IC,LOGIC GATE,QUAD 2-INPUT NAND,F-TTL,DIP,14PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDIP-T14 |
| JESD-609 code | e0 |
| Logic integrated circuit type | NAND GATE |
| MaximumI(ol) | 0.048 A |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Maximum supply current (ICC) | 33 mA |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Filter level | 38535Q/M;38534H;883B |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| 54F37DMQB | 54F37LMQB | 74F37DC | 74F37QC | 54F37FMQB | |
|---|---|---|---|---|---|
| Description | IC,LOGIC GATE,QUAD 2-INPUT NAND,F-TTL,DIP,14PIN,CERAMIC | IC,LOGIC GATE,QUAD 2-INPUT NAND,F-TTL,LLCC,20PIN,CERAMIC | IC,LOGIC GATE,QUAD 2-INPUT NAND,F-TTL,DIP,14PIN,CERAMIC | IC,LOGIC GATE,QUAD 2-INPUT NAND,F-TTL,LDCC,20PIN,PLASTIC | IC,LOGIC GATE,QUAD 2-INPUT NAND,F-TTL,FP,14PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| package instruction | DIP, DIP14,.3 | QCCN, LCC20,.35SQ | DIP, DIP14,.3 | QCCJ, LDCC20,.4SQ | DFP, FL14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XDIP-T14 | S-XQCC-N20 | R-XDIP-T14 | S-PQCC-J20 | R-XDFP-F14 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| MaximumI(ol) | 0.048 A | 0.048 A | 0.064 A | 0.064 A | 0.048 A |
| Number of terminals | 14 | 20 | 14 | 20 | 14 |
| Maximum operating temperature | 125 °C | 125 °C | 70 °C | 70 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | - | - | -55 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | DIP | QCCN | DIP | QCCJ | DFP |
| Encapsulate equivalent code | DIP14,.3 | LCC20,.35SQ | DIP14,.3 | LDCC20,.4SQ | FL14,.3 |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER | FLATPACK |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| Maximum supply current (ICC) | 33 mA | 33 mA | 33 mA | 33 mA | 33 mA |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | NO | NO | NO | NO | NO |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | NO | YES | YES |
| technology | TTL | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | J BEND | FLAT |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | DUAL | QUAD | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | - | - | 38535Q/M;38534H;883B |