ZiLOG, Inc.
2H - Year 2002
Quality
And
Reliability
Report
ZAC03-0004
ZiLOG
2002Quality and Reliability Report
Chapter Title and Subsection
TABLE OF CONTENTS
Chapter Title and Subsection
Chapter 1
- ZiLOG’s Quality Culture
1-2
1-3
1-8
1 - 10
1 - 11
Reliability And Quality Assurance Policy Statement………………………………. 1 - 1
ZiLOG Quality Policy Mission Statement………………………………………….
ZiLOG’s Quality And Reliability Program…………………………………………
ZiLOG’s Environmental, Health and Safety Policy………………………………..
Quality and Reliability Trend Charts……………………………………………….
ZiLOG’s Quality Organization Chart………………………………………………
Chapter 2
ISO Certification……………………………………………………………………. 1 - 9
- Customer Quality Support System
2-1
2–4
2–9
2 - 11
Customer Failure Analysis/Correlation Procedure …………………………………
Summary of QC Test Equipment …………………………………………………..
List of Outside FA Labs ……………………………………………………………
Customer Change Notification Letter Z80S183 Die Revision..…………………….
Chapter 3
Customer Notification System……………………………………………………… 2 – 10
- Qualification Requirements
3-1
3-2
3-3
3-4
Product/Process Qualification Requirements……………………………………….
ZiLOG Product Qualification Summary……………………………………………
Package Qualification Requirements………………………………………………..
ZiLOG Package Qualification Summary…………………………………………...
ZAC03-0004
II
ZiLOG
2002Quality and Reliability Report
Chapter Title and Subsection
- Quality Monitor Systems
4-1
4–4
4–4
4–5
4–5
4–5
4–5
4–5
4–6
4–6
4–7
4–8
4–9
4 – 12
4 – 15
4 – 16
4 – 16
4 – 17
4 – 19
4 – 20
4 – 23
4 – 24
4 – 25
4 – 28
4 – 29
4 – 37
Chapter 4
Failure Rate Prediction Calculations………………………………………………..
ESD Testing Methodology………………………………………………………….
Latchup Testing Methodology………………………………………………….…..
ZiLOG’s Reliability Summary………………………………………………….…..
Early Life……………………………………………………………………………
Long Term Life……………………………………………………………………..
Pressure Pot…………………………………………………………………………
Temperature Cycle………………………………………………………………….
Highly Accelerated Stress Test………………………………………………….….
Package Integrity Test………………………………………………………………
Reliability Monitor Testing Requirements
Table 1
…………………………………..
Reliability Monitor Early Life Test Conditions 168 Hrs, 125°C Burn-In
(CMOS Plastic)
Table 2
…………..………………………………………………….
Reliability Monitor Early Life Test Conditions 168 Hrs, 125°C Burn-In
(NMOS Plastic)
Table 3
…………………..…………………………………….……
Reliability Monitor Long-Term Life Test Conditions: 150°C, 5V, 184 Hrs Burn-In
(CMOS)
Table 4
……………………………………………………………………..
Reliability Monitor Long-Term Life Test Conditions: 125°C, 1000 Hrs Burn-In
(CMOS)
Table 5
……………………………………………………………………...
Reliability Test Summary Early Life Test Summary
Table 6. ...
………………….….
Reliability Test Summary Long-Term Life Test Summary
Table7
…..……………..
Reliability Monitor Pressure Pot Test Conditions (CMOS-Plastic)
Table 8
………...
Reliability Monitor Pressure Pot Test Conditions (NMOS-Plastic)
Table 9
………...
Reliability Monitor Temperature Cycling Test Conditions (CMOS)
Table 10
……...
Reliability Monitor Temperature Cycling Test Conditions (NMOS)
Table 11
……...
Reliability Monitor Highly Accelerated Stress Test (HAST)-(CMOS)
Table 12
…...
Reliability Monitor ZiLOG Packaging Integrity Test Results (CMOS)
Table 13
…...
Reliability Monitor ZiLOG Packaging Integrity Test Results (NMOS)
Table 14
…...
C-Mode Scanning Acoustic Microscope Monitor 2002 (CMOS)
Table 15
…………
C-Mode Scanning Acoustic Microscope Monitor 2002 (NMOS)
Table 16
…………
ZAC03-0004
III
ZiLOG
2002Quality and Reliability Report
Chapter Title and Subsection
Chapter 5
- Assembly and Test
5–1
5-1
5-2
5-3
5-4
5-5
Package Types……………………………………………………………………...
Technology Data……………………………………………………………………
Pre/Post Packaging Device Test Procedures……………………………………….
Plastics Process Flow……………………………………………………………….
Plastic-Standard Assembly/Test Process…………………………………….……..
General Material Specification……………………………………………………..
Chapter 6
The Handling and Storage of Surface Mount Devices
…………
6- 1
6-2
6-2
6-3
6-3
6-3
Handling………………………………………………………………..…………..
Lead Protection ……………...……………………………………………………..
ESD Protection ……………...……………………………………………………..
Storage/Unpacking Cautions ..……………………………………………………..
Soldering …………………….……………………………………………………..
Desoldering ………………………………………………………………………...
Chapter 7
- Quality Systems
7– 1
7–1
7–1
7–1
7–1
7–2
7–2
7–3
7–3
7–3
7–3
7–3
7-4
Quality Systems………………………………………………………….……..…..
Subcontracting ……………………………………………………………………..
Lot Traceability ……………………………………………………………………
Availability of Documentation on Monitoring …………………………………….
Quality Data ………………………………………………………………………..
Testing ……………………………………………………………………………..
Test Tape Support ………………………………………………………………….
When Manufacturing is Performed Offshore, What Are The Controls? …………..
Availability of Programming Facilities ……………………………………………
Documentation Control …………………………………………………………….
QA Audit …………………………………………………………………………...
Material Control ……………………………………………………………………
Vendor of the Year Award …………………………………………………………
ZAC03-0004
IV
ZiLOG
2002Quality and Reliability Report
Chapter Title and Subsection
- Statistical Process Control
8-1
8–1
8-1
Chapter 8
Scope …………………………………………………………………………….....
Control Charts ……………………………………………………………………...
Design of Experiments ……………………………………………………………..
Chapter 9
- Document Control
9–1
9–2
9–3
9–4
Document Control System………………………………………………………….
ZiLOG Policies, Procedures or Specifications …………………………………….
Flow Chart …………………………………………………………………………
SPC Fabrication Typical Process ………………………………………………….
Chapter 10
- Thermal Properties
10 - 1
10 - 2
10 - 3
Thermal Characteristics…………………………………………………………….
Device
θ
JA
,
θ
JC
Table 1 Summary Of Thermal Characteristics For ZiLOG Plastic
Packages…………………………………………………………………………….
Device
θ
JA
,
θ
JC
Table 2 Summary Of Thermal Resistance For Hermetic
Packages………………...…………………………………………………………..
Device
θ
JA
,
θ
JC
Table 3 Summary Of Thermal Resistance For Networking
Technology Devices…………..………………………………..………………….. 10 - 4
Device
θ
JA
,
θ
JC
Table 4 Summary Of Thermal Resistance For Connecting
Technology & Home Entertainment………………………………………………. 10 - 10
Chapter 11
- Glossary
11 – 1
ZiLOG Glossary…………………………………………………………………….
ZAC03-0004
V