M68AR024D
TABLE OF CONTENTS
SUMMARY DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Figure 2. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Table 1. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Figure 3. TFBGA Connections (Top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 4. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 2. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 3. Operating and AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 5. AC Measurement I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 6. AC Measurement Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 4. Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 5. DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 6. Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Read Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 7. Address Controlled, Read Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 8. Chip Enable or Output Enable Controlled, Read Mode AC Waveforms . . . . . . . . . . . . . . 9
Figure 9. Chip Enable or UB/LB Controlled, Standby Mode AC Waveforms . . . . . . . . . . . . . . . . . . 9
Table 7. Read and Standby Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Write Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 10. Write Enable Controlled, Write AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 11. Chip Enable E1 Controlled, Write AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 12. UB/LB Controlled, Write AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 8. Write Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 13. E1 Controlled, Low VCC Data Retention AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 14. E2 Controlled, Low VCC Data Retention AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . 14
Table 9. Low VCC Data Retention Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 15. TFBGA48 6.5x10mm - 6x8 ball array, 0.75 mm pitch, Bottom View Package Outline. . 15
Table 11. TFBGA48 8x10mm - 6x8 ball array, 0.75 mm pitch, Package Mechanical Data. . . . . . . 16
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 12. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 7
REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 13. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
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M68AR024D
SUMMARY DESCRIPTION
The M68AR024D is a 16 Mbit (16,777,216 bit) Low
Power SRAM fabricated in STMicroelectronics ad-
vanced CMOS technology, organized as 1,048,576
words by 16 bits. The device exhibits fully static op-
eration requiring no external clocks or timing
strobes.
It needs 1.65 to 1.95V supply voltage. By using the
V
CCQ
pin all the outputs can be powered indepen-
dently from the core supply voltage allowing to
drive the I/O pins down to 1.5V. V
CCQ
pin can be
tied to Vcc if the feature is not required.
This device has a standard Asynchronous SRAM
Interface. Read and Write cycles can be per-
formed on a single byte by using UB/LB signals.
The device can be put into standby mode by using
E1/E2 pins. The same pins can be used to cas-
cade more devices in order to achieve deep mem-
ory expansion.
Standby mode allows a low current consumption,
up to 99%, by reducing internal activities.
The M68AR024D is available in TFBGA48 (0.75
mm pitch) package with industrial standard foot-
print.
Figure 2. Logic Diagram
VCC
VCCQ
Table 1. Signal Names
A0-A19
DQ0-DQ15
Address Inputs
Data Input/Output
Chip Enables
Output Enable
Write Enable
Upper Byte Enable Input
Lower Byte Enable Input
Supply Voltage
I/O Supply Voltage
Ground
Not Connected Internally
Don’t Use as Internally Connected
20
A0-A19
W
E1
E2
G
UB
LB
M68AR024D
16
DQ0-DQ15
E1, E2
G
W
UB
LB
V
CC
V
CCQ
V
SS
NC
DU
VSS
AI05400c
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M68AR024D
Figure 4. Block Diagram
A19
ROW
DECODER
A8
MEMORY
ARRAY
DQ15
UB
(8)
I/O CIRCUITS
COLUMN
DECODER
DQ0
E1
E2
UB
LB
Ex
LB
(8)
A0
(8)
A7
W
UB
(8)
LB
G
AI05924
MAXIMUM RATING
Stressing the device above the rating listed in the
Absolute Maximum Ratings table may cause per-
manent damage to the device. These are stress
ratings only and operation of the device at these or
any other conditions above those indicated in the
Operating sections of this specification is not im-
Table 2. Absolute Maximum Ratings
Symbol
I
O (1)
P
D
T
A
T
STG
V
CC
V
CCQ
V
IO (2)
Output Current
Power Dissipation
Ambient Operating Temperature
Storage Temperature
Supply Voltage
I/O Supply Voltage
Input or Output Voltage
Parameter
plied. Exposure to Absolute Maximum Rating con-
ditions for periods greater than 1 sec may affect
device reliability. Refer also to the STMicroelec-
tronics SURE Program and other relevant quality
documents.
Value
20
1
–55 to 125
–65 to 150
–0.5 to 2.5
–0.5 to 2.5
–0.5 to V
CCQ
+0.5
Unit
mA
W
°C
°C
V
V
V
Note: 1. One output at time not to exceed 1 second duration.
2. Up to a maximum operating V
CC
or V
CCQ
of 1.95V only.
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Embedded System
京公网安备 11010802033920号
EEWORLD
