5962-8872504LA datasheet, PDF - EEWORLD Datasheet

5962-8872504LA: DescriptionStandard SRAM, 256KX1, 70ns, CMOS, CDIP24, CERAMIC, DIP-24; Categorystorage storage; File Size50KB，1 Pages; ManufacturerMicross; Websitehttps://www.micross.com

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5962-8872504LA Overview

Standard SRAM, 256KX1, 70ns, CMOS, CDIP24, CERAMIC, DIP-24

Parameter Name	Attribute value
Parts packaging code	DIP
package instruction	DIP, DIP24,.3
Contacts	24
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	70 ns
I/O type	SEPARATE
JESD-30 code	R-GDIP-T24
JESD-609 code	e0
length	30.48 mm
memory density	262144 bit
Memory IC Type	STANDARD SRAM
memory width	1
Number of functions	1
Number of ports	1
Number of terminals	24
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	256KX1
Output characteristics	3-STATE
Exportable	NO
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	3.81 mm
Maximum standby current	0.02 A
Minimum standby current	4.5 V
Maximum slew rate	0.12 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm
Base Number Matches	1

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