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5962-8966604XX

Description
FIFO, 256X9, 50ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, THIN, CERAMIC, DIP-28
Categorystorage    storage   
File Size459KB,14 Pages
ManufacturerIDT (Integrated Device Technology)
Download Datasheet Parametric View All

5962-8966604XX Overview

FIFO, 256X9, 50ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, THIN, CERAMIC, DIP-28

5962-8966604XX Parametric

Parameter NameAttribute value
MakerIDT (Integrated Device Technology)
Parts packaging codeDIP
package instructionDIP,
Contacts28
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time50 ns
Other featuresRETRANSMIT
period time65 ns
JESD-30 codeR-GDIP-T28
JESD-609 codee0
length37.1475 mm
memory density2304 bit
memory width9
Number of functions1
Number of terminals28
word count256 words
character code256
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize256X9
ExportableNO
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTIN LEAD
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width7.62 mm
Base Number Matches1
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