| Parameter Name | Attribute value |
| Brand Name | Texas Instruments |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| Parts packaging code | BGA |
| package instruction | LFBGA, BGA257,19X19,32 |
| Contacts | 257 |
| Reach Compliance Code | _compli |
| ECCN code | 3A991.A.2 |
| Factory Lead Time | 1 week |
| Address bus width | 32 |
| Bus compatibility | PCI |
| maximum clock frequency | 33 MHz |
| Maximum data transfer rate | 132 MBps |
| External data bus width | 32 |
| JESD-30 code | S-PBGA-B257 |
| length | 16 mm |
| Number of terminals | 257 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LFBGA |
| Encapsulate equivalent code | BGA257,19X19,32 |
| Package shape | SQUARE |
| Package form | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3.3,3.3/5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.4 mm |
| Maximum supply voltage | 3.6 V |
| Minimum supply voltage | 3 V |
| Nominal supply voltage | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 16 mm |
| uPs/uCs/peripheral integrated circuit type | BUS CONTROLLER, PCMCIA |
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