Multiplexer, 1-Func, 8 Line Input, CMOS, CQCC20,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | QCCN, LCC20,.35SQ |
| Reach Compliance Code | unknown |
| JESD-30 code | S-XQCC-N20 |
| JESD-609 code | e0 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | MULTIPLEXER |
| MaximumI(ol) | 0.012 A |
| Number of functions | 1 |
| Number of entries | 8 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC20,.35SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| power supply | 3.3/5 V |
| Prop。Delay @ Nom-Sup | 17 ns |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Base Number Matches | 1 |
| 54AC251LMQB | 54AC251DMQB | 54ACT251DMQB | 54ACT251FMQB | |
|---|---|---|---|---|
| Description | Multiplexer, 1-Func, 8 Line Input, CMOS, CQCC20, | Multiplexer, 1-Func, 8 Line Input, CMOS, CDIP16, | Multiplexer, 1-Func, 8 Line Input, CMOS, CDIP16, | Multiplexer, 1-Func, 8 Line Input, CMOS, CDFP16, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| package instruction | QCCN, LCC20,.35SQ | DIP, DIP16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| JESD-30 code | S-XQCC-N20 | R-XDIP-T16 | R-XDIP-T16 | R-XDFP-F16 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| MaximumI(ol) | 0.012 A | 0.012 A | 0.024 A | 0.024 A |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of entries | 8 | 8 | 8 | 8 |
| Number of terminals | 20 | 16 | 16 | 16 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | QCCN | DIP | DIP | DFP |
| Encapsulate equivalent code | LCC20,.35SQ | DIP16,.3 | DIP16,.3 | FL16,.3 |
| Package shape | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | IN-LINE | IN-LINE | FLATPACK |
| power supply | 3.3/5 V | 3.3/5 V | 5 V | 5 V |
| Prop。Delay @ Nom-Sup | 17 ns | 17 ns | 15 ns | 15 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| surface mount | YES | NO | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| Terminal location | QUAD | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 |
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