53RS881ANL datasheet, PDF - EEWORLD Datasheet

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53RS881ANL: DescriptionOTP ROM, 1KX8, 20ns, MOS, PQCC28, PLASTIC, LCC-28; Categorystorage storage; File Size136KB，5 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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53RS881ANL Overview

OTP ROM, 1KX8, 20ns, MOS, PQCC28, PLASTIC, LCC-28

53RS881ANL Parametric

Parameter Name	Attribute value
Parts packaging code	QLCC
package instruction	QCCJ,
Contacts	28
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	20 ns
JESD-30 code	S-PQCC-J28
length	11.5062 mm
memory density	8192 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	28
word count	1024 words
character code	1000
Operating mode	SYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	1KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	4.57 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	MOS
Temperature level	MILITARY
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
width	11.5062 mm
Base Number Matches	1

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53RS881ANL Related Products

	53RS881ANL	53RS881ANS	53RS881NS	53RS881NL	53RS881AL	63RS881L
Description	OTP ROM, 1KX8, 20ns, MOS, PQCC28, PLASTIC, LCC-28	OTP ROM, 1KX8, 20ns, MOS, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24	OTP ROM, 1KX8, 25ns, MOS, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24	OTP ROM, 1KX8, 25ns, MOS, PQCC28, PLASTIC, LCC-28	OTP ROM, 1KX8, 20ns, MOS, CQCC28, LCC-28	OTP ROM, 1KX8, 20ns, MOS, CQCC28, LCC-28
package instruction	QCCJ,	DIP,	DIP,	QCCJ,	QCCN,	QCCN,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	20 ns	20 ns	25 ns	25 ns	20 ns	20 ns
JESD-30 code	S-PQCC-J28	R-PDIP-T24	R-PDIP-T24	S-PQCC-J28	S-CQCC-N28	S-CQCC-N28
length	11.5062 mm	31.242 mm	31.242 mm	11.5062 mm	11.43 mm	11.43 mm
memory density	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1
Number of terminals	28	24	24	28	28	28
word count	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words
character code	1000	1000	1000	1000	1000	1000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	75 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-
organize	1KX8	1KX8	1KX8	1KX8	1KX8	1KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCJ	DIP	DIP	QCCJ	QCCN	QCCN
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.57 mm	5.715 mm	5.715 mm	4.57 mm	2.54 mm	2.54 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.25 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.75 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	YES	YES	YES
technology	MOS	MOS	MOS	MOS	MOS	MOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL EXTENDED
Terminal form	J BEND	THROUGH-HOLE	THROUGH-HOLE	J BEND	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	DUAL	DUAL	QUAD	QUAD	QUAD
width	11.5062 mm	7.62 mm	7.62 mm	11.5062 mm	11.43 mm	11.43 mm
Parts packaging code	QLCC	DIP	DIP	QLCC	-	-
Contacts	28	24	24	28	-	-
Base Number Matches	1	1	1	1	1	-

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