8 CHANNEL MULTIPLEXER/REGISTER 3 STATE

| M74HC354 | M74HC354M1R | M74HC354C1R | M74HC354B1R | M54HC354F1R | M54HC354 | |
|---|---|---|---|---|---|---|
| Description | 8 CHANNEL MULTIPLEXER/REGISTER 3 STATE | 8 CHANNEL MULTIPLEXER/REGISTER 3 STATE | 8 CHANNEL MULTIPLEXER/REGISTER 3 STATE | 8 CHANNEL MULTIPLEXER/REGISTER 3 STATE | 8 CHANNEL MULTIPLEXER/REGISTER 3 STATE | 8 CHANNEL MULTIPLEXER/REGISTER 3 STATE |
| Is it lead-free? | - | Lead free | Lead free | Lead free | Contains lead | - |
| Is it Rohs certified? | - | conform to | conform to | conform to | incompatible | - |
| Maker | - | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | - |
| Parts packaging code | - | SOIC | QFN | DIP | DIP | - |
| package instruction | - | SOP-20 | QCCJ, LDCC20,.4SQ | DIP, DIP20,.3 | DIP, DIP20,.3 | - |
| Contacts | - | 20 | 20 | 20 | 20 | - |
| Reach Compliance Code | - | compli | compli | compli | _compli | - |
| Other features | - | TRANSPARENT ADDRESS/DATA LATCHES; 3 ENABLE INPUTS | TRANSPARENT ADDRESS/DATA LATCHES; 3 ENABLE INPUTS | TRANSPARENT ADDRESS/DATA LATCHES; 3 ENABLE INPUTS | TRANSPARENT ADDRESS/DATA LATCHES; 3 ENABLE INPUTS | - |
| series | - | HC/UH | HC/UH | HC/UH | HC/UH | - |
| JESD-30 code | - | R-PDSO-G20 | S-PQCC-J20 | R-PDIP-T20 | R-GDIP-T20 | - |
| JESD-609 code | - | e4 | e3 | e3 | e0 | - |
| Load capacitance (CL) | - | 50 pF | 50 pF | 50 pF | 50 pF | - |
| Logic integrated circuit type | - | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | - |
| MaximumI(ol) | - | 0.006 A | 0.006 A | 0.006 A | 0.006 A | - |
| Number of functions | - | 1 | 1 | 1 | 1 | - |
| Number of entries | - | 8 | 8 | 8 | 8 | - |
| Output times | - | 1 | 1 | 1 | 1 | - |
| Number of terminals | - | 20 | 20 | 20 | 20 | - |
| Maximum operating temperature | - | 125 °C | 85 °C | 125 °C | 125 °C | - |
| Minimum operating temperature | - | -55 °C | -40 °C | -55 °C | -55 °C | - |
| Output characteristics | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
| Output polarity | - | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | - |
| Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | - |
| encapsulated code | - | SOP | QCCJ | DIP | DIP | - |
| Encapsulate equivalent code | - | SOP20,.4 | LDCC20,.4SQ | DIP20,.3 | DIP20,.3 | - |
| Package shape | - | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | - |
| Package form | - | SMALL OUTLINE | CHIP CARRIER | IN-LINE | IN-LINE | - |
| Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| power supply | - | 2/6 V | 2/6 V | 2/6 V | 2/6 V | - |
| Prop。Delay @ Nom-Su | - | 63 ns | 65 ns | 63 ns | 78 ns | - |
| propagation delay (tpd) | - | 375 ns | 53 ns | 375 ns | 63 ns | - |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| Maximum seat height | - | 2.65 mm | 4.57 mm | 3.93 mm | 5.71 mm | - |
| Maximum supply voltage (Vsup) | - | 6 V | 6 V | 6 V | 6 V | - |
| Minimum supply voltage (Vsup) | - | 2 V | 2 V | 2 V | 2 V | - |
| Nominal supply voltage (Vsup) | - | 4.5 V | 5 V | 4.5 V | 5 V | - |
| surface mount | - | YES | YES | NO | NO | - |
| technology | - | CMOS | CMOS | CMOS | CMOS | - |
| Temperature level | - | MILITARY | INDUSTRIAL | MILITARY | MILITARY | - |
| Terminal surface | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | - |
| Terminal form | - | GULL WING | J BEND | THROUGH-HOLE | THROUGH-HOLE | - |
| Terminal pitch | - | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | - |
| Terminal location | - | DUAL | QUAD | DUAL | DUAL | - |
| Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| width | - | 7.5 mm | 8.9662 mm | 7.62 mm | 7.62 mm | - |