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EMI/EMC-Compliant, ±15 kV ESDProtected,
RS-232 Line Drivers/Receivers
ADM206E/ADM207E/ADM208E/ADM211E/ADM213E
FEATURES
Complies with 89/336/EEC EMC directive
ESD protection to IEC 1000-4-2 (801-2)
Contact discharge: ±8 kV
Air-gap discharge: ±15 kV
Human body model: ±15 kV
EFT/burst immunity (IEC 1000-4-4)
Low EMI emissions (EN 55022)
Eliminates need for TransZorb® suppressors
230 kbps data rate guaranteed
Single 5 V power supply
Shutdown mode 1 μW
Plug-in upgrade for MAX2xxE
Space saving TSSOP package available
0.1µF
10V
+
CONNECTION DIAGRAM
5V INPUT
12
14
C1+
C1–
C2+
C2–
+5V TO +10V
VOLTAGE
DOUBLER
+10V TO –10V
VOLTAGE
INVERTER
T1
T2
T3
T4
R1
R2
R3
R4
R5
V
CC 11
V+
13
0.1µF
+ 6.3V
0.1µF
+ 10V
+
0.1µF
0.1µF
10V
T1
IN
T2
IN
T3
IN
T4
IN
R1
OUT
R2
OUT
TTL/CMOS
OUTPUTS
R3
OUT
R4
OUT
R5
OUT
EN (ADM211E)
EN (ADM213E)
+
15
16
V–
17
7
2
T1
OUT
T2
OUT
T3
OUT
T4
OUT
R1
IN
R2
IN
R3
IN
R4
IN
R5
IN
SHDN (ADM211E)
SHDN (ADM213E)
RS-232
INPUTS
2
RS-232
OUTPUTS
TTL/CMOS
INPUTS
1
6
3
20
1
21
28
8
9
APPLICATIONS
Laptop computers
Notebook computers
Printers
Peripherals
Modems
5
4
26
27
22
23
19
18
25
GENERAL DESCRIPTION
The ADM2xxE is a family of robust RS-232 and V.28 interface
devices that operate from a single 5 V power supply. These pro-
ducts are suitable for operation in harsh electrical environments
and are compliant with the EU directive on electromagnetic
compatibility (EMC) (89/336/EEC). The level of emissions and
immunity are both in compliance. EM immunity includes ESD
protection in excess of ±15 kV on all I/O lines (IEC 1000-4-2),
fast transient burst protection (IEC 100044), and radiated
immunity (IEC 1000-4-3). EM emissions include radiated and
conducted emissions as required by Information Technology
Equipment EN 55022, CISPR 22.
All devices fully conform to the EIA-232-E and CCITT V.28
specifications and operate at data rates up to 230 kbps. Shut-
down and enable control pins are provided on some of the
products (see Table 1).
The shutdown function on the ADM211E disables the charge
pump and all transmitters and receivers. On the ADM213E the
Table 1. Selection Table
Model
ADM206E
ADM207E
ADM208E
ADM211E
ADM213E
1
24
GND
10
ADM211E/
ADM213E
1
INTERNAL
2
INTERNAL
400kΩ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT.
5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT.
Figure 1.
charge pump, all transmitters, and three of the five receivers are
disabled. The remaining two receivers remain active, thereby
allowing monitoring of peripheral devices. This feature allows
the device to be shut down until a peripheral device begins
communication. The active receivers can alert the processor,
which can then take the ADM213E out of the shutdown mode.
Operating from a single 5 V supply, four external 0.1 μF
capacitors are required.
The ADM207E and ADM208E are available in 24-lead PDIP, SSOP,
available in 28-lead SSOP, TSSOP, and SOIC_W packages. All
products are backward compatible with earlier ADM2xx products,
facilitating easy upgrading of older designs.
Shutdown
Yes
No
No
Yes
Yes (SHDN)
1
Enable
Yes
No
No
Yes
Yes (EN)
Packages
RW-24
N-24-1, RW-24, RS-24, RU-24
N-24-1, RW-24, RS-24, RU-24
RW-28, RS-28, RU-28
RW-28, RS-28, RU-28
Supply Voltage
5V
5V
5V
5V
5V
Drivers
4
5
4
4
4
Receivers
3
3
4
5
5
ESD Protection
±15 kV
±15 kV
±15 kV
±15 kV
±15 kV
Two receivers active.
Rev. E
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2006 Analog Devices, Inc. All rights reserved.
00068-001
ADM206E/ADM207E/ADM208E/ADM211E/ADM213E
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications....................................................................................... 1
General Description ......................................................................... 1
Connection Diagram ....................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
ESD Caution.................................................................................. 4
Pin Configurations and Function Descriptions ........................... 5
Typical Performance Characteristics ............................................. 8
Theory of Operation ...................................................................... 10
Circuit Description..................................................................... 10
Enable and Shutdown ................................................................ 10
High Baud Rate........................................................................... 11
ESD/EFT Transient Protection Scheme .................................. 11
ESD Testing (IEC 100042) ..................................................... 11
EFT/Burst Testing (IEC 100044)........................................... 12
IEC 1000-4-3 Radiated Immunity ........................................... 13
Emissions/Interference .............................................................. 14
Conducted Emissions ................................................................ 14
Radiated Emissions .................................................................... 14
Outline Dimensions ....................................................................... 16
Ordering Guide .......................................................................... 19
REVISION HISTORY
9/06—Rev.
D to Rev. E
Updated Format..................................................................Universal
Changes to Figure 1 and Table 1..................................................... 1
Changes to Table 2............................................................................ 3
Changes to Figure 2, Figure 3, and Figure 5.................................. 5
Changes to Figure 7 and Figure 9................................................... 6
Changes to Figure 11........................................................................ 7
Changes to Figure 17........................................................................ 8
Updated Outline Dimensions ....................................................... 16
Changes to Ordering Guide .......................................................... 19
4/05—Rev. C to Rev. D
Changes to Specifications Section.................................................. 2
Changes to Ordering Guide ............................................................ 4
Updated Outline Dimensions ......................................................... 6
3/01—Rev. B to Rev. C
Changes to Features Section ............................................................1
Changes to Specifications Table ......................................................2
Changes to Absolute Maximum Ratings........................................3
Changes to Figure 6 ..........................................................................5
Changes to Typical Performance Characteristics Section ...... 7, 8
Changes to Table V......................................................................... 11
Rev. E | Page 2 of 20
ADM206E/ADM207E/ADM208E/ADM211E/ADM213E
SPECIFICATIONS
V
CC
= 5.0 V ± 10%, C1 to C4 = 0.1 μF. All specifications T
MIN
to T
MAX
, unless otherwise noted.
Table 2.
Parameter
DC CHARACTERISTICS
Operating Voltage Range
V
CC
Power Supply Current
SHUTDOWN SUPPLY CURRENT
LOGIC
Input Pull-Up Current
Input Logic Threshold Low, V
INL
Input Logic Threshold High, V
INH
Input Logic Threshold High, V
INH
TTL/CMOS Output Voltage Low, V
OL
TTL/CMOS Output Voltage High, V
OH
TTL/CMOS Output Leakage Current
RS-232 RECEIVER
Input Voltage Range
1
Input Threshold Low
Input Threshold High
Input Hysteresis
Input Resistance
RS-232 TRANSMITTER
Output Voltage Swing
Output Resistance
Output Short-Circuit Current
TIMING CHARACTERISTICS
Maximum Data Rate
Receiver Propagation Delay, TPHL, TPLH
Receiver Output Enable Time, t
ER
Receiver Output Disable Time, t
DR
Transmitter Propagation Delay, TPHL, TPLH
Transition Region Slew Rate
EM IMMUNITY
ESD Protection (I/O Pins)
Min
4.5
Typ
5.0
3.5
0.2
10
2.0
2.0
0.4
3.5
+0.05
−30
0.8
±10
+30
1.3
2.0
0.65
5
±9.0
±20
±60
2.4
7
Max
5.5
13
10
25
0.8
Unit
V
mA
μA
μA
V
V
V
V
V
μA
V
V
V
V
kΩ
V
Ω
mA
kbps
μs
ns
ns
μs
V/μs
Test Conditions/Comments
No load
T
IN
= GND
T
IN
, EN, EN, SHDN, SHDN
T
IN
EN, EN, SHDN, SHDN
I
OUT
= 1.6 mA
I
OUT
= −40 μA
EN = V
CC
, EN = GND, 0 V ≤ R
OUT
≤ V
CC
3
±5.0
300
±6
230
T
A
= 0°C to 85°C
All transmitter outputs loaded with 3 kΩ to ground
V
CC
= 0 V, V
OUT
= ±2 V
0.4
120
120
1
8
2
R
L
= 3 kΩ to 7 kΩ, C
L
= 50 pF to 2500 pF
C
L
= 150 pF
R
L
= 3 kΩ, C
L
= 2500 pF
R
L
= 3 kΩ, C
L
= 50 pF to 2500 pF, measured from
+3 V to −3 V or −3 V to +3 V
Human body model
IEC 1000-4-2 air-gap discharge
IEC 1000-4-2 contact discharge
IEC 1000-4-3
Radiated Immunity
1
±15
±15
±8
10
kV
kV
kV
V/m
Guaranteed by design.
Table 3. ADM211E Truth Table
SHDN
0
0
1
1
Table 4. ADM213E Truth Table
T
OUT
1:4
Enabled
Enabled
Disabled
R
OUT
1:5
Enabled
Disabled
Disabled
SHDN
0
0
1
1
EN
0
1
0
1
Status
Shutdown
Shutdown
Normal operation
Normal operation
T
OUT
1:4
Disabled
Disabled
Enabled
Enabled
R
OUT
1:3
Disabled
Disabled
Disabled
Enabled
R
OUT
4:5
Disabled
Enabled
Disabled
Enabled
EN
0
1
X
1
Status
Normal operation
Normal operation
Shutdown
X = don’t care.
Rev. E | Page 3 of 20
ADM206E/ADM207E/ADM208E/ADM211E/ADM213E
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 5.
Parameter
V
CC
V+
V–
Input Voltages
T
IN
R
IN
Output Voltages
T
OUT
R
OUT
Short-Circuit Duration
T
OUT
Power Dissipation
N-24-1 PDIP
(Derate 13.5 mW/°C above 70°C)
RW-24 SOIC_W
(Derate 12 mW/°C above 70°C)
RS-24 SSOP
(Derate 12 mW/°C above 70°C)
RU-24 TSSOP
(Derate 12 mW/°C above 70°C)
RW-28 SOIC_W
(Derate 12 mW/°C above 70°C)
RS-28 SSOP
(Derate 10 mW/°C above 70°C)
RU-28 TSSOP
(Derate 12 mW/°C above 70°C)
Operating Temperature Range
Storage Temperature Range
Lead Temperature, Soldering (10 sec)
ESD Rating
MIL-STD-883B (I/O Pins)
IEC 1000-4-2 Air-Gap (I/O Pins)
IEC 1000-4-2 Contact (I/O Pins)
Rating
−0.3 V to +6 V
(V
CC
– 0.3 V) to +14 V
+0.3 V to −14 V
−0.3 V to (V+ + 0.3 V)
±30 V
±15 V
−0.3 V to (V
CC
+ 0.3 V)
Continuous
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
1000 mW
900 mW
850 mW
900 mW
900 mW
900 mW
900 mW
−40°C to +85°C
−65°C to +150°C
300°C
±15 kV
±15 kV
±8 kV
Rev. E | Page 4 of 20
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