5962R9663702V9A datasheet, PDF

Datasheet> All Categories > logic> logic> 5962R9663702V9A

5962R9663702V9A: Description4000/14000/40000 SERIES, HEX 1-INPUT NON-INVERT GATE, UUC15; Categorylogic logic; File Size154KB，23 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

Download Datasheet Parametric Compare View All

5962R9663702V9A Overview

4000/14000/40000 SERIES, HEX 1-INPUT NON-INVERT GATE, UUC15

5962R9663702V9A Parametric

Parameter Name	Attribute value
Parts packaging code	DIE
package instruction	DIE,
Contacts	15
Reach Compliance Code	unknown
series	4000/14000/40000
JESD-30 code	R-XUUC-N15
JESD-609 code	e0
Logic integrated circuit type	BUFFER
Number of functions	6
Number of entries	1
Number of terminals	15
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	RECTANGULAR
Package form	UNCASED CHIP
propagation delay (tpd)	189 ns
Certification status	Not Qualified
Filter level	MIL-PRF-38535 Class V
Maximum supply voltage (Vsup)	18 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	NO LEAD
Terminal location	UPPER
total dose	100k Rad(Si) V
Base Number Matches	1

Preview

Download Datasheet

View All

REVISIONS

LTR

DESCRIPTION

Changes in accordance with NOR 5962-R125-97.

DATE (YR-MO-DA)

96-11-29

APPROVED

Monica L. Poelking

Changes in accordance with NOR 5962-R375-97.

97-07-24

Monica L. Poelking

Incorporate revisions A and B. Update boilerplate to MIL-PRF-38535

requirements. Editorial changes throughout. – LTG

03-12-11

Thomas M. Hess

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Rajesh Pithadia

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

CHECKED BY

Monica L. Poelking

APPROVED BY

Monica L. Poelking

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216

http://www.dscc.dla.mil

DRAWING APPROVAL DATE

95-12-14

MICROCIRCUIT, DIGITAL, RADIATION

HARDENED CMOS, NON-INVERTING HEX

BUFFER/CONVERTER, MONOLITHIC SILICON

AMSC N/A

REVISION LEVEL

SIZE

CAGE CODE

SHEET

67268

1 OF

5962-96637

DSCC FORM 2233

APR 97

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

5962-E053-04

1.3 Absolute maximum ratings. 1/ 2/ 3/

Supply voltage range (V

) ........................................................................................

Input voltage range ...................................................................................................

DC input current, any one input .................................................................................

Device dissipation per output transistor .....................................................................

Storage temperature range (T

STG

)..............................................................................

Lead temperature (soldering, 10 seconds) ................................................................

Thermal resistance, junction-to-case (θ

Case E ....................................................................................................................

Case X ....................................................................................................................

Thermal resistance, junction-to-ambient (θ

Case E ....................................................................................................................

Case X ....................................................................................................................

Junction temperature (T

)...........................................................................................

Maximum power dissipation at T

= +125°C (P

): 4/

Case E ....................................................................................................................

Case X ....................................................................................................................

1.4 Recommended operating conditions.

Supply voltage range (V

) ........................................................................................

Case operating temperature range (T

) .....................................................................

Input voltage (V

) ......................................................................................................

Output voltage (V

OUT

) .................................................................................................

Radiation features:

Total dose .............................................................................................................

Single event phenomenon (SEP) effective

linear energy threshold, no upsets or latchup (see 4.4.4.5) ................................

Dose rate upset (20 ns pulse) ...............................................................................

Dose rate latch-up ................................................................................................

Dose rate survivability ..........................................................................................

Neutron irradiated..................................................................................................

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a

part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in

the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the

solicitation.

SPECIFICATION

DEPARTMENT OF DEFENSE

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the

maximum levels may degrade performance and affect reliability.

Unless otherwise specified, all voltages are referenced to V

The limits for the parameters specified herein shall apply over the full specified V

range and case temperature range of

-55°C to +125°C unless otherwise noted.

If device power exceeds package dissipation capability, provide heat sinking or derate linearly (the derating is

based on

) at the following rate:

Case E ....................................................................................................................... 13.7 mW/°C

Case X ....................................................................................................................... 8.8 mW/°C

This device has high-to-low level voltage conversion capability but not low-to-high level; therefore it is recommended that

≥

Guaranteed by design or process but not tested.

Device type 02 only.

SIZE

-0.5 V dc to +20 V dc

-0.5 V dc to + 20.5 V dc

±10

100 mW

-65°C to +150°C

+265°C

24°C/W

29°C/W

73°C/W

114°C/W

+175°C

0.68 W

0.44 W

3.0 V dc to +18 V dc

-55°C to +125°C

to 18 V dc 5/

0 V to V

1 x 10 Rads (Si)

> 75 MeV/(cm /mg) 6/

> 5 x 10 Rads(Si)/s 6/

> 2 x 10 Rads(Si)/s 6/

> 5 x 10 Rads(Si)/s 6/

> 1 x 10 neutrons/cm 7/

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

DSCC FORM 2234

APR 97

REVISION LEVEL

5962-96637

SHEET

STANDARDS

DEPARTMENT OF DEFENSE

MIL-STD-883 -

MIL-STD-1835 -

HANDBOOKS

DEPARTMENT OF DEFENSE

MIL-HDBK-103 -

MIL-HDBK-780 -

List of Standard Microcircuit Drawings.

Standard Microcircuit Drawings.

Test Method Standard Microcircuits.

Interface Standard Electronic Component Case Outlines.

(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization

Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with

MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for

device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified

herein.

3.1.1 Microcircuit die. For the requirements for microcircuit die, see appendix A to this document.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.

3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.3 Load circuit and switching waveforms. The load circuit and switching waveforms shall be as specified on figure 2.

3.2.4 Radiation test connections. The radiation test connections shall be as specified in table III herein.

3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the

electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full

case operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical

tests for each subgroup are defined in table I.

3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be

marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space

limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the

RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.

Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.

3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in

MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-96637

SHEET

5962R9663702V9A Related Products

	5962R9663702V9A	5962R9663702VEC	5962R9663702VXC	5962R9663701V9A
Description	4000/14000/40000 SERIES, HEX 1-INPUT NON-INVERT GATE, UUC15	4000/14000/40000 SERIES, HEX 1-INPUT NON-INVERT GATE, CDIP16	4000/14000/40000 SERIES, HEX 1-INPUT NON-INVERT GATE, CDFP16	4000/14000/40000 SERIES, HEX 1-INPUT NON-INVERT GATE, UUC15
Parts packaging code	DIE	DIP	DFP	DIE
package instruction	DIE,	DIP, DIP16,.3	DFP, FL16,.3	DIE,
Contacts	15	16	16	15
Reach Compliance Code	unknown	unknow	unknown	unknown
series	4000/14000/40000	4000/14000/40000	4000/14000/40000	4000/14000/40000
JESD-30 code	R-XUUC-N15	R-CDIP-T16	R-CDFP-F16	R-XUUC-N15
JESD-609 code	e0	e4	e4	e0
Logic integrated circuit type	BUFFER	BUFFER	BUFFER	BUFFER
Number of functions	6	6	6	6
Number of entries	1	1	1	1
Number of terminals	15	16	16	15
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C
Package body material	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED
encapsulated code	DIE	DIP	DFP	DIE
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	UNCASED CHIP	IN-LINE	FLATPACK	UNCASED CHIP
propagation delay (tpd)	189 ns	189 ns	189 ns	189 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	MIL-PRF-38535 Class V	MIL-PRF-38535 Class V	MIL-PRF-38535 Class V	MIL-PRF-38535 Class V
Maximum supply voltage (Vsup)	18 V	18 V	18 V	18 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	YES	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	TIN LEAD	GOLD	GOLD	TIN LEAD
Terminal form	NO LEAD	THROUGH-HOLE	FLAT	NO LEAD
Terminal location	UPPER	DUAL	DUAL	UPPER
total dose	100k Rad(Si) V	100k Rad(Si) V	100k Rad(Si) V	100k Rad(Si) V
Base Number Matches	1	1	1	1

Recommended Resources

TRS501-1B/2B circuit

Single audio decoding circuit diagram

Anti-bounce circuit using RS flip-flop

Modem circuit schematic diagram

M50116P/AP/BP/CP (VCR, TV and audio equipment) 60-function infrared remote control receiving circuit

845E computer motherboard circuit diagram_32

What you need to know to become an excellent electronic engineer: [p=22, null, left][color=rgb(51, 51, 51)][font=宋体, Georgia, verdana, serif][b]How to become a true [color=#f00000][size=12px]electronics engineer[/size][/color][/b][/font][/color][/p][p=22, null, left...; tiankai001 Download Centre

Wince registry advice: The problem is this: I want to install a software on wince, and hope that the software can still be used after the system is cold restarted. How can this be achieved? The software only needs to be ins...; stone_111 Embedded System

New NuTiny NUC472 Development Board: [size=4]Brand new NuTiny NUC472 development board, never used, Taobao transaction, 85, not including postage[/size] [url=http://2.taobao.com/item.htm?id=40190059387&grade=4.5]http://2.taobao.com/item....; nwcheroes Buy&Sell

Share DSP algorithm standards and their applications: 1 Introduction Since its birth, DSP [1] (Digital Signal Processor) has been rapidly developed in some specific fields due to its special structure and hardware logic for digital signal processing. For...; fish001 DSP and ARM Processors

My HP laptop cq40-323AX has a V key that doesn't work! Help!: I bought the computer half a year ago. After installing the system, the v key worked at first. I don't know what happened. I can't type a word by just pressing the v key, but I can still paste and cop...; well2003 Embedded System

Experts, please come and take a look. Can the voltage divider resistor of a differential ADC be drawn like this?: ADC supports input ±2.5V input. Under the condition of differential input, I want to realize 0~500V wide voltage input range (S1, S2, S3 switches). If the input resistance and overvoltage protection o...; littleshrimp Integrated technical exchanges

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components