Precondition for Class II MLCC measurement: Apply a preheat treatment @150±10°C for 1 hour. The measurement
should be applied after 24±2 hrs the part was stored under ambient conditions. There is not any precondition necessary
for Class I MLCC.
C Schematic:
E General information:
General Purpose MLCC
Ceramic Type:
Temperature Coeffecient:
Storage Conditions:
Operating Temperature:
Dielectric Strength:
General Test conditions:
FIT according to
DESCRIPTION
NP0 Class I
± 30 ppm max.
35°C, <45% RH
-55 °C bis +125 °C
5 sec. @250% UR; Charge & Discharge Current < 50mA
25°C, 30-70% RH; if not specified differently
separate documentation
L ± 0.15
W ± 0.15
H ± 0.1
E ± 0.2
l
p
w
3.2
1.6
0.8
0.2
4.00
2.20
1.60
1.0
REV
2014-11-06
DATE
SSt
BY
PSL
CHECKED
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
WCAP-CSGP Ceramic Capacitors
Order.- No.
SIZE
A4
885012008049
Size: 1206
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use.
Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before
the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
D2 Mechanical Properties:
Properties
Adhesive Strength of Termination
Definition
0402 & 0603
> 0603
Vibration Resistance
Resistance to Solder Heat
Solder Temperature
Dipping Time
Specific
10 ±1 sec; 5N
10 ±1 sec; 10N
all 3 directions, 2 hours each @ 10 - 55 - 10 Hz,
amplitude 0.75 mm or 10 g
260°C ±5°C
10 ±1 sec
Refer to Soldering Profile
DESCRIPTION
WCAP-CSGP Ceramic Capacitors
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
Order.- No.
SIZE
A4
1.0
REV
2014-11-06
DATE
SSt
BY
PSL
CHECKED
885012008049
Size: 1206
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use.
Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before
the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
H Soldering Specifications:
H1: Classification Reflow Profile for SMT components:
H2: Classification Reflow Profiles
Profile Feature
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (ts) from (Tsmin to Tsmax)
Ramp-up rate (TL to TP)
Liquidous temperature (TL)
Time (tL) maintained above TL
Peak package body temperature (Tp)
Time within 5°C of actual peak temperature (tp)
Ramp-down rate (TP to TL)
Time 25°C to peak temperature
refer to IPC/JEDEC J-STD-020D
Pb-Free Assembly
150°C
200°C
60-120 seconds
3°C/ second max.
217°C
60-150 seconds
See Table H3
20-30 seconds
6°C/ second max.
8 minutes max.
H3: Package Classification Reflow Temperature
Package Thickness
PB-Free Assembly
PB-Free Assembly
PB-Free Assembly
refer to IPC/JEDEC J-STD-020D
< 1.6 mm
1.6 - 2.5 mm
≥ 2.5 mm
Volume mm³
<350
260°C
260°C
250°C
Volume mm³
350 - 2000
260°C
250°C
245°C
Volume mm³
>2000
260°C
245°C
245°C
DESCRIPTION
WCAP-CSGP Ceramic Capacitors
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
Order.- No.
SIZE
A4
1.0
REV
2014-11-06
DATE
SSt
BY
PSL
CHECKED
885012008049
Size: 1206
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use.
Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before
the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
I Cautions and Warnings:
The following conditions apply to all goods within the product series of WCAP-CSGP
of Würth Elektronik eiSos GmbH & Co. KG:
1. General
•The capacitor is engineered, designed and manufactured to be used within the datasheet specified values.
•Do not use the capacitor neither short term nor long term outside the specified values, which are given in the data sheet.
•Do not apply any kind of flexural or compressive force onto soldered or unsoldered component.
•Prevent the capacitor surface from any damage or scratches with sharp edges (e.g. chassis, screwdrivers, pincers)
2. Product specific
The responsibility for the applicability of customer specific products and use in a particular customer design is always within the authority of
the customer. All technical specifications for standard products do also apply to customer specific products.
Follow all instructions mentioned in the data sheet, especially the following items:
2.1 Storage conditions
•These ceramic capacitors must be stored in stable conditions within an ambient temperature between 5°C to 40°C with a relative humi-
dity of <70%.
•The environment in which the capacitors are operated and stored has to have atmospheric characteristics and must be free of dew con-
densation and toxic gases (e.g. chlorine, ammonia, sulfur, hydrogen sulphide and hydrogen sulfate).
•All products shall be used before the end of the period of 12 months based on the product date code, if not, a 100% solderability cannot
be guaranteed.
•The capacitance tolerance as specified within the datasheet is only valid on the date of delivery.
2.2 Operating climatic conditions
•Do not exceed the lower nor the upper specified temperature under no condition.
•Be aware that the specified capacitance tolerance is only valid at the date delivery and according specified measurement criteria.
•Do not use the capacitors under high humidity, high temperature nor under high or low atmospheric pressure which may affect capacitors
reliability.
•Surface temperature including self-heating must be kept below the maximum operating temperature.
•The temperature rise of the capacitor´s temperature compared to ambient temperature shall be below 20°C.
•Avoid any water or heavy dust on capacitors surface, which may cause electrical leakage, damage, overheating or corrosion.
2.3 Operating load conditions
•Do not use the capacitor with any higher than specified voltage.
•Violation of the technical product specifications such as exceeding the specified voltage will void the warranty.
•Operating voltage across the terminals including AC and DC peaks and AC or pulse overshooting, Vp-p as well as irregular voltage becau-
se of resonance or switching must be below the rated voltage.
•Due to self-heating the reliability of the capacitor may be reduced, if high frequency AC or pulse is applied.
•Avoid any overload or conditions that are not specified in the capacitors datasheet.
•Consider carefully possible specific changes of electrical characteristics like capacitance over temperature, voltage and time as well as
the specific performance over frequency for the actual use conditions. For detailed information see datasheet.
2.4 Design of the P.C. board
•The chip capacitor shall be located to minimize any possible mechanical stress from deflection or board wrap.
•It is recommended to position the chip capacitor in parallel to slits and perforations and as far away from slits, perforations, separation
points, screw holes, frames and edges of the P.C. board to avoid mechanical stress.
•Determine the shape and size of the solder pads to have proper amount of solder on the terminations as the amount of solder at the ter-
minations has a direct effect on the reliability of the capacitor.
•Provide individual solder pads for each termination. Solder pads are specified in the datasheet.
•The PCB design (e.g. land pattern design and grounding planes) must be evaluated for each individual circuit to achieve the optimal sol-
dering results.
2.5 Mounting
•Avoid any stress from the mounting head to avoid cracks.
•Adjust the bottom dead center of the mounting head not to press on the P.C. board surface.
•The mounting head pressure has to be adjusted to 1 N up to 3 N of static force.
•Provide support from the bottom side of the P.C. board by a support pin for minimizing the impact energy from the mounting head.
•Provide sufficient close up dimension, preventive maintenance and replacement of the centering jaw to avoid a crack when it is worn out.
2.6 Adhesive
Selection of adhesive
•The adhesive should have sufficient coating and viscosity and should harden rapidly.
•The adhesive should be strong enough to hold parts on the board during the mounting and solder process and should have sufficient
strength at high temperatures.
•The adhesive should have corrosion resistance, excellent insulation characteristics and no emission of toxic gasses nor any effect on the
human body.
•Do not use too much adhesive to avoid pollution of the soldering pads.
DESCRIPTION
WCAP-CSGP Ceramic Capacitors
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
Order.- No.
SIZE
A4
1.0
REV
2014-11-06
DATE
SSt
BY
PSL
CHECKED
885012008049
Size: 1206
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use.
Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before
the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
I Cautions and Warnings (2):
The following conditions apply to all goods within the product series of WCAP-CSGP
of Würth Elektronik eiSos GmbH & Co. KG:
2.7 Soldering
•The detailed soldering instructions for reflow and wave soldering are given within Soldering Specification in the datasheet.
•The soldering profile has to be compliant with the technical soldering specification, otherwise this will void the warranty.
•Avoid any other than specified temperature and / or time conditions during soldering.
•Customer needs to ensure that the applied solder paste, the paste thickness and solder conditions are applicable to guarantee a sufficient
solder result according to the relevant criteria of IPC-A-610.
•Excessive amount of solder may lead to higher tensile force and chip cracking. Insufficient amount of solder may detach the capacitor due
to defective contacts.
•Do not use excessive nor insufficient flux.
•Provide enough washing when water-soluble flux is used.
•Consider the preheating conditions as follows to avoid thermal shock:
Soldering
Wave soldering
Reflow soldering
Reflow soldering
Manual soldering
Manual soldering
Size
0603, 0805
1206 or less
1210 or more
1206 or less
1210 or more
Temperature difference (ΔT)
ΔT ≤ 150°C
ΔT ≤ 190°C
ΔT ≤ 130°C
ΔT ≤ 190°C
ΔT ≤ 130°C
2.8 Cleaning
•Cleaning agents that are used to clean the customer application might damage or change the characteristics of the component, body,
pins or termination.
•Avoid Halogen in the flux or any contaminated flux as well as excessively high ultrasonic cleaning.
2.9 Coating, molding and potting of the P.C. board
•When coating and molding the P.C. board verify the quality influence on the capacitor.
•Verify the curing temperature and assure that there is no harmful decomposing or reaction gas emission during curing.
•Do not exceed the maximal temperature rise of 20°C.
•If the product is potted in customer applications, the potting material might shrink during and after hardening. The product is exposed to
the pressure of the potting material with the effect that the body and termination is possibly damaged and so the electrical as well as the
mechanical characteristics are endangered to be affected. After the potting material is cured, the body and termination of the product ha-
ve to be checked if any reduced electrical or mechanical functions or destructions have occurred.
2.10 Handling after chip is mounted
•Direct mechanical impact to the product shall be prevented.
•After soldering please pay attention not to bend, twist or distort the P.C. board in handling and storage.
•Avoid excessive pressure during the functional check of the P.C. board.
•Avoid bending stress while breaking the P.C. board.
2.11 Handling of loose chip capacitor
•Once dropped do not use the chip capacitor.
•After mounting avoid piling up P.C. boards to avoid hitting the chip capacitor of another board.
•It is recommended to use air for natural cooling. When dipping the chips into a solvent for cleaning, the temperature difference (∆T) must
be less than 100°C.
•For reflow soldering two times limitation is recommended.
•Wave soldering is recommended only for the following case sizes: 0603 and 0805, thickness< 1mm.
•Please ensure for manual soldering (solder iron) not to exceed the general temperature capabilities as specified above.
•The following conditions are recommended for solder repair by solder iron:
Size
Temp. (°C)
Preheating Temp. (°C) Temperature difference (ΔT) Atmosphere
1206 or less 330 ± 20°C >150°C
ΔT ≤ 190°C
Room air
1210 or more 280°C max
>150°C
ΔT ≤ 130°C
Room air
•Typical time of actual peak temperature: <5 sec (300°C), <3 sec (350°C); as short as possible
•Do not make direct contact with the ceramic dielectric.
DESCRIPTION
WCAP-CSGP Ceramic Capacitors
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
Order.- No.
SIZE
A4
1.0
REV
2014-11-06
DATE
SSt
BY
PSL
CHECKED
885012008049
Size: 1206
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use.
Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before
the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
When debugging CC2530, it is found that when the baud rate is changed to 9600, the receiving DMA will start when a single packet has only 3 bytes.Therefore, the data packet is forced to be split into ...
I want to use an fft for frequency recognition. I encountered a problem when using ise10.1. I always get an error when calling the ip core. Please help me solve it~~~ Thank you...
Microchip Technology Inc. (Microchip Technology) has released its first standalone analog front end (AFE) device for intelligent 125 kHz low-frequency wireless identification applications. The new MCP...
[align=left][color=#000][font="][size=12px] Power supply layout is one of the most important aspects of a successful power supply design. However, everyone has their own opinions and reasons for how t...
Embedded systems inevitably have to deal with chip registers, and register operations require bit operations.
I won’t talk about the basic operations such as clearing a bit and setting a bit, but let’...
From being a global leader to losing the market, Korean battery manufacturers have always wanted to regain the lost market and dignity, but facing Chinese battery manufacturers represented by CAT...[Details]
1. Equipment Overview
Shell-and-tube heat exchangers are a common heat exchange device used in chemical evaporation and heating equipment. Currently, the tubesheets of shell-and-tube heat exch...[Details]
Is pure electric vehicles a false proposition for long-distance driving? At least from my personal perspective, based on current technological and infrastructure standards, I believe so. Below, I'l...[Details]
Topics: Bring Your Own Device (BYOD) trends; the impact of using employees' own mobile devices to control access to work facilities and equipment on information security; and ways to securely imple...[Details]
On August 22, Lantu Motors officially launched its Lanhai Intelligent Hybrid technology via an online livestream. This intelligent hybrid technology, which integrates a full-range 800V high-voltage...[Details]
On August 22, the National Energy Administration released the latest data, showing that by the end of July 2025, China's total number of electric vehicle charging infrastructure will reach 16.696 m...[Details]
Since its invention in the mid-1940s, the microwave oven has evolved from a humble beginning to commercial use, entering homes in the 1960s and rapidly gaining popularity. Its basic functionality a...[Details]
As AI accelerates across industries, the demand for data center infrastructure is also growing rapidly.
Keysight Technologies, in collaboration with Heavy Reading, released the "Beyo...[Details]
Electric vehicles are becoming increasingly popular, with increasingly longer ranges. There are two ways to charge electric vehicles: slow charging and fast charging. Which is the most suitable? Sl...[Details]
Teletrac Navman has launched the Multi IQ dashcam, a cloud-based solution designed for large commercial vehicle operators. It connects up to five cameras to cover the vehicle's interior, sides, and...[Details]
On August 20, Geely announced its focus on "One Cockpit". Through a unified AI OS architecture, a unified AI Agent, and a unified user ID, it will achieve an All-in-One AI cockpit, create the first...[Details]
A pure sine wave inverter has a good output waveform with very low distortion, and its output waveform is essentially the same as the AC waveform of the mains power grid. In fact, the AC power prov...[Details]
With growing environmental awareness, the continuous improvement of three-electric technology and the increasing deployment of infrastructure such as charging stations, the electrification of new e...[Details]
Consumer demand for premium listening experiences has driven rapid evolution in the wireless headphone market in recent years. Hybrid designs, which utilize two drivers per earbud to enhance sound ...[Details]
Renesas Electronics' new ultra-low-power RA4C1 MCU features advanced security and a dedicated peripheral set, making it ideal for metering and other applications.
The new product mee...[Details]
Electronics Design Contest
京公网安备 11010802033920号
EEWORLD
