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BSZ120P03NS3E G
OptiMOS
TM
P3 Power-Transistor
Features
• single P-Channel in S3O8
• Qualified according JEDEC
1)
for target applications
• 150 °C operating temperature
•
V
GS
=25 V, specially suited for notebook applications
• Pb-free; RoHS compliant
• ESD protected
• applications: battery management, load switching
• Halogen-free according to IEC61249-2-21
Product Summary
V
DS
R
DS(on),max
I
D
-30
12
-40
V
mΩ
A
PG-TSDSON-8
Type
BSZ120P03NS3E G
Package
PG-TSDSON-8
Marking
120P3NE
Lead free
Yes
Halogen free
Yes
Packing
non-dry
Maximum ratings,
at
T
j
=25 °C, unless otherwise specified
Parameter
Continuous drain current
Symbol Conditions
I
D
T
C
=25 °C
T
C
=70 °C
T
A
=25 °C
2)
Pulsed drain current
Avalanche energy, single pulse
Gate source voltage
Power dissipation
I
D,pulse
E
AS
V
GS
P
tot
T
A
=25 °C
T
A
=25 °C
2)
Operating and storage temperature
ESD class
Soldering temperature
IEC climatic category; DIN IEC 68-1
1)
Value
-40.0
-40
-11.0
-160
73
±25
52
2.1
-55 … 150
Unit
A
T
C
=25 °C
3)
I
D
=-20 A,
R
GS
=25
Ω
mJ
V
W
T
j
,
T
stg
JESD22-A114 HBM
°C
class 2 (> 2 kV)
260
55/150/56
°C
J-STD20 and JESD22
Rev. 2.1
page 1
2009-11-16
BSZ120P03NS3E G
Parameter
Symbol Conditions
min.
Thermal characteristics
Thermal resistance,
junction - case
Thermal resistance,
junction - ambient
R
thJC
R
thJA
6 cm
2
cooling area
2)
Values
typ.
max.
Unit
-
-
-
-
2.4
60
K/W
Electrical characteristics,
at
T
j
=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
Gate threshold voltage
V
(BR)DSS
V
GS
=0 V,
I
D
=-250µA
V
GS(th)
V
DS
=V
GS
,
I
D
=-73 µA
V
DS
=-30 V,
V
GS
=0 V,
T
j
=25 °C
V
DS
=-30 V,
V
GS
=0 V,
T
j
=125 °C
Gate-source leakage current
Drain-source on-state resistance
I
GSS
R
DS(on)
V
GS
=-25 V,
V
DS
=0 V
V
GS
=-6 V,
I
D
=-20 A
-30
-3.1
-
-2.5
-
-1.9
V
Zero gate voltage drain current
I
DSS
-
-
-1
µA
-
-
-
-
-
12.0
-100
-10
20.0
µA
mΩ
V
GS
=-10 V,
I
D
=-20 A
Gate resistance
Transconductance
R
G
g
fs
|V
DS
|>2|I
D
|R
DS(on)max
,
I
D
=-20 A
-
-
22
9.0
2.2
36
12.0
-
-
Ω
S
2
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
2)
3)
See Fig. 3 for more detailed information
Rev. 2.1
page 2
2009-11-16
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