
10
21.9
103.7
21.9
V
V
V
V
V
V
°C
°C
°C
°C
W
mA
s
°C/W
°C/W
°C/W
Continuous
100
10
AGND − 0.3 to AVDD + 0.3
mA
mA
V
UNITS
(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for
extended periods may affect device reliability.
2
MSC1201
MSC1202
www.ti.com
SBAS317B − APRIL 2004 − REVISED JANUARY 2005
ELECTRICAL CHARACTERISTICS: AV
DD
= 5V
All specifications from TMIN to TMAX, DVDD = +2.7V to +5.25V, fMOD = 15.625kHz, PGA = 1, Buffer ON, fDATA = 10Hz, Bipolar, and
VREF
≡
(REF IN+) − (REF IN−) = +2.5V, unless otherwise noted.
MSC1201Yx, MSC1202Yx
PARAMETER
Analog Input
(AIN0-AIN5, AINCOM)
Buffer OFF
Analog Input Range
Full-Scale Input Voltage Range
Differential Input Impedance
Input Current
Fast Settling Filter
Bandwidth
Sinc2 Filter
Sinc3 Filter
Programmable Gain Amplifier
Input Capacitance
Input Leakage Current
Burnout Current Sources
ADC Offset DAC
Offset DAC Range
Offset DAC Resolution
Offset DAC Full-Scale Gain Error
Offset DAC Full-Scale Gain Error Drift
System Performance
MSC1201
Resolution
MSC1202
MSC1201
ENOB
Output Noise
MSC1201, Sinc3 Filter, Decimation > 360
No Missing Codes
Integral Nonlinearity
Offset Error
Offset Drift(2)
Gain Error(3)
Gain Error Drift(2)
System Gain Calibration Range
System Offset Calibration Range
At DC
Common-Mode Rejection
fCM = 60Hz
,
fDATA = 10Hz
fCM = 50Hz
,
fDATA = 50Hz
fCM = 60Hz
,
fDATA = 60Hz
Normal-Mode Rejection
Power-Supply Rejection
(1)
(2)
(3)
(4)
fCM = 50Hz
,
fDATA = 50Hz
fCM = 60Hz
,
fDATA = 60Hz
At DC, dB = −20log(∆VOUT/∆VDD)(4)
MSC1202, Sinc3 Filter
End Point Fit, Differential Input
After Calibration
Before Calibration
After Calibration
Before Calibration
80
−50
120
130
120
120
100
100
100
24
16
±0.0004
1.5
0.02
0.005
0.5
120
50
±0.0015
MSC1202
24
16
22
16
See Typical Characteristics
Bits
Bits
% of
FSR
ppm of FS
ppm of FS/°C
%
ppm/°C
% of FS
% of FS
dB
dB
dB
dB
dB
dB
dB
Bits
Bits
Bits
Bits
8
±1.0
0.6
±V
REF
/(2
•
PGA)
CONDITION
MIN
TYP
MAX
UNITS
AGND − 0.1
AGND + 50mV
AVDD + 0.1
AVDD − 1.5
±V
REF/PGA
7/PGA(1)
0.5
0.469
•
fDATA
0.318
•
fDATA
0.262
•
fDATA
V
V
V
MΩ
nA
Buffer ON
(In+) − (In−)
Buffer OFF
Buffer ON
−3dB
−3dB
−3dB
User-Selectable Gain Range
Buffer ON
Multiplexer Channel OFF, T = +25°C
Buffer ON
1
7
0.5
±2
128
pF
pA
µA
V
Bits
% of Range
ppm/°C
The input impedance for PGA = 128 is the same as that for PGA = 64 (that is, 7MΩ/64).
Calibration can minimize these errors.
The gain calibration cannot have a REF IN+ of more than AV
DD
−1.5V with Buffer ON. To calibrate gain, turn Buffer OFF.
∆V
OUT is change in digital result.
3
MSC1201
MSC1202
www.ti.com
SBAS317B − APRIL 2004 − REVISED JANUARY 2005
ELECTRICAL CHARACTERISTICS: AV
DD
= 5V (continued)
All specifications from TMIN to TMAX, DVDD = +2.7V to +5.25V, fMOD = 15.625kHz, PGA = 1, Buffer ON, fDATA = 10Hz, Bipolar, and
VREF
≡
(REF IN+) − (REF IN−) = +2.5V, unless otherwise noted.
MSC1201Yx, MSC1202Yx
PARAMETER
Voltage Reference Input
Reference Input Range
ADC VREF
VREF Common-Mode Rejection
Input Current
On-Chip Voltage Reference
VREFH = 1 at +25°C
Output Voltage
Short-Circuit Current Source
Short-Circuit Current Sink
Short-Circuit Duration
Startup Time from Power ON
Temperature Sensor
Temperature Sensor Voltage
Temperature Sensor Coefficient
IDAC Output Characteristics
IDAC Resolution
Full-Scale Output Current
Maximum Short-Circuit Current Duration
Compliance Voltage
Analog Power-Supply Requirements
Analog Power-Supply Voltage
Analog Current
AVDD
BOR OFF, External Clock Mode, Analog OFF,
ALVD OFF, PDADC = PDIDAC = 1
PGA = 1, Buffer OFF
Analog
Power-Supply
Current
ADC Current
(IADC)
PGA = 128, Buffer OFF
PGA = 1, Buffer ON
PGA = 128, Buffer ON
VREF Supply Current
(IVREF)
IDAC Supply Current
(IIDAC)
(1)
(2)
(3)
(4)
ADC ON
IDAC = 00h
4.75
5.0
<1
170
430
230
770
360
230
5.25
V
nA
µA
µA
µA
µA
µA
µA
8
1
Indefinite
AVDD − 1.5
V
Bits
mA
T = +25°C
115
345
mV
µV/°C
Sink or Source
CREFOUT = 0.1µF
VREFH = 0
2.5
1.25
8
50
Indefinite
8
ms
V
V
mA
mA
REF IN+, REF IN−
VREF
≡
(REFIN+) − (REFIN−)
At DC
VREF = 2.5V, PGA = 1
AGND
0.1
2.5
115
1
AVDD(3)
AVDD
V
V
dB
µA
CONDITION
MIN
TYP
MAX
UNITS
The input impedance for PGA = 128 is the same as that for PGA = 64 (that is, 7MΩ/64).
Calibration can minimize these errors.
The gain calibration cannot have a REF IN+ of more than AV
DD
−1.5V with Buffer ON. To calibrate gain, turn Buffer OFF.
∆V
OUT is change in digital result.
4
MSC1201
MSC1202
www.ti.com
SBAS317B − APRIL 2004 − REVISED JANUARY 2005
ELECTRICAL CHARACTERISTICS: AV
DD
= 3V
All specifications from TMIN to TMAX, DVDD = +2.7V to +5.25V,
VREF
≡
(REF IN+) − (REF IN−) = +1.25V, unless otherwise noted.
fMOD = 15.625kHz, PGA = 1, Buffer ON, fDATA = 10Hz, Bipolar, and
MSC1201Yx, MSC1202Yx
PARAMETER
Analog Input
(AIN0-AIN5, AINCOM)
Buffer OFF
Analog Input Range
Full-Scale Input Voltage Range
Differential Input Impedance
Input Current
Fast Settling Filter
Bandwidth
Sinc2 Filter
Sinc3 Filter
Programmable Gain Amplifier
Input Capacitance
Input Leakage Current
Burnout Current Sources
ADC Offset DAC
Offset DAC Range
Offset DAC Resolution
Offset DAC Full-Scale Gain Error
Offset DAC Full-Scale Gain Error Drift
System Performance
MSC1201
Resolution
MSC1202
MSC1201
ENOB
Output Noise
MSC1201, Sinc3 Filter, Decimation > 360
No Missing Codes
Integral Nonlinearity
Offset Error
Offset Drift(2)
Gain Error(3)
Gain Error Drift(2)
System Gain Calibration Range
System Offset Calibration Range
At DC
Common-Mode Rejection
fCM = 60Hz
,
fDATA = 10Hz
fCM = 50Hz
,
fDATA = 50Hz
fCM = 60Hz
,
fDATA = 60Hz
Normal-Mode Rejection
Power-Supply Rejection
(1)
(2)
(3)
(4)
fSIG = 50Hz
,
fDATA = 50Hz
fSIG = 60Hz
,
fDATA = 60Hz
At DC, dB = −20log(∆VOUT/∆VDD)(4)
MSC1202, Sinc3 Filter
End Point Fit, Differential Input
After Calibration
Before Calibration
After Calibration
Before Calibration
80
−50
130
130
120
120
100
100
88
24
16
±0.0004
1.3
0.02
0.005
0.5
120
50
±0.0015
MSC1202
24
16
22
16
See Typical Characteristics
Bits
Bits
%
of FSR
ppm of FS
ppm of FS/°C
%
ppm/°C
% of FS
% of FS
dB
dB
dB
dB
dB
dB
dB
Bits
Bits
Bits
Bits
8
±1.5
0.6
±V
REF
/(2
•
PGA)
CONDITIONS
MIN
TYP
MAX
UNITS
AGND − 0.1
AGND + 50mV
AVDD + 0.1
AVDD − 1.5
±V
REF/PGA
7/PGA(1)
0.5
0.469
•
fDATA
0.318
•
fDATA
0.262
•
fDATA
V
V
V
MΩ
nA
Buffer ON
(In+) − (In−)
Buffer OFF
Buffer ON
−3dB
−3dB
−3dB
User-Selectable Gain Range
Buffer ON
Multiplexer Channel Off, T = +25°C
Buffer ON
1
7
0.5
±2
128
pF
pA
µA
V
Bits
% of Range
ppm/°C
The input impedance for PGA = 128 is the same as that for PGA = 64 (that is, 7MΩ/64).
Calibration can minimize these errors.
The gain calibration cannot have a REF IN+ of more than AVDD −1.5V with Buffer ON. To calibrate gain, turn Buffer OFF.
∆V
OUT is change in digital result.
5
NXP MCU
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