Incorporates two enable inputs to simplify cascading and/or
data reception
1.2μ
CMOS
- Latchup immune
High speed
Low power consumption
Single 5 volt supply
Available QML Q or V processes
Flexible package
- 16-pin DIP
- 16-lead flatpack
UT54ACS139 - SMD 5962-96546
UT54ACTS139 - SMD 5962-96547
DESCRIPTION
The UT54ACS139 and the UT54ACTS139 are designed to be
used in high-performance memory-decoding or data-routing ap-
plications requiring very short propagation delay times.
The devices consist of two individual two-line to four-line de-
coders in a single package. The active-low enable input can be
used as a data line in demultiplexing applications.
The devices are characterized over full military temperature
range of -55°C to +125°C.
FUNCTION TABLE
ENABLE
INPUTS
G
H
L
L
L
L
SELECT
INPUTS
B
X
L
L
H
H
A
X
L
H
L
H
Y0
H
L
H
H
H
OUTPUT
Y1
H
H
L
H
H
Y2
H
H
H
L
H
Y3
H
H
H
H
L
PINOUTS
16-Pin DIP
Top View
IG
1A
1B
1Y0
1Y1
1Y2
1Y3
V
SS
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
DD
2G
2A
2B
2Y0
2Y1
2Y2
2Y3
16-Lead Flatpack
Top View
1G
1A
1B
1Y0
1Y1
1Y2
1Y3
V
SS
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
DD
2G
2A
2B
2Y0
2Y1
2Y2
2Y3
LOGIC DIAGRAM
(4)
1G
(1)
(5)
(6)
SELECT
1A
1B
(2)
(3)
(7)
(12)
2G
(15)
(11)
(10)
SELECT
2A
2B
(14)
(13)
(9)
1Y0
1Y1
1Y2
DATA
1Y3
2Y0
2Y1
2Y2
2Y3
1
LOGIC SYMBOL
1A
1B
1G
(2)
(3)
(1)
X/Y
1
2
EN
0
1
2
3
(4)
(5)
(6)
(7)
(12)
(11)
(10)
(9)
1Y0
1Y1
1Y2
1Y3
2Y0
2Y1
2Y2
2Y3
1A
1B
1G
(2)
(3)
(1)
DMUX
0
1
0
G
---
3
0
1
2
3
(4)
(5)
(6)
(7)
(12)
(11)
(10)
(9)
1Y0
1Y1
1Y2
1Y3
2Y0
2Y1
2Y2
2Y3
2A
2B
2G
(14)
(13)
(15)
2A
2B
2G
(14)
(13)
(15)
Note:
1. Logic symbols in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
2
OPERATIONAL ENVIRONMENT
1
PARAMETER
Total Dose
SEU Threshold
2
SEL Threshold
Neutron Fluence
LIMIT
1.0E6
80
120
1.0E14
UNITS
rads(Si)
MeV-cm
2
/mg
MeV-cm
2
/mg
n/cm
2
Notes:
1. Logic will not latchup during radiation exposure within the limits defined in the table.
2. Device storage elements are immune to SEU affects.
ABSOLUTE MAXIMUM RATINGS
SYMBOL
V
DD
V
I/O
T
STG
T
J
T
LS
Θ
JC
I
I
P
D
PARAMETER
Supply voltage
Voltage any pin
Storage Temperature range
Maximum junction temperature
Lead temperature (soldering 5 seconds)
Thermal resistance junction to case
DC input current
Maximum power dissipation
LIMIT
-0.3 to 7.0
-.3 to V
DD
+.3
-65 to +150
+175
+300
20
±10
1
UNITS
V
V
°C
°C
°C
°C/W
mA
W
Note:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, functional operation of the device at
these or any other conditions beyond limits indicated in the operational sections is not recommended. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
SYMBOL
V
DD
V
IN
T
C
PARAMETER
Supply voltage
Input voltage any pin
Temperature range
LIMIT
4.5 to 5.5
0 to V
DD
-55 to + 125
UNITS
V
V
°C
3
DC ELECTRICAL CHARACTERISTICS
7
(V
DD
= 5.0V
±
10%; V
SS
= 0V
6
, -55°C < T
C
< +125°C); Unless otherwise noted, Tc is per the temperature range ordered.
SYMBOL
V
IL
PARAMETER
Low-level input voltage
1
ACTS
ACS
High-level input voltage
1
ACTS
ACS
Input leakage current
ACTS/ACS
Low-level output voltage
3
ACTS
ACS
High-level output voltage
3
ACTS
ACS
Output current
10
(Sink)
I
OH
Output current
10
(Source)
I
OS
P
total
I
DDQ
ΔI
DDQ
Short-circuit output current
2 ,4
ACTS/ACS
Power dissipation
2, 8, ,9
Quiescent Supply Current
Quiescent Supply Current Delta
ACTS
V
IN
= V
DD
or V
SS
I
OL
= 8.0mA
I
OL
= 100μA
I
OH
= -8.0mA
I
OH
= -100μA
V
IN
= V
DD
or V
SS
V
OL
= 0.4V
V
IN
= V
DD
or V
SS
V
OH
= V
DD
- 0.4V
V
O
= V
DD
and V
SS
C
L
= 50pF
V
DD
= 5.5V
For input under test
V
IN
= V
DD
- 2.1V
For all other inputs
V
IN
= V
DD
or V
SS
V
DD
= 5.5V
C
IN
C
OUT
Input capacitance
5
Output capacitance
5
ƒ
= 1MHz @ 0V
ƒ
= 1MHz @ 0V
15
15
pF
pF
-200
200
1.8
10
1.6
mA
mW/
MHz
μA
mA
-8
mA
.7V
DD
V
DD
- 0.25
8
.5V
DD
.7V
DD
-1
1
0.40
0.25
CONDITION
MIN
MAX
0.8
.3V
DD
UNIT
V
V
IH
V
I
IN
V
OL
μA
V
V
OH
V
I
OL
mA
4
Notes:
1. Functional tests are conducted in accordance with MIL-STD-883 with the following input test conditions: V
IH
= V
IH
(min) + 20%, - 0%; V
IL
= V
IL
(max) + 0%, -
50%, as specified herein, for TTL, CMOS, or Schmitt compatible inputs. Devices may be tested using any input voltage within the above specified range, but are
guaranteed to V
IH
(min) and V
IL
(max).
2. Supplied as a design limit but not guaranteed or tested.
3. Per MIL-PRF-38535, for current density
≤
5.0E5 amps/cm
2
, the maximum product of load capacitance (per output buffer) times frequency should not exceed 3,765
pF/MHz.
4. Not more than one output may be shorted at a time for maximum duration of one second.
5. Capacitance measured for initial qualification and when design changes may affect the value. Capacitance is measured between the designated terminal and V
SS
at
frequency of 1MHz and a signal amplitude of 50mV rms maximum.
6. Maximum allowable relative shift equals 50mV.
7. All specifications valid for radiation dose
≤
1E6 rads(Si).
8. Power does not include power contribution of any TTL output sink current.
9. Power dissipation specified per switching output.
10. This value is guaranteed based on characterization data, but not tested.
Award-winning live broadcast: Registration is open for TI desktop DLP 3D printing, 3D scanning and industrial display applications based on DLPPico technology~Click here to registerLive broadcast time...
It's been a while since I came back from Shanghai. I wanted to keep a low profile from the time I left until I came back, so I didn't say anything. Let's talk about the serious stuff. There are curren...
There is a lamp and four switches A, B, C, and D. All four switches are required to control the lamp independently (no matter which one of ABCD changes, the lamp will change). 1. Write the logic truth...
With the booming electronics industry, vision systems have become a leader in the electronics automation sector. However, the delicate nature of electronic products often affects product yields due...[Details]
Reflow soldering is a critical process in electronics assembly production, and the cleanliness of the reflow oven has a direct impact on product quality. Dust and residue accumulation within the ov...[Details]
On August 24th, media outlets reported, citing sources, that NavInfo, a listed company on the A-share market, is nearing completion in its acquisition of the intelligent driving c...[Details]
Introduction to the principles of speech recognition technology
Automatic speech recognition (ASR) technology aims to enable computers to understand human speech and extract the textual inform...[Details]
Zos Automotive Research Institute released the "2025
Smart Cockpit
Tier 1 Research Report (Domestic Edition)."
This report analyzes the operating conditions of more than a dozen ...[Details]
Learned the following information.
Customer product: industrial computer motherboard
Glue application area: CPU/BGA filling
Glue color requirements: black or t...[Details]
We often hear about the precautions for using pure electric vehicles in winter, and many owners even develop relevant strategies, such as adopting a "charge as you go" principle for their vehicles,...[Details]
Electric vehicles are composed of three main components: electric motors, electric motors, and electric vehicles. Maintenance is much simpler than for gasoline-powered vehicles. Maintenance for ele...[Details]
Common Mode Semiconductor has officially launched the GM6503 series—a 5 V, 3 A synchronous step-down DC/DC power module designed for optical communications, servers, industrial applications, and FP...[Details]
Most cameras on the market use chips manufactured by Japanese companies like Sony, Sharp, Panasonic, and LG. South Korea now has the capability to produce chips, but the quality is somewhat inferio...[Details]
The Radxa Cubie A7A is a single-board computer (SBC) powered by the Allwinner A733 octa-core Cortex-A76/A55 SoC, equipped with a 3 TOPS AI accelerator and up to 16GB of LPDDR5 memory.
Fo...[Details]
French market research firm Yole Group released its latest report on the global automotive
semiconductor market
on July 31, 2025.
The report shows that the automotive semiconductor market w...[Details]
With the rapid development of the automotive industry, automotive requirements for control, communication, and network management are becoming increasingly stringent. Hardware platforms based on 32...[Details]
Shenzhen RF Star's Bluetooth smart e-cigarette solution, by embedding a BLE module in the third-generation e-cigarette tube and coordinating it with the development of a smartphone APP, bring...[Details]
Have you ever experienced these moments? Your phone battery runs out at a critical moment, an electric car owner repeatedly calculates the mileage before a long journey, or a drone enth...[Details]
PCB Design
京公网安备 11010802033920号
EEWORLD
