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F3S90HVX2-4062

Description
Power Field-Effect Transistor, 3A I(D), 900V, 4.7ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET
CategoryDiscrete semiconductor    The transistor   
File Size105KB,2 Pages
ManufacturerSHINDENGEN
Websitehttps://www.shindengen.com
Download Datasheet Parametric Compare View All

F3S90HVX2-4062 Overview

Power Field-Effect Transistor, 3A I(D), 900V, 4.7ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET

F3S90HVX2-4062 Parametric

Parameter NameAttribute value
MakerSHINDENGEN
package instructionSMALL OUTLINE, R-PSSO-G2
Reach Compliance Codeunknown
Other featuresAVALANCHE RATED
Shell connectionDRAIN
ConfigurationSINGLE
Minimum drain-source breakdown voltage900 V
Maximum drain current (ID)3 A
Maximum drain-source on-resistance4.7 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JESD-30 codeR-PSSO-G2
Number of components1
Number of terminals2
Operating modeENHANCEMENT MODE
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Polarity/channel typeN-CHANNEL
Maximum power consumption environment50 W
Maximum pulsed drain current (IDM)6 A
Certification statusNot Qualified
surface mountYES
Terminal formGULL WING
Terminal locationSINGLE
transistor applicationsSWITCHING
Transistor component materialsSILICON
Maximum off time (toff)230 ns
Maximum opening time (tons)70 ns
Base Number Matches1

F3S90HVX2-4062 Related Products

F3S90HVX2-4062 F3S90HVX2-4072
Description Power Field-Effect Transistor, 3A I(D), 900V, 4.7ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET Power Field-Effect Transistor, 3A I(D), 900V, 4.7ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET
Maker SHINDENGEN SHINDENGEN
package instruction SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2
Reach Compliance Code unknown unknown
Other features AVALANCHE RATED AVALANCHE RATED
Shell connection DRAIN DRAIN
Configuration SINGLE SINGLE
Minimum drain-source breakdown voltage 900 V 900 V
Maximum drain current (ID) 3 A 3 A
Maximum drain-source on-resistance 4.7 Ω 4.7 Ω
FET technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JESD-30 code R-PSSO-G2 R-PSSO-G2
Number of components 1 1
Number of terminals 2 2
Operating mode ENHANCEMENT MODE ENHANCEMENT MODE
Maximum operating temperature 150 °C 150 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE
Polarity/channel type N-CHANNEL N-CHANNEL
Maximum power consumption environment 50 W 50 W
Maximum pulsed drain current (IDM) 6 A 6 A
Certification status Not Qualified Not Qualified
surface mount YES YES
Terminal form GULL WING GULL WING
Terminal location SINGLE SINGLE
transistor applications SWITCHING SWITCHING
Transistor component materials SILICON SILICON
Maximum off time (toff) 230 ns 230 ns
Maximum opening time (tons) 70 ns 70 ns
Base Number Matches 1 1
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