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BU-61581G3-152Q

Description
Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CDSO70, LOW PROFILE, CERAMIC PACKAGE-70
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size298KB,44 Pages
ManufacturerData Device Corporation
Download Datasheet Parametric View All

BU-61581G3-152Q Overview

Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CDSO70, LOW PROFILE, CERAMIC PACKAGE-70

BU-61581G3-152Q Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerData Device Corporation
Parts packaging codeSOIC
package instructionSOP,
Contacts70
Reach Compliance Codecompliant
Address bus width16
boundary scanNO
maximum clock frequency16 MHz
letter of agreementMIL-STD-1553A; MIL-STD-1553B
Data encoding/decoding methodsBIPH-LEVEL(MANCHESTER)
Maximum data transfer rate0.125 MBps
External data bus width16
JESD-30 codeR-CDSO-G70
JESD-609 codee0
low power modeNO
Number of serial I/Os2
Number of terminals70
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height3.81 mm
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
uPs/uCs/peripheral integrated circuit typeSERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
Base Number Matches1
BU-65170/61580 and BU-61585
MIL-STD-1553A/B NOTICE 2 RT and BC/RT/MT,
ADVANCED COMMUNICATION ENGINE (ACE)
ACE User’s Guide
Also Available
DESCRIPTION
DDC's BU-65170, BU-61580 and
BU-61585 Bus Controller / Remote
Terminal
/
Monitor
Terminal
(BC/RT/MT)
A d v a n c e d
Communication Engine (ACE) termi-
nals comprise a complete integrated
interface between a host processor
and a MIL-STD-1553 A and B or
STANAG 3838 bus.
The ACE series is packaged in a 1.9 -
square-inch, 70-pin, low-profile,
cofired MultiChip Module (MCM)
ceramic package that is well suited for
applications with stringent height
requirements.
The BU-61585 ACE integrates dual
transceiver, protocol, memory man-
agement, processor interface logic,
and a total of 12K words of RAM in a
choice of DIP or flat pack packages.
The BU-61585 requires +5 V power
and either -15 V or -12 V power.
The BU-61585 internal RAM can be
configured as 12K x 16 or 8K x 17.
The 8K x 17 RAM feature provides
capability for memory integrity check-
ing by implementing RAM parity gen-
eration and verification on all access-
es. To minimize board space and
“glue” logic, the ACE provides ultimate
flexibility in interfacing to a host
processor and internal/external RAM.
The advanced functional architecture
of the ACE terminals provides soft-
ware
compatibility
to
DDC's
Advanced Integrated Multiplexer (AIM)
series hybrids, while incorporating a
multiplicity of architectural enhance-
ments. It allows flexible operation
while off-loading the host processor,
ensuring data sample consistency,
and supports bulk data transfers.
The ACE hybrids may be operated at
either 12 or 16 MHz. Wire bond
options allow for programmable RT
address (hardwired is standard) and
external transmitter inhibit inputs.
FEATURES
Fully Integrated MIL-STD-1553
Interface Terminal
Interface
Flexible Processor/Memory
Standard 4K x 16 RAM and
Optional RAM Parity
Optional 12K x 16 or 8K x 17 RAM
Available
Generation/Checking
Automatic BC Retries
Programmable BC Gap Times
BC Frame Auto-Repeat
Flexible RT Data Buffering
Programmable Illegalization
Selective Message Monitor
Simultaneous RT/Monitor Mode
TX/RX_A
SHARED
RAM
CH. A
TRANSCEIVER
A
DATA
BUFFERS
PROCESSOR
DATA BUS
*
TX/RX_A
DATA BUS
DUAL
ENCODER/DECODER,
MULTIPROTOCOL
AND
MEMORY
MANAGEMENT
D15-D0
TX/RX_B
ADDRESS BUS
ADDRESS
BUFFERS
A15-A0
PROCESSOR
ADDRESS BUS
CH. B
TRANSCEIVER
B
TX/RX_B
PROCESSOR
AND
MEMORY
INTERFACE
LOGIC
TRANSPARENT/BUFFERED, STRBD, SELECT,
RD/WR, MEM/REG, TRIGGER_SEL/MEMENA-IN,
MSB/LSB/DTGRT
IOEN, MEMENA-OUT, READYD
ADDR_LAT/MEMOE, ZERO_WAIT/MEMWR,
8/16-BIT/DTREQ, POLARITY_SEL/DTACK
INT
PROCESSOR
AND
MEMORY
CONTROL
INTERRUPT
REQUEST
RT ADDRESS
RTAD4-RTAD0, RTADP
INCMD
MISCELLANEOUS
CLK_IN, TAG_CLK,
MSTCLR,SSFLAG/EXT_TRG
* SEE ORDERING INFORMATION FOR AVAILABLE MEMORY
FIGURE 1. ACE BLOCK DIAGRAM
©
1992, 1999 Data Device Corporation
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