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89HPES16NT2ZABCGI

Description
Bus Controller, PBGA484
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size568KB,29 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
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89HPES16NT2ZABCGI Overview

Bus Controller, PBGA484

89HPES16NT2ZABCGI Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Reach Compliance Codecompliant
JESD-30 codeS-PBGA-B484
JESD-609 codee1
Humidity sensitivity level3
Number of terminals484
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA484,22X22,40
Package shapeSQUARE
Package formGRID ARRAY
power supply1,3.3 V
Certification statusNot Qualified
surface mountYES
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Base Number Matches1
16-Lane 2-Port Non-Transparent
PCI Express® Switch
®
89HPES16NT2
Data Sheet
Advance Information*
Device Overview
The 89HPES16NT2 is a member of the IDT PRECISE™ family of
PCI Express® switching solutions offering the next-generation I/O inter-
connect standard. The PES16NT2 is a 16-lane, 2-port peripheral chip
that provides high-performance switching and non-transparent bridging
(NTB) functions between a PCIe® upstream port and an NTB down-
stream port. The PES16NT2 is a part of the IDT PCIe System Intercon-
nect Products and is intended to be used with IDT PCIe System
Interconnect Switches. Together, the chipset targets multi-host and intel-
ligent I/O applications such as communications, storage, and blade
servers where inter-domain communication is required.
Features
High Performance PCI Express Switch
Sixteen PCI Express lanes (2.5Gbps), two switch ports
Delivers 64 Gbps (8 GBps) of aggregate switching capacity
Low latency cut-through switch architecture
Support for Max Payload size up to 2048 bytes
Supports one virtual channel and eight traffic classes
PCI Express Base specification Revision 1.0a compliant
Flexible Architecture with Numerous Configuration Options
Supports automatic per port link width negotiation (x8, x4, x2,
or x1)
Static lane reversal on all ports
Automatic polarity inversion on all lanes
Supports locked transactions, allowing use with legacy soft-
ware
Ability to load device configuration from serial EEPROM
Ability to control device via SMBus
Non-Transparent Port
Crosslink support on NTB port
Four mapping windows supported
Each may be configured as a 32-bit memory or I/O window
May be paired to form a 64-bit memory window
Interprocessor communication
Thirty-two inbound and outbound doorbells
Four inbound and outbound message registers
Two shared scratchpad registers
Allows up to sixteen masters to communicate through the non-
transparent port
No limit on the number of supported outstanding transactions
through the non-transparent bridge
Completely symmetric non-transparent bridge operation
allows similar/same configuration software to be run
Supports direct connection to a transparent or non-transparent
port of another switch
Highly Integrated Solution
Requires no external components
Incorporates on-chip internal memory for packet buffering and
queueing
Integrates sixteen 2.5 Gbps embedded full duplex SerDes, 8B/
10B encoder/decoder (no separate transceivers needed)
Block Diagram
2-Port Switch Core
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Non-
Transparent
Bridge
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
...
...
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
16 PCI Express Lanes
x8 Upstream Port and One x8 Downstream Port
Figure 1 Internal Block Diagram
IDT and the IDT logo are trademarks of Integrated Device Technology, Inc.
1 of 29
©
2007 Integrated Device Technology, Inc.
*Notice: The information in this document is subject to change without notice
March 26, 2007
DSC 6925
Advance Information

89HPES16NT2ZABCGI Related Products

89HPES16NT2ZABCGI 89HPES16NT2ZABCI
Description Bus Controller, PBGA484 Bus Controller, PBGA484
Is it Rohs certified? conform to incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Reach Compliance Code compliant not_compliant
JESD-30 code S-PBGA-B484 S-PBGA-B484
JESD-609 code e1 e0
Humidity sensitivity level 3 3
Number of terminals 484 484
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA
Encapsulate equivalent code BGA484,22X22,40 BGA484,22X22,40
Package shape SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY
power supply 1,3.3 V 1,3.3 V
Certification status Not Qualified Not Qualified
surface mount YES YES
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37)
Terminal form BALL BALL
Terminal pitch 1 mm 1 mm
Terminal location BOTTOM BOTTOM

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